公开(公告)号：US20080101097A1

公开(公告)日：2008-05-01

申请号：US11928259

申请日：2007-10-30

Applicant: Koji Kawasaki ,  Tsuyoshi Yamashita

Inventor： Koji Kawasaki ,  Tsuyoshi Yamashita

IPC: H02M3/335 ,  H01F5/00

CPC classification number: H01F30/06 ,  H01F17/043 ,  H01F27/255 ,  H01F30/04 ,  H01F30/12 ,  H02M3/33569 ,  H02M7/003

Abstract: In an integrated transformer assembly, a common coil member has a first portion alternately wound, for each one electromagnetic turn, around the first core member and around the second core member. The first portion of the common primary coil member wound around the first core member is magnetically linked to the first magnetic path thereof so as to constitute a first primary coil. The first portion of the common primary coil member wound around the second core member is magnetically linked to the second magnetic path thereof so as to constitute a second primary coil. The first and second primary coils are connected in series. A secondary coil member has first and second secondary coils. The first and second secondary coils are arranged to be magnetically linked to the first and second primary coils of the common primary coil member, respectively.

Abstract translation: 在集成变压器组件中，公共线圈构件具有围绕第一芯构件并且围绕第二芯构件交替地缠绕的第一部分，用于每一个电磁转向。 卷绕在第一芯部件上的公共初级线圈部件的第一部分与其第一磁路磁性连接以构成第一初级线圈。 卷绕在第二芯体上的公共初级线圈构件的第一部分与其第二磁路磁性连接，构成第二初级线圈。 第一和第二初级线圈串联连接。 次级线圈构件具有第一和第二次级线圈。 第一和第二次级线圈被布置成分别与公共初级线圈构件的第一和第二初级线圈磁连接。

公开(公告)号：US07309981B2

公开(公告)日：2007-12-18

申请号：US11142663

申请日：2005-06-02

Applicant: Tsuyoshi Yamashita

Inventor： Tsuyoshi Yamashita

IPC: G01R31/28

CPC classification number: G01R31/2851 ,  G01R31/2887 ,  G01R31/2891 ,  G01R31/2893 ,  G01R31/31905

Abstract: A first spring 54 is provided between a support member 51 driven in the Z-axis direction and a heat block 53, and biases the support member 51 and the heat block 53 in the direction of separating them from each other. A second spring 57 is provided between a first pusher 55 for pressing a die 81 of an IC device 8 and a second pusher 56 for pressing a substrate 82 of the IC device 8, and biases the first pusher 55 and the second pusher 56 in the direction of separating them from each other.

Abstract translation: 第一弹簧54设置在沿Z轴方向驱动的支撑构件51和加热块53之间，并且使支撑构件51和加热块53沿彼此分离的方向偏压。 在用于挤压IC器件8的模具81的第一推动器55和用于按压IC器件8的基板82的第二推动器56之间设置有第二弹簧57，并且将第一推动器55和第二推动器56偏置在 将它们彼此分离的方向。

公开(公告)号：US07049841B2

公开(公告)日：2006-05-23

申请号：US10729975

申请日：2003-12-09

Applicant: Tsuyoshi Yamashita

Inventor： Tsuyoshi Yamashita

IPC: G01R31/02

CPC classification number: G01R31/2868 ,  G01R31/2867 ,  G01R31/2874

Abstract: A pusher is constituted by a pusher main body, which is capable of direct contact with an electronic component to be tested, a heat absorbing and radiating body provided on the pusher main body, a heater provided on the pusher main body to enable direct or indirect contact with the electronic component to be tested, and a thermal insulating material provided between the pusher main body and the heater. According to such a pusher, temperature control of an electronic component can be performed such that the electronic component nears a target set temperature for testing.

Abstract translation: 推动器由能够直接接触待测试的电子部件的推动器主体，设置在推动器主体上的吸热和散热体构成，设置在推动器主体上的加热器能够直接或间接地 与要测试的电子部件接触，以及设置在推动器主体和加热器之间的绝热材料。 根据这样的推动器，可以进行电子部件的温度控制，使得电子部件接近用于测试的目标设定温度。

公开(公告)号：US06972581B2

公开(公告)日：2005-12-06

申请号：US10737755

申请日：2003-12-18

Applicant: Tsuyoshi Yamashita ,  Noriyuki Igarashi

Inventor： Tsuyoshi Yamashita ,  Noriyuki Igarashi

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC classification number: G01R31/2862 ,  G01R31/2867 ,  G01R31/2868 ,  G01R31/2874

Abstract: A handler 1 is provided with an inner chamber 104 containing inside thereof heat sinks 40 of pushers 30, a temperature adjusting unit 91 for controlling the atmosphere temperature inside the inner chamber 104, a test chamber 102 containing inside thereof sockets 40 located on the test head 5 and the inner chamber 104, and a temperature adjusting unit 90 for controlling the atmosphere temperature inside the test chamber 102. With such a handler 1, the temperature control can be conducted so that the temperature of electronic components is brought close to the set temperature of the target test.

Abstract translation: 处理机1设置有内室104，内室104包括推动器30的散热器40，用于控制内室104内的气氛温度的温度调节单元91，容纳在其内部的位于测试头上的插座40的测试室 5和内室104，以及用于控制测试室102内的气氛温度的温度调节单元90。 利用这种处理机1，可以进行温度控制，使得电子部件的温度接近目标试验的设定温度。

公开(公告)号：US06926190B2

公开(公告)日：2005-08-09

申请号：US10106009

申请日：2002-03-25

Applicant: Tongbi Jiang ,  Tsuyoshi Yamashita

Inventor： Tongbi Jiang ,  Tsuyoshi Yamashita

IPC: B23K1/20 ,  B23K31/02 ,  H01L21/56 ,  H01L23/48

CPC classification number: H01L21/563 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, the method includes removing oxide from bumps, applying no-flow underfill to a substrate, and fluxlessly connecting the bumps to pads on the substrate. In an embodiment, oxide is removed from the bumps by a plasma treatment. In an embodiment, oxide is removed from the bumps by a subjecting the bumps to an oxide reduction process. The assembly of the chips and substrate is free from flux residue and/or flux cleaning solution residue.

Abstract translation: 将芯片组装到衬底上的方法包括施加无助焊剂的无流动的底部填充材料。 在一个实施例中，该方法包括从互连中去除氧化物而不使用焊剂并施加无助熔剂的无流动底部填充物。 在一个实施例中，该方法包括从凸起去除氧化物，向衬底施加无流动的底部填充物，以及将所述凸起与所述衬底上的焊盘无磁通地连接。 在一个实施例中，通过等离子体处理从凸块去除氧化物。 在一个实施例中，通过使凸块进行氧化物还原处理，从凸块去除氧化物。 芯片和基板的组装没有助焊剂残渣和/或助焊剂清洗溶液残留物。

公开(公告)号：US06891954B2

公开(公告)日：2005-05-10

申请号：US09819718

申请日：2001-03-29

Applicant: Akira Takahashi ,  Toshio Inoue ,  Tsuyoshi Yamashita ,  Hisashi Sano ,  Kenichi Terai ,  Hiroyuki Hashimoto ,  Isao Kakuhari ,  Yoshio Nakamura

Inventor： Akira Takahashi ,  Toshio Inoue ,  Tsuyoshi Yamashita ,  Hisashi Sano ,  Kenichi Terai ,  Hiroyuki Hashimoto ,  Isao Kakuhari ,  Yoshio Nakamura

IPC: B60R11/02 ,  G10K11/178 ,  H04B1/08 ,  H04R3/00 ,  A61F11/06 ,  H04B1/00 ,  H04R29/00 ,  H03G3/20

CPC classification number: H04B1/082 ,  G10K11/178

Abstract: In an active noise control apparatus in which an audio signal and a noise control signal are mixed to thereby sound a loudspeaker inside a motor vehicle, a general-purpose audio head unit cannot conventionally be freely changed for the one already mounted on the motor vehicle. As a solution, an active noise control unit is provided with a buffer amplifier and a mixer. An audio signal amplified by a power amplifier in an audio head unit is adjusted in level by the buffer amplifier such that a level of an audio signal outputted after amplification by the first amplifier becomes substantially equal to a level of the audio signal outputted from the audio head unit. Then, at the mixer, a noise control signal outputted from an active noise controller is added to an audio signal outputted from the buffer amplifier. Therefore, any audio head unit can be freely changed for the one already mounted on the vehicle as long as the audio head unit contains therein a power amplifier.

Abstract translation: 在其中混合有音频信号和噪声控制信号从而在汽车内部发出扬声器的有源噪声控制装置中，通用音频头单元对于已经安装在机动车辆上的扬声器通常不能自由地改变。 作为解决方案，主动噪声控制单元设置有缓冲放大器和混频器。 由音频头单元中的功率放大器放大的音频信号由缓冲放大器调节，使得由第一放大器放大后输出的音频信号的电平基本上等于从音频输出的音频信号的电平 头单位 然后，在混频器中，将从有源噪声控制器输出的噪声控制信号加到从缓冲放大器输出的音频信号中。 因此，只要音频头单元包含功率放大器，任何音频头单元可以自由地改变已经安装在车辆上的音频头单元。

公开(公告)号：US06459259B1

公开(公告)日：2002-10-01

申请号：US09254084

申请日：1999-02-26

Applicant: Akihiko Ito ,  Yoshihito Kobayashi ,  Yoshiyuki Masuo ,  Tsuyoshi Yamashita

Inventor： Akihiko Ito ,  Yoshihito Kobayashi ,  Yoshiyuki Masuo ,  Tsuyoshi Yamashita

IPC: B65G4300

CPC classification number: G01R31/2893 ,  G01R31/01 ,  G01R31/2851 ,  G01R31/2867

Abstract: An IC tester which is capable of reducing the time required before completion of testing on all of ICs to be tested is provided. The depth (length in the Y-axis direction) of the constant temperature chamber 4 and the exit chamber 5 is expanded by a dimension corresponding approximately to one transverse width (length of the minor edge) of the rectangular test tray 3, and two generally parallel test tray transport paths or alternatively a widened test tray transport path broad enough to transport two test trays simultaneously with the two test trays juxtaposed in a direction transverse to the widened test tray transport path are provided in the section of test tray transport path extending from the soak chamber 41 in the constant temperature chamber 4 through the testing section 42 in the constant temperature chamber 4 to the exit chamber 5 so that two test trays may be simultaneously transported along the two test tray transport paths or the widened test tray transport path.

Abstract translation: 提供了一种能够在所有要测试的IC上测试完成之前减少所需时间的IC测试器。 恒温室4和出口室5的深度（Y轴方向的长度）以相当于矩形试验盘3的一个横向宽度（小边的长度）的尺寸扩大， 平行的测试托盘传送路径或者可选地，加宽的测试托盘传送路径足够宽以与横向于加宽的测试托盘传送路径的方向并置的两个测试托盘同时传送两个测试托盘设置在从托盘传送路径延伸的部分 恒温室4中的浸泡室41通过恒温室4中的检测部分42到出口室5，从而沿着两个试纸盘传送路径或加宽的试纸盘传送路径同时传送两个试纸盘。

公开(公告)号：US4996683A

公开(公告)日：1991-02-26

申请号：US420373

申请日：1989-10-12

Applicant: Tsuyoshi Yamashita ,  Goro Kobayashi ,  Hisanori Nakamura ,  Youichi Shibata ,  Toshihiro Mori

Inventor： Tsuyoshi Yamashita ,  Goro Kobayashi ,  Hisanori Nakamura ,  Youichi Shibata ,  Toshihiro Mori

IPC: H04B10/25

CPC classification number: H04B10/2503

Abstract: An optical transmission device for interconnecting an optical full duplex transmission line and a half duplex transmission line. When a start bit of a data block of an electrical signal received from the half duplex transmission line is detected, a maintaining signal to maintain the same transmission direction is generated during which the data block can be transmitted. An optical signal is received from the optical full duplex transmission line and converted into an electrical signal. Similarly, a maintaining signal to maintain the same transmission direction is generated. In response to either one of the two maintaining signals, passage or stopping of signals by a driver for sending out an electrical signal to the half duplex transmission line and a receiver for receiving an electrical signal from the half duplex-transmission line are controlled. Possible interference of data is prevented and the transmission direction is changed over in this manner. Further, the level of an optical signal is monitored, and when the optical signal level becomes lower than a reference level, an abnormality warning data is transmitted succeeding to the data block.

Abstract translation: 一种用于互连光学全双工传输线和半双工传输线的光传输设备。 当检测到从半双工传输线接收到的电信号的数据块的起始位时，产生保持相同​​传输方向的维持信号，在该维持信号期间可以发送数据块。 从光学全双工传输线接收光信号并转换成电信号。 类似地，产生维持相同传输方向的维持信号。 响应于两个保持信号中的任一个，控制由驱动器发送电信号到半双工传输线路的信号的通过或停止以及用于从半双工传输线路接收电信号的接收机。 可以防止数据的干扰，并以这种方式改变传输方向。 此外，监视光信号的电平，并且当光信号电平变得低于参考电平时，在数据块之后发送异常警告数据。

公开(公告)号：US08839818B2

公开(公告)日：2014-09-23

申请号：US12742178

申请日：2009-05-27

Applicant: Tadateru Ide ,  Tsuyoshi Yamashita

Inventor： Tadateru Ide ,  Tsuyoshi Yamashita

IPC: F16K11/085

CPC classification number: F16K11/0853 ,  F16K11/065 ,  Y10T137/86541 ,  Y10T137/86871

Abstract: A valve device for adjusting the flow volumes of a cooling medium and a heating medium for adjusting the temperature of an electronic device includes: flow paths through which a cooling medium and heating medium are able to flow; and a merging section into which these flow path merge. The merging section has a valve shaft internally and a first channel is formed in the valve shaft. The valve shaft makes the first channel face at least two of the flow paths so as to make at least two flow paths communicate with each other.

Abstract translation: 用于调节冷却介质和用于调节电子设备的温度的加热介质的流量的阀装置包括：冷却介质和加热介质能够流过的流路; 以及合并这些流程路径合并的部分。 合流部分内部具有阀轴，在阀轴上形成第一通道。 阀轴使得第一通道面向至少两个流动路径，以便使至少两个流动路径彼此连通。

公开(公告)号：US07746670B2

公开(公告)日：2010-06-29

申请号：US11905861

申请日：2007-10-04

Applicant: Koji Kawasaki ,  Tsuyoshi Yamashita

Inventor： Koji Kawasaki ,  Tsuyoshi Yamashita

IPC: H02M3/335

CPC classification number: H02M3/33576

Abstract: A first AC/DC converter circuit is coupled via two transformers to a second AC/DC converter circuit, the first AC/DC converter circuit having a symmetrical configuration of two switching elements performing complementary opened/closed switching, to alternately connect positive and negative terminals of a DC source to a junction between transformer primary windings. Each primary winding alternates between a condition of transferring electrical power to a secondary winding and a condition of serving as a choke coil which temporarily stores electromagnetic energy when a current flows through that primary winding and a primary winding of the other transformer.

Abstract translation: 第一AC / DC转换器电路通过两个变压器耦合到第二AC / DC转换器电路，第一AC / DC转换器电路具有执行互补开/闭开关的两个开关元件的对称配置，以交替地连接正负端子 的直流电源到变压器初级绕组之间的接点。 每个初级绕组在电力传递到次级绕组的条件和作为扼流线圈的条件之间交替，当电流流过另一个变压器的初级绕组和初级绕组时，临时存储电磁能。