-
公开(公告)号：US09963769B2
公开(公告)日：2018-05-08
申请号：US13541842
申请日：2012-07-05
Applicant: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Abstract: Provided in one embodiment is a method of selective microstructural transformation, comprising: providing a part comprising a bulk amorphous alloy; heating selectively a portion of the part to a first temperature such that at least some of the portion is transformed into a crystalline phase; and processing the transformed portion.
-
公开(公告)号：US09659723B2
公开(公告)日：2017-05-23
申请号：US13478623
申请日：2012-05-23
Applicant: Osamu Yabe , Craig M. Stanley , Kurt R. Stiehl , Christopher D. Prest
Inventor： Osamu Yabe , Craig M. Stanley , Kurt R. Stiehl , Christopher D. Prest
IPC: H01H13/14 , H01H13/705
CPC classification number: H01H13/705 , H01H2229/044 , H01H2233/002
Abstract: An accessory may be provided with a button controller having a microphone and switches. Plastic structures for the accessory may be formed by injection molding. Plastic structures may be molded around switch terminals. Switches may be formed using dome switch members and the switch terminals. A printed circuit with components may be mounted in the plastic structures. Recesses in the structures may be configured to receive the dome switch members, components on the printed circuit board, and wires in a cable. A backplate may be used to cover the printed circuit. A layer of plastic may be molded over the backplate to seal an interface created by the backplate. Cable strain relief structures may be molded into the layer of plastic. A lip on the strain relief structures may prevent particles from entering the controller.
-
公开(公告)号：US09578769B2
公开(公告)日：2017-02-21
申请号：US13610782
申请日：2012-09-11
Applicant: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
Inventor： Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
IPC: H01Q1/42 , H05K5/04 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , H05K5/02 , H05K13/00 , C25D11/02 , C25D7/00 , C25D11/12 , H05K5/03 , C25D11/34 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11 , C25D11/24
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Abstract translation: 公开了电子设备外壳的各种部件及其组装方法。 壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。 壳体的部分可以使用一个或多个联接构件联接在一起。 联接构件可以使用双射模制工艺来形成，其中第一射击形成联接构件的结构部分，并且第二射击形成联接构件的化妆品部分。
-
公开(公告)号：US09314839B2
公开(公告)日：2016-04-19
申请号：US13541848
申请日：2012-07-05
Applicant: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
CPC classification number: B22D29/002 , C22C1/002 , C22C1/02 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10
Abstract: Provided in an embodiment is a method for molding, including: providing a molten alloy in a space between a mold cavity and an etchable block shaped to form an undercut on a part formed in the space, cooling the molten alloy to form the part with the undercut, and etching the etchable block. An undercut is a beveled edge caused by an etchant attacking an etchable block laterally and optionally vertically. The formed part can be made of a bulk amorphous alloy. In some cases, the etchable block can also be used to form at least one threaded portion in the part.
Abstract translation: 在一个实施例中提供了一种模制方法，包括：在模具腔和可蚀刻块之间的空间中提供熔融合金，其形状在形成在该空间中的部分上形成底切，冷却熔融合金以形成具有 底切和蚀刻可蚀刻块。 底切是由蚀刻剂横向和任选垂直地攻击可蚀刻块而引起的斜边。 形成的部分可以由块状非晶合金制成。 在一些情况下，可蚀刻块也可用于在该部分中形成至少一个螺纹部分。
-
公开(公告)号：US20150307967A1
公开(公告)日：2015-10-29
申请号：US14387023
申请日：2012-03-23
Applicant: Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore A. Waniuk , Quoc Tran Pham
Inventor： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore A. Waniuk , Quoc Tran Pham
CPC classification number: C22C1/002 , B22F3/02 , B22F3/105 , B22F3/1216 , B22F3/14 , B22F3/20 , B22F9/002 , B22F2003/1051 , B22F2998/00 , C22C1/04 , C22C33/003 , C22C45/00 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , B22F3/15 , B22F3/087
Abstract: Described herein is a method of producing a feedstock comprising a BMG. A powder is compacted to for the feed-stock. The powder has elements of the BMG and the elements in the powder have a same weight percentage as in the BMG. Described herein is a method of producing a feedstock comprising a BMG. A powder is compacted into a sheath to for the feedstock. The powder and the sheath together have elements of the BMG and the elements in the powder have a same weight percentage as in the BMG.
Abstract translation: 本文描述了生产包含BMG的原料的方法。 将粉末压实成为原料。 该粉末具有BMG的元素，并且粉末中的元素具有与BMG中相同的重量百分比。 本文描述了生产包含BMG的原料的方法。 将粉末压实成为原料的护套。 粉末和护套一起具有BMG的元素，并且粉末中的元素具有与BMG中相同的重量百分比。
-
Patent Agency Ranking
公开(公告)号：US20150306670A1
公开(公告)日：2015-10-29
申请号：US14387039
申请日：2012-03-23
Applicant: Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore A. Waniuk , Quoc Tran Pham
Inventor： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore A. Waniuk , Quoc Tran Pham
CPC classification number: B22F9/002 , B22F9/04 , B22F9/08 , B22F2998/10 , B22F2999/00 , C22B9/22 , C22B9/221 , C22C1/002 , C22C1/02 , C22C33/003 , C22C45/00 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , B22F2202/05 , B22F2202/06 , B22F2202/07 , B22F2202/11 , B22F2202/13 , B22F2201/10 , B22F2201/20 , B22F2009/0804
Abstract: Described herein is a method of producing an alloy. The method includes pouring a stream of molten mixture of component elements of the alloy, separating the stream into discrete pieces, solidifying the discrete pieces by cooling before the discrete pieces contact any liquid or solid. Also described herein is another method of producing an alloy. This method includes pouring and solidifying a stream of molten mixture of component elements of the alloy into a rod or pulling a rod from a molten mixture of component elements of the alloy, before the rod contacts any liquid or solid, separating the rod into discrete pieces. An apparatus suitable for carrying out the methods above can include a container from which the molten stream is poured or the solid rod extends, one or more coil, conductive plates, a laser source, or an electron beam source arranged around the molten stream or the solid rod and configured to separate the molten stream or the solid rod into discrete pieces.
Abstract translation: 这里描述的是制造合金的方法。 该方法包括浇注合金组分的熔融混合物流，将流分离成分离的碎片，在离散的碎片与任何液体或固体接触之前通过冷却固化分散的碎片。 本文还描述了制造合金的另一种方法。 该方法包括在棒接触任何液体或固体之前将合金的组分元素的熔融混合物料流浇注并固化成棒或从合金的组分元素的熔融混合物中拉出棒，将棒分离成离散块 。 适用于实施上述方法的装置可以包括一个容器，熔融物料流从该容器或实心棒延伸出来，一个或多个线圈，导电板，激光源或电子束源设置在熔融流周围或 固体棒并且构造成将熔融流或实心棒分离成离散件。
-
公开(公告)号：US09044805B2
公开(公告)日：2015-06-02
申请号：US13472759
申请日：2012-05-16
Applicant: Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore Andrew Waniuk
Inventor： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore Andrew Waniuk
IPC: B22D19/00 , B22D23/00 , B22D19/16 , B22D27/00 , B22D27/02 , B22D27/15 , B22D41/01 , B32B15/01 , B32B15/04 , C22C45/00 , C22C1/02
CPC classification number: B22D23/003 , B22D19/00 , B22D19/16 , B22D23/00 , B22D25/06 , B22D27/00 , B22D27/02 , B22D27/15 , B22D37/00 , B22D41/01 , B32B15/01 , B32B15/04 , C22C1/02 , C22C45/00 , Y10T428/12493 , Y10T428/31678
Abstract: Described herein is a method of selectively depositing molten bulk metallic glass (BMG). In one embodiment, a continuous stream or discrete droplets of molten BMG is deposited to selected positions. The deposition can be repeated as needed layer by layer. One or more layers of non-BMG can be used as needed.
Abstract translation: 这里描述的是选择性地沉积熔融体金属玻璃（BMG）的方法。 在一个实施例中，将熔融BMG的连续流或离散液滴沉积到选定位置。 沉积可以根据需要逐层重复。 可以根据需要使用一个或多个非BMG层。
-
公开(公告)号：US09033024B2
公开(公告)日：2015-05-19
申请号：US13541550
申请日：2012-07-03
Applicant: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
CPC classification number: C22C1/08 , B22D19/00 , B22D19/0081 , B22D19/16 , B22D21/005 , B22D25/005 , B22D29/002 , B32B5/18 , B32B15/01 , B32B2266/045 , C22C1/002 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , Y10T428/12479
Abstract: Provided in one embodiment is a method of making use of foams as a processing aid or to improve the properties of bulk-solidifying amorphous alloy materials. Other embodiments include the bulk-solidifying amorphous alloy/foam composite materials made in accordance with the methods.
Abstract translation: 在一个实施方案中提供了使用泡沫作为加工助剂或改善非晶合金材料块状固化性能的方法。 其他实施方案包括根据该方法制备的体固固化非晶合金/泡沫复合材料。
-
79.发明申请CONSUMER ELECTRONICS PORT HAVING BULK AMORPHOUS ALLOY CORE AND A DUCTILE CLADDING 审中-公开具有大块非晶态合金芯和消隐层的消费电子端口公开(公告)号：US20150124401A1
公开(公告)日：2015-05-07
申请号：US14397587
申请日：2012-05-04
Applicant: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Richard W. Heley , Dermot J. Stratton , Joseph C. Poole
Inventor： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Richard W. Heley , Dermot J. Stratton , Joseph C. Poole
CPC classification number: H05K5/04 , B23K20/002 , B32B37/06 , B32B37/10 , C22C1/002 , C22C45/001 , C22C45/02 , C22C45/04 , C22C45/10 , C23C4/06 , C23C4/08 , C23C4/126 , C23C4/129 , C23C4/131 , C23C4/134 , C23C24/04 , G06F1/1656 , H04M1/0202 , H05K5/0247
Abstract: Disclosed herein are consumer electronics housings made from bulk-solidifying amorphous alloy materials having a ductile coating applied to all or a portion of the bulk-solidifying amorphous alloy. Also disclosed are methods of making consumer electronic housings from bulk-solidifying amorphous alloy materials such that at least a portion of the bulk-solidifying amorphous alloy housing is coated with a ductile cladding material.
Abstract translation: 本文公开了消费电子产品外壳，其通过将具有延展性涂层的非晶态合金材料的块状固化制成，该延性涂层施加到全部或部分本体固化非晶态合金。 还公开了制造消费电子外壳的方法，该方法是将非晶合金材料块状固化，使得至少一部分本体固化非晶合金外壳涂覆有延展性包层材料。
-
公开(公告)号：US20140348571A1
公开(公告)日：2014-11-27
申请号：US14352401
申请日：2011-10-21
Applicant: Christopher D. Prest , Joseph C. Poole , Matthew S. Scott , Dermot J. Stratton , Stephen P. Zadesky , Richard W. Heley
Inventor： Christopher D. Prest , Joseph C. Poole , Matthew S. Scott , Dermot J. Stratton , Stephen P. Zadesky , Richard W. Heley
CPC classification number: B23K1/0016 , B21D39/032 , B21J5/04 , B32B15/01 , C22C1/002 , C22C45/00 , C22C45/001 , C22C45/003 , C22C45/10 , Y10T403/32 , Y10T403/479
Abstract: Provided in one embodiment is a method of joining one or more articles together using pressurized fluid to deform a bulk-solidifying amorphous alloy material and form a mechanical interlock between the respective surfaces joined together.
Abstract translation: 在一个实施例中提供了一种使用加压流体将一个或多个物品连接在一起的方法，以使大体积固化的非晶合金材料变形，并在连接在一起的相应表面之间形成机械互锁。
-
-
-
-
-
-
-
-
-
Search Results
121
records
(took 0.028 seconds)
