公开(公告)号：US07751174B2

公开(公告)日：2010-07-06

申请号：US10538136

申请日：2003-12-09

申请人： Takeshi Kimura ,  Yamato Takada ,  Michinori Komagata ,  Masahiro Kitamura ,  Kiminori Yokoyama

发明人： Takeshi Kimura ,  Yamato Takada ,  Michinori Komagata ,  Masahiro Kitamura ,  Kiminori Yokoyama

IPC分类号： H01G4/228 ,  H01G2/20 ,  H01B1/00 ,  H01B1/12

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01G4/005

摘要： The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).

摘要翻译： 本发明旨在解决传统的热固性导电浆料相对于内部电极和外部电极之间的结合性质的问题，以便提供一种适于其安装在一个或多个陶瓷电极上的多层陶瓷电子部件 基板和电镀处理。 多层陶瓷电子部件技术领域本发明涉及一种多层陶瓷电子部件，其特征在于，具有由包含高熔点导电性粒子，熔点为300℃以下的金属粉末的热固性导电膏形成的外部电极 和一种或多种树脂。

公开(公告)号：US08168889B2

公开(公告)日：2012-05-01

申请号：US12086622

申请日：2006-12-21

申请人： Senichi Ikarashi ,  Kiminori Yokoyama

发明人： Senichi Ikarashi ,  Kiminori Yokoyama

IPC分类号： H05K1/09 ,  H01G4/228

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30

摘要： Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ. A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700° C. or higher; (B) metal powder having a melting point of higher than 300 to lower than 700° C.; and (C) a thermosetting resin.

摘要翻译： 公开了一种热固性导电浆料，其优点在于，使用该糊料形成的多层陶瓷电子部件的外部电极与内部电极具有优异的接合性，并且适合于安装在基板或电镀上，实现优异的电性能（静电电容， tanδ。一种热固性导电膏，其包含：（A）熔点为700℃以上的金属粉末;（B）熔点高于300℃且低于700℃的金属粉末;和（C ）热固性树脂。

公开(公告)号：US5714238A

公开(公告)日：1998-02-03

申请号：US757255

申请日：1996-11-27

申请人： Michinori Komagata ,  Kiminori Yokoyama ,  Yoshinobu Tanaka ,  Kenichi Suzuki

发明人： Michinori Komagata ,  Kiminori Yokoyama ,  Yoshinobu Tanaka ,  Kenichi Suzuki

IPC分类号： C08G65/327 ,  C09D171/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J171/10 ,  H01L21/60 ,  H01L23/482 ,  H05K1/18 ,  H05K3/32 ,  B32B33/00 ,  H01B1/06

CPC分类号： H01L24/29 ,  C08G65/327 ,  C09D171/02 ,  C09J163/00 ,  C09J9/02 ,  H01L23/4828 ,  H01L24/83 ,  H05K3/321 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24909 ,  Y10T428/256 ,  Y10T428/31515 ,  Y10T428/31522

摘要： There is disclosed a conductive adhesive comprising (A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof; (B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and (C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.

摘要翻译： 公开了一种导电粘合剂，其包含（A）具有镍和镍 - 硼合金中的至少一种的表面的导电颗粒，并且其表面已经用聚氧化烯磷酸酯化合物和聚氧化烯烷基的混合物进行表面处理，或 聚氧亚烷基烯基胺或其衍生物; （B）环氧化合物，其含有基于环氧化合物的总量为20〜70重量％的用作反应性稀释剂的二缩水甘油基环氧化合物; 和（C）酚醛树脂硬化剂，其以酚醛树脂固化剂的总量计含有50重量％以上的量的烷基酚醛树脂酚醛树脂和酚醛清漆酚醛树脂中的至少一种。

公开(公告)号：US20090139754A1

公开(公告)日：2009-06-04

申请号：US12086622

申请日：2006-12-21

申请人： Senichi Ikarashi ,  Kiminori Yokoyama

发明人： Senichi Ikarashi ,  Kiminori Yokoyama

IPC分类号： H01B1/02 ,  H05K1/09

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30

摘要： Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ. A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700° C. or higher; (B) metal powder having a melting point of higher than 300 to lower than 700° C.; and (C) a thermosetting resin.

摘要翻译： 公开了一种热固性导电浆料，其优点在于，使用该糊料形成的多层陶瓷电子部件的外部电极与内部电极具有优异的接合性，并且适合于安装在基板或电镀上，实现优异的电性能（静电电容， tanδ。一种热固性导电糊剂，其包含：（A）熔点为700℃以上的金属粉末;（B）熔点高于300℃且低于700℃的金属粉末;和（C ）热固性树脂。