Abstract:
Modified polyester imides, hardenable by energy-rich radiation and containing an acrylic or methacrylic ester group having a hydroxyl group, said ester group being linked to the polyester imide molecule by way of an oxygen atom that is located on the carbon atom adjacent to the carbon atom carrying said hydroxyl group, as well as a process for their production and their use for the insulation of electric wires.
Abstract:
A heat-curable and solvent-soluble ester group containing polymer composition is prepared by the steps of:(1) either (i) reacting a highly polymerized linear aromatic polyester with a diaryl carbonate to depolymerize it to a solvent-soluble low-molecular-weight polyester (component A) containing terminal aryl carboxylate groups, or (ii) effecting the above depolymerization in the presence of a compound containing at least two specified functional groups thereby to form a modified solvent-soluble low-molecular-weight polyester (component A') containing terminal aryl carboxylate groups; and(2) either (i) mixing the resulting component A or A' with a monomeric or solvent-soluble polymeric, polyfunctional compound (component B) containing at least two hydroxyl and/or primary or secondary amino groups or (ii) partially reacting the resulting component A or A' with the component B. The composition has superior workability in molding and curing, and gives cured molded products of high utilitarian value. It is especially suitable for use in wire enamelling varnishes.
Abstract:
This invention relates to a photosensitive composition comprising a precursor of a heat resistant polymer having carboxylic groups and a compound having a photosensitive olefinic double bond and an amino or quaternary ammonium salt. The photosensitive composition can give highly heat resistant relief patterns with good edge sharpness, good mechanical and chemical properties as well as good insulating properties. The heat resistant relief patterns obtained from the composition of this invention are especially useful as insulating, passivation or protective coatings in semiconductor devices.
Abstract:
The invention relates to organic polymers which can be crosslinked under the action of light and which are suitable for carrying out photomechanical processes. These polymers are photochemically considerably more sensitive than known comparable polymers and their sensitivity can additionally also be further increased by means of a combination with sensitizers. The molecular weight is at least 1,000. The polymers contain, as light-sensitive groups, groups of the formula I ##STR1## wherein R and R.sub.1 independently of one another denote alkyl groups with at most 4 C atoms, or R and R.sub.1 conjointly denote the remaining part of a 5-membered to 6-membered carbocyclic ring.
Abstract:
A shaped article having a refractive index of not less than 1.625 at least in one direction and possessing excellent physical properties and various uses, which can be prepared by stretching a molded product, which is made of a polymeric material comprising at least 80 mol% of the repeating units of the formula: ##STR1## and having an intrinsic viscosity of not less than 0.25 dl/g when measured in a mixture of phenol and sym.-tetrachloroethane in a weight ratio of 6 : 4 at 30.degree. C. and has a refractive index of not more than 1.610 at least in one direction, at a temperature of 120.degree. to 230.degree. C. with a stretch ratio of 2 to 20 in the same direction as the refractive index is measured, or by melt extruding the polymeric material at a temperature higher than 230.degree. C. and not higher than 360.degree. C. while or immediately followed by stretching with a deformation speed of not less than 20 times the speed of the melt extrusion.
Abstract:
A heat-curable and solvent-soluble ester group-containing polymer composition is prepared by the steps of:(1) either (i) reacting a highly polymerized linear aromatic polyester with a diaryl carbonate to depolymerize it to a solvent-soluble low-molecular-weight polyester (component A) containing terminal aryl carboxylate groups, or (ii) effecting the above depolymerization in the presence of a compound containing at least two specified functional groups thereby to form a modified solvent-soluble low-molecular-weight polyester (component A') containing terminal aryl carboxylate groups; and(2) either (i) mixing the resulting component A or A' with a monomeric or solvent-soluble polymeric, polyfunctional compound (component B) containing at least two hydroxyl and/or primary or secondary amino groups or (ii) partially reacting the resulting component A or A' with the component B. The composition has superior workability in molding and curing, and gives cured molded products of high utilitarian value. It is especially suitable for use in wire enamelling varnishes.
Abstract:
Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.
Abstract:
New dicarboxylic compounds of the formula: ##STR1## where R is a hydrogen atom or an alkyl, cycloalkyl or aryl group of 1 - 10 carbon atoms, may be used for manufacturing polyester-imides and copolyester-imides -- Varnishes obtained therefrom are useful for coating electric metal conductors.
Abstract:
The process of making a catalyst for the polymerization of 2-pyrrolidone by contacting an alkali metal pyrrolidonate, a quaternary ammonium carboxylate and carbon dioxide.
Abstract:
This invention relates to a process of reformulating a solvent polyester-type resin, such as employed in electrical insulation, for example in wire enamels, to a solventless polyester-type wire resin of similar properties which is characterized by increasing the relative hydroxy-functionality of said polyester-type resin as compared to the hydroxy-functionality of a corresponding solvent-type wire resin.In the preferred embodiment the increased hydroxy-functionality, in whole or in part, is derived from the use of, or the increased content, of tris(2-hydroxyethyl) isocyanurate. The polyester-type wire enamels include polyesters and polyesters containing other groups such as polyester-amides, polyester-imides, polyester-amide-imides, etc. By doing this, resins having the desired properties as well as viscosities suitable for wire insulation can be made and applied in solventless systems.