MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20230170142A1

    公开(公告)日:2023-06-01

    申请号:US18070187

    申请日:2022-11-28

    发明人: Ryo ONO Jun NISHIKAWA

    IPC分类号: H01G4/012 H01G4/30 H01G4/12

    CPC分类号: H01G4/012 H01G4/30 H01G4/1209

    摘要: A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including an electrode laminating unit including internal electrodes laminated in a first axis direction, covers covering the electrode laminating unit in the first axis direction, and covered surfaces perpendicular to a second axis, end portions of the internal electrodes being aligned on the covered surfaces within a range of 0.5 μm in the second axis direction; and side margins covering the covered surfaces and having a porosity of 3% or more in end regions. The ceramic body has a dimension in the first axis direction, which is 1.5 times or more a dimension in the second axis direction, and a proportion of an area of the electrode laminating unit to an entire cross-section perpendicular to a third axis and located at the center portion of the ceramic body in a third axis direction is 80% or more.

    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME

    公开(公告)号:US20220028619A1

    公开(公告)日:2022-01-27

    申请号:US17498558

    申请日:2021-10-11

    摘要: A multi-layer ceramic electronic component includes a ceramic body and an external electrode, the ceramic body including a protective portion and a functional portion, the protective portion including an end surface facing in a first direction, circumferential surfaces connected to the end surface and extending in the first direction, and a ridge that includes a recess extending along the first direction and connects the circumferential surfaces, the functional portion being disposed inside the protective portion, the external electrode including a base film covering the end surface, an intermediate film formed on the base film, and a surface film formed on the intermediate film, the base film including a first covering portion formed on the end surface, second covering portions formed on the circumferential surfaces, and a third covering portion formed on the recess and spaced apart from at least one second covering portion, the intermediate film continuously covering the first, second, and third covering portions.

    MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACUTING SAME

    公开(公告)号:US20210020379A1

    公开(公告)日:2021-01-21

    申请号:US16928425

    申请日:2020-07-14

    IPC分类号: H01G4/30 H01G4/248 H01G4/12

    摘要: A multilayer ceramic electronic device includes a ceramic functional part having a generally rectangular shape in which a plurality of ceramic dielectric layers and a plurality of internal electrodes are laminated alternately in a vertical direction; a pair of cover parts that cover the functional part from top and bottom, respectively; and a pair of side margin parts covering side surfaces of the functional part, respectively, wherein an end portion of an uppermost internal electrode among the plurality of internal electrodes is curved downward to satisfy a≥1 μm and 0.1≤a/b≤0.4, where a is a dimension of the curved end portion in the vertical direction in a cross section taken along a plane perpendicular to the side surfaces, and b is a dimension of the curved end portion in a horizontal direction in said cross section.

    MULTI-LAYER CERAMIC CAPACITOR
    4.
    发明申请

    公开(公告)号:US20210134526A1

    公开(公告)日:2021-05-06

    申请号:US17145688

    申请日:2021-01-11

    摘要: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 μm or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME

    公开(公告)号:US20210110976A1

    公开(公告)日:2021-04-15

    申请号:US17125132

    申请日:2020-12-17

    IPC分类号: H01G4/224 H01G4/30 H01G4/012

    摘要: A multi-layer ceramic electronic component includes a ceramic body including a multi-layer unit, a side margin, and ridges. The multi-layer unit includes a capacitance forming unit including ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers, a cover that covers the capacitance forming unit in the first direction, and a side surface facing in a second direction orthogonal to the first direction. The side margin covers the side surface. The ridges are rounded and extend in a third direction orthogonal to the first and second directions. The capacitance forming unit includes a first region disposed at a center portion in the first direction, and a second region disposed between the cover and the first region, end portions of the internal electrodes in the second direction in the second region being positioned inward in the second direction relative to those in the first region.

    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME

    公开(公告)号:US20230223199A1

    公开(公告)日:2023-07-13

    申请号:US18184583

    申请日:2023-03-15

    摘要: A multi-layer ceramic electronic component includes (I) a ceramic body including (i) a protective portion that includes an end surface facing in a first direction, circumferential surfaces, and a ridge including a recess extending along the first direction and connects the circumferential surfaces, and (ii) a functional portion including internal electrodes laminated in a second direction, and (II) an external electrode including (i) a base film covering the end surface and including a first, second, and third covering portions formed on the end surface, on the circumferential surfaces, and on the recess, respectively, (ii) an intermediate film formed on the base film and continuously covering the first, second, and third covering portions, and (iii) a surface film formed on the intermediate film, wherein the recess is disposed outside end portions of the internal electrodes in a third direction orthogonal to the first and second directions.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, CIRCUIT BOARD, AND PACKAGE

    公开(公告)号:US20230187132A1

    公开(公告)日:2023-06-15

    申请号:US17988922

    申请日:2022-11-17

    摘要: A circuit board includes a multilayer ceramic electronic component; and a mounting board mounting the multilayer ceramic electronic component thereon, wherein the multilayer ceramic electronic component comprises: a ceramic main body having a dimension in the first axis direction of the ceramic main body of 0.1 mm or more, and a ratio of a dimension in the second axis direction of the ceramic main body to the dimension in the first axis direction of 130 or more, a plurality of internal electrodes laminated inside the ceramic main body in the first axis direction, and both edges of the plurality of internal electrodes in the second axis direction being aligned with each other within 0.5 μm in the second axis direction, and external electrodes respectively covering the end surfaces, and wherein the mounting board faces the second principal surface of the multilayer ceramic electronic component mounted thereon.

    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
    8.
    发明申请

    公开(公告)号:US20200098519A1

    公开(公告)日:2020-03-26

    申请号:US16584209

    申请日:2019-09-26

    IPC分类号: H01G4/12

    摘要: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface that faces in the first direction, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed from the side surface. The side margin includes a side-surface-covering portion that is disposed on the side surface, and an end portion that includes an extended portion extending from the side surface to the main surface and having a first dimension of 0.1 μm or more in the first direction and a second dimension of 0.1 μm or more in the second direction.