公开(公告)号：US20160200621A1

公开(公告)日：2016-07-14

申请号：US14993236

申请日：2016-01-12

Applicant: Corning Incorporated

Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

IPC: C03B33/02 ,  B23K26/402 ,  B23K26/38

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  B23K2103/54 ,  Y02P40/57

Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

Abstract translation: 公开了用于激光切割热回火衬底的系统和方法。 在一个实施例中，分离热回火衬底的方法包括引导激光束焦线，使得激光束焦线的至少一部分在热回火衬底的主体内。 聚焦的脉冲激光束被脉冲以形成包括一个或多个子脉冲的脉冲串序列。 激光束焦线沿着激光束焦线在回火基板的主体内产生损伤轨迹。 在聚焦的脉冲激光束和回火衬底之间提供相对运动，使得脉冲激光束在回火衬底内形成一系列损伤轨迹。 损伤轨迹序列的单个损伤轨迹由横向间隔分开，并且一个或多个微裂纹连接损坏轨迹序列的相邻损伤轨迹。

公开(公告)号：US20150166397A1

公开(公告)日：2015-06-18

申请号：US14529801

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/10 ,  C03B33/08

CPC classification number: B23K26/53 ,  B23K26/0624 ,  B23K26/382 ,  C03B33/0222 ,  Y02P40/57

Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.

Abstract translation: 用于激光钻孔材料的系统包括被配置为产生波长小于或等于约850nm的脉冲激光束的脉冲激光器，所选择的波长使得材料在该波长处基本上是透明的。 该系统还包括位于激光束的光束路径中的光学组件，其配置成在光学组件的光束出射侧将激光束转换成沿光束传播方向定向的激光束焦点。

公开(公告)号：US20150166396A1

公开(公告)日：2015-06-18

申请号：US14535800

申请日：2014-11-07

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/09 ,  B32B17/06 ,  C03C15/00 ,  C03C17/00

CPC classification number: B23K26/384 ,  B23K26/04 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/38 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/064 ,  C03B33/0222 ,  C03B33/091 ,  C03C15/00 ,  C03C17/00 ,  C03C2217/70 ,  C09K13/00 ,  Y02P40/57 ,  Y10T428/24273 ,  Y10T428/24322

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。

公开(公告)号：US12116312B2

公开(公告)日：2024-10-15

申请号：US17056590

申请日：2019-05-20

Applicant: CORNING INCORPORATED

Inventor： Michael Peter Gaj ,  Garrett Andrew Piech ,  Nickolaos Savidis

IPC: C03C23/00 ,  C03C15/02 ,  G02B3/14

CPC classification number: C03C23/0025 ,  C03C15/02 ,  G02B3/14

Abstract: A liquid lens that includes: a lens body comprising a first window, a second window, and a cavity disposed between the first window and the second window; and a first liquid and a second liquid within the cavity of the lens body, the first liquid and the second liquid substantially immiscible with each other and having different refractive indices such that an interface between the first liquid and second liquid to form a lens. The sidewall of the cavity has an average surface roughness (Ra) of less than or equal to 200 nanometers (nm). The cavity is disposed within a plate. Further, each of the windows and the plate comprises a glass, glass-ceramic or ceramic composition. In addition, a linearity of a first bottom portion of the sidewall in proximity to the base of the plate can be from 0 μm±5 μm.

公开(公告)号：US20220064062A1

公开(公告)日：2022-03-03

申请号：US17412471

申请日：2021-08-26

Applicant: CORNING INCORPORATED

Inventor： Jonas Bankaitis ,  Alejandro Antonio Becker ,  Bradley Frederick Bowden ,  Yuvanash Kasinathan ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Kristopher Allen Wieland

IPC: C03C23/00 ,  G11B5/73 ,  C03C17/00

Abstract: Glass articles with protective films used for processing hard disk drive substrates and methods of forming glass articles with protective films used for processing hard disk drive substrates are provided herein. In one embodiment, a glass blank includes: a first surface, a second surface opposing the first surface, and an edge surface connecting the first surface and the second surface; wherein the first surface comprises a first coated portion and a first uncoated portion surrounding the first coated portion, wherein the first uncoated portion extends a first distance radially inward from the edge toward a center of the first surface, wherein the second surface comprises a second coated portion and a second uncoated portion surrounding the second coated portion, wherein the second uncoated portion extends a second distance radially inward from the edge toward a center of the second surface.

公开(公告)号：US20210347673A1

公开(公告)日：2021-11-11

申请号：US17383708

申请日：2021-07-23

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US11130701B2

公开(公告)日：2021-09-28

申请号：US16910266

申请日：2020-06-24

Applicant: CORNING INCORPORATED

Inventor： Ravindra Kumar Akarapu ,  Garrett Andrew Piech ,  Sergio Tsuda ,  James Andrew West

IPC: C03B33/08 ,  B23K26/53 ,  B23K26/06 ,  B23K26/00 ,  B23K26/067 ,  B23K26/073 ,  B23K26/08 ,  B23K26/38 ,  C03B33/10 ,  B23K103/00

Abstract: A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, an effective spot size wo,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range ZRx,min in an x-direction and a minimum Rayleigh range ZRy,min in a y-direction. Further, the smaller of ZRx,min and ZRy,min is greater than F D = π ⁢ ⁢ w 0 , eff 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

公开(公告)号：US11111170B2

公开(公告)日：2021-09-07

申请号：US16097999

申请日：2017-05-04

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/38 ,  B23K26/50 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53 ,  B23K103/00

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US11078112B2

公开(公告)日：2021-08-03

申请号：US15978430

申请日：2018-05-14

Applicant: CORNING INCORPORATED

Inventor： Rachel Eileen Dahlberg ,  Tian Huang ,  Yuhui Jin ,  Garrett Andrew Piech ,  Daniel Ohen Ricketts

IPC: C03C15/00 ,  C03C23/00 ,  B23K26/06 ,  B23K26/062 ,  B23K26/0622 ,  B23K26/36 ,  B23K26/53 ,  B23K26/55 ,  B23K26/402 ,  B23K26/00 ,  B23K26/073 ,  B23K26/064 ,  H01L23/48 ,  H01L23/538 ,  B23K103/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

公开(公告)号：US20210086294A1

公开(公告)日：2021-03-25

申请号：US16971501

申请日：2019-02-22

Applicant: CORNING INCORPORATED

Inventor： Hasan Fiaz ,  Jann Paul Kaminski ,  Raymond Miller Karam ,  Brian Nilsen ,  Marie Bernadette O'Regan ,  Garrett Andrew Piech ,  Charles Jueilei Wang ,  Ming Ying

IPC: B23K26/00 ,  C03C23/00 ,  C03C27/08 ,  C03B33/02 ,  B23K26/32

Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.