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公开(公告)号：US20210134526A1
公开(公告)日：2021-05-06
申请号：US17145688
申请日：2021-01-11
发明人： Ryo ONO , Tetsuhiko FUKUOKA , Shoji KUSUMOTO , Akihiko KONO
摘要： A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 μm or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.
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63.发明授权公开(公告)号：US10714714B2
公开(公告)日：2020-07-14
申请号：US15844892
申请日：2017-12-18
申请人： Robert Bosch GmbH
发明人： Andreas Russ , Roland Gauch
IPC分类号： H01M2/06 , H01G11/76 , H01M2/22 , H01M2/26 , H01G11/72 , H01G11/82 , H01M2/20 , H01G2/20 , H01M2/02
摘要： An electrical energy store having a spatially-optimized electrode interconnection. The electrical energy store (1) comprises flat electrodes (3), flags (7) projecting laterally from the electrodes (3), and external terminals (9). A plurality of electrode regions are respectively stacked, one on top of another, to form an electrode stack (14). A plurality of flags (7) are arranged one on top of another in a flag stack (15), and are respectively materially bonded, both mutually and with an associated external terminal (9). The energy store is characterized in that each flag (7) of a plurality of flags (7) in a flag stack (15), which is bonded to the associated external terminal (9), is materially bonded to a respectively adjoining flag (7) in a region in which the flag (7) is oriented in an inclined direction at an angle (α) to the surface (11) of the associated external terminal (9).
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公开(公告)号：US09916928B2
公开(公告)日：2018-03-13
申请号：US15244660
申请日：2016-08-23
发明人： Young Joo Oh , Jung Rag Yoon , Jae Sung Han , Dong Soon Shin
CPC分类号： H01G2/14 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/30
摘要： Provided is a high voltage multilayer ceramic capacitor and a manufacturing method thereof. The high voltage multilayer ceramic capacitor includes a multilayer ceramic sintering body; a plurality of first inner electrode layer; a plurality of second inner electrode layers; a plurality of first arc shield pattern layers respectively formed inside the multilayer ceramic sintering body to be arranged on a plane the same as those of the plurality of first inner electrode layers and spaced apart from the first inner electrode layers to surround the first inner electrode layers; and a plurality of second arc shield pattern layers respectively formed inside the multilayer ceramic sintering body to be arranged on a plane the same as those of the plurality of second inner electrode layers and spaced apart from the second inner electrode layers to surround the second inner electrode layers.
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公开(公告)号：US09697953B2
公开(公告)日：2017-07-04
申请号：US14667575
申请日：2015-03-24
发明人： Heung Kil Park , Seok Kyoon Woo , Kyoung Jin Jun , So Yeon Song , Soon Ju Lee
IPC分类号： H01G2/20 , H01G4/06 , H01G4/228 , H01G4/30 , H01G4/232 , H01G4/12 , H01G4/224 , H01G4/012 , H05K1/18 , H05K3/34 , H05K1/11
CPC分类号： H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/224 , H01G4/232 , H05K1/111 , H05K1/181 , H05K3/3426 , H05K2201/0311 , H05K2201/10015 , H05K2201/10757 , H05K2201/10946 , H05K2201/2045 , Y02P70/611 , Y02P70/613
摘要： There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having “⊂” and “⊃” shapes, and disposed on the mounting surface of the MLCC in a facing manner.
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公开(公告)号：US08730646B2
公开(公告)日：2014-05-20
申请号：US12466435
申请日：2009-05-15
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。
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公开(公告)号：US08687345B2
公开(公告)日：2014-04-01
申请号：US13150537
申请日：2011-06-01
CPC分类号： H01G4/2325 , H01C1/142 , H01C7/18 , H01G4/30
摘要： A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.
摘要翻译： 具有高可靠性的芯片型电子部件，即使安装有芯片型电子部件的基板发生偏转，也能够抑制和防止由于开裂导致的陶瓷体的致命损坏。 芯片型电子部件包括具有内部电极的陶瓷体; 形成在至少包含陶瓷体的端面的区域中的树脂电极层，并且与内部电极直接或间接连接并与陶瓷体连接; 以及覆盖树脂电极层的金属层，其中陶瓷体和树脂电极层之间的粘合强度高于树脂电极层和电镀金属层之间的粘附强度。
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公开(公告)号：US08315035B2
公开(公告)日：2012-11-20
申请号：US12629646
申请日：2009-12-02
申请人： Masaaki Togashi , Sunao Masuda , Hiroshi Abe
发明人： Masaaki Togashi , Sunao Masuda , Hiroshi Abe
CPC分类号： H01G4/232 , H01G2/06 , H01G4/30 , H05K3/3426 , H05K2201/10636 , H05K2201/10856 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/41
摘要： A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.
摘要翻译： 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。
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公开(公告)号：US07751174B2
公开(公告)日：2010-07-06
申请号：US10538136
申请日：2003-12-09
CPC分类号： H01G4/2325 , H01B1/22 , H01G4/005
摘要： The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).
摘要翻译： 本发明旨在解决传统的热固性导电浆料相对于内部电极和外部电极之间的结合性质的问题，以便提供一种适于其安装在一个或多个陶瓷电极上的多层陶瓷电子部件 基板和电镀处理。 多层陶瓷电子部件技术领域本发明涉及一种多层陶瓷电子部件，其特征在于，具有由包含高熔点导电性粒子，熔点为300℃以下的金属粉末的热固性导电膏形成的外部电极 和一种或多种树脂。
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公开(公告)号：US07558047B2
公开(公告)日：2009-07-07
申请号：US10568441
申请日：2005-02-14
申请人： Yuji Ukuma
发明人： Yuji Ukuma
CPC分类号： H01G4/2325 , Y10T428/1291
摘要： An electronic component is provided which includes external electrodes having a multilayer structure of first and second sintered electrode layers that are densely sintered and have less possibility of causing poor appearance and decreased reliability in electrical connection. Each external electrode includes a first sintered electrode layer and a second sintered electrode layer. The first sintered electrode layer contains a first borosilicate glass containing an alkali metal in which there is 85% to 95% by weight of silicon and 0.5% to 1.5% by weight of the alkali metal based on 100% by weight of all contained elements other than boron. The second sintered electrode layer contains a second borosilicate glass containing an alkali metal in which there is 65% to 80% by weight of silicon and 3.5% to 8.0% by weight of the alkali metal based on 100% by weight of all contained elements other than boron.
摘要翻译： 提供一种电子部件，其包括外部电极，该外部电极具有致密烧结的第一和第二烧结电极层的多层结构，并且具有较差的外观可能性和电连接的可靠性降低的可能性。 每个外部电极包括第一烧结电极层和第二烧结电极层。 第一烧结电极层包含含有碱金属的第一硼硅酸盐玻璃，其中基于100重量％的全部含量的元素，其中含有85重量％至95重量％的硅和0.5重量％至1.5重量％的碱金属 比硼。 第二烧结电极层包含含有碱金属的第二硼硅酸盐玻璃，其中基于100重量％的所有其它元素，其中含有65重量％至80重量％的硅和3.5重量％至8.0重量％的碱金属，其他 比硼。
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