公开(公告)号：US08497693B2

公开(公告)日：2013-07-30

申请号：US12681806

申请日：2008-10-01

Applicant: Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

Inventor： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

IPC: G01R31/00

CPC classification number: G01R31/2891 ,  G01R31/2874

Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

Abstract translation: 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。

公开(公告)号：US08446792B2

公开(公告)日：2013-05-21

申请号：US13168515

申请日：2011-06-24

Applicant: Yoshifumi Fukushima ,  Shoji Sakamoto ,  Hiroyuki Sadakata ,  Kiyoto Ohta

Inventor： Yoshifumi Fukushima ,  Shoji Sakamoto ,  Hiroyuki Sadakata ,  Kiyoto Ohta

IPC: G11C7/04

CPC classification number: G11C5/00 ,  G01R31/2874 ,  G11C5/143 ,  G11C7/04 ,  G11C8/10 ,  G11C8/18 ,  G11C11/4076 ,  G11C29/50 ,  G11C2029/5002 ,  H03K19/00369

Abstract: A temperature sensing circuit activates a sensing signal when sensing that a temperature inside a semiconductor integrated circuit is lower than a predetermined temperature. A heat generation control circuit activates a heat generation control signal when the sensing signal is activated. When the heat generation control signal is activated, a current is generated inside a memory circuit to raise the temperature inside the semiconductor integrated circuit.

Abstract translation: 当感测半导体集成电路内的温度低于预定温度时，温度检测电路激活感测信号。 当感测信号被激活时，发热控制电路激活发热控制信号。 当发热控制信号被激活时，在存储器电路内部产生电流以升高半导体集成电路内的温度。

公开(公告)号：US08422762B2

公开(公告)日：2013-04-16

申请号：US12738780

申请日：2007-10-31

Applicant: Masayoshi Ichikawa ,  Hiroki Ikeda

Inventor： Masayoshi Ichikawa ,  Hiroki Ikeda

IPC: G06K9/00

CPC classification number: G01R31/2887 ,  G01R31/2874 ,  G06T7/0004

Abstract: An abnormality detecting apparatus includes an imaging device for obtaining image data of a TIM, a failure detecting section for detecting appearance failures of the TIM on the basis of the image data of the TIM obtained by the imaging device, and a determining device for determining whether an abnormality occurs at the TIM on the basis of a detection result by the failure detecting section.

Abstract translation: 异常检测装置包括用于获取TIM的图像数据的成像装置，用于根据由成像装置获得的TIM的图像数据检测TIM的出现故障的故障检测部分，以及用于确定是否 基于故障检测部的检测结果，TIM发生异常。

公开(公告)号：US08410802B2

公开(公告)日：2013-04-02

申请号：US12647261

申请日：2009-12-24

Applicant: Ashish Gupta ,  James R. Hastings ,  Nader N. Abazarnia ,  Suzana Prstic ,  Jerome L. Garcia

Inventor： Ashish Gupta ,  James R. Hastings ,  Nader N. Abazarnia ,  Suzana Prstic ,  Jerome L. Garcia

IPC: G01R31/00

CPC classification number: F28F23/00 ,  G01R31/2874 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.

Abstract translation: 描述了包括电子元件测试的系统和方法。 一个系统涉及包括适于在测试期间控制电子部件的至少一部分的温度的热控制单元的系统。 该系统包括延伸穿过热控制单元的一部分的至少一个导管，该导管的尺寸适于允许热界面材料流过其中，该热界面材料包括液体。 定位至少一个导管，使得热界面材料可以通过导管输送到电子部件上。 该系统还包括适于控制通过导管的热界面材料的流动的装置，其中可以控制流动以将热界面材料输送到电子部件并从电子部件移除热界面材料。 描述和要求保护其他实施例。

公开(公告)号：US20130075982A1

公开(公告)日：2013-03-28

申请号：US13702054

申请日：2011-04-11

Applicant: Michael E. Simmons ,  Kazuki Negishi ,  Roy Jensen ,  Ryan Garrison ,  Philip Wolf

Inventor： Michael E. Simmons ,  Kazuki Negishi ,  Roy Jensen ,  Ryan Garrison ,  Philip Wolf

IPC: G01R31/26 ,  H01L21/683

CPC classification number: H01L21/6838 ,  G01R31/2601 ,  G01R31/2865 ,  G01R31/2874 ,  Y10T279/11 ,  Y10T279/34

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract translation: 用于测试集成电路的卡盘包括具有适于支撑被测器件的下表面和上表面的上导电层。 上绝缘层具有与上导电层的下表面至少部分地面对面接触的上表面和下表面。 中间导电层具有至少与上绝缘层的下表面部分地面对面接触的上表面和下表面。

公开(公告)号：US20130025382A1

公开(公告)日：2013-01-31

申请号：US13630016

申请日：2012-09-28

Applicant: Kun-Ta Lee

Inventor： Kun-Ta Lee

IPC: G01N17/00

CPC classification number: G05D27/02 ,  G01N17/002 ,  G01R31/2849 ,  G01R31/2874 ,  G05D22/02 ,  G05D23/19

Abstract: An environmental test apparatus is disclosed. The environmental test apparatus is configured to simulate the environmental variation in temperature and humidity. The environmental test apparatus comprises a box, a plurality of openings, a plurality of fans, two guiding elements and a plurality of controllers. The box has a plurality of sidewalls and a plurality of corners each being defined by three of the adjacent sidewalls, wherein the openings are disposed on at least two sidewalls of the box, and each of the fans is correspondingly disposed in each of the openings. The two guiding elements are disposed on two opposite corners for guiding the airflow in the hollow box, wherein the two opposite corners share a single sidewall. The controllers are configured to control the rotational speed of each fan and adapted to uniform the distribution of the temperature and the humidity inside the box.

Abstract translation: 公开了一种环境试验装置。 环境试验装置被配置为模拟温度和湿度的环境变化。 环境试验装置包括一个盒子，多个开口，多个风扇，两个导向元件和多个控制器。 箱体具有多个侧壁和多个角部，每个角部由三个相邻的侧壁限定，其中开口设置在箱体的至少两个侧壁上，并且每个风扇相应地设置在每个开口中。 两个引导元件设置在两个相对的角部上以引导中空箱中的气流，其中两个相对的角共享单个侧壁。 这些控制器被配置成控制每个风扇的转速，并适合使箱内温度和湿度均匀分布。

公开(公告)号：US20120276675A1

公开(公告)日：2012-11-01

申请号：US13544924

申请日：2012-07-09

Applicant: Rolf-Peter Vollertsen

Inventor： Rolf-Peter Vollertsen

IPC: H01L21/8234

CPC classification number: G01K7/015 ,  G01R31/2874 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/00

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract translation: 描述了用于测量应力下的半导体器件的局部表面温度的装置和方法。 该装置包括衬底和参考MOSFET。 参考MOSFET可以在应力下紧邻半导体器件设置。 应力下的半导体器件的局部表面温度可以使用不受应力的参考MOSFET进行测量。 半导体器件在应力下的局部表面温度可以被确定为在向半导体器件施加应力之前测量的参考MOSFET的漏极电流值以及半导体器件处于应力下的函数。

公开(公告)号：US08274300B2

公开(公告)日：2012-09-25

申请号：US12321003

申请日：2009-01-14

Applicant: Naoto Sakaue ,  Fook Seng Kong

Inventor： Naoto Sakaue ,  Fook Seng Kong

IPC: G01R31/00

CPC classification number: G05D23/1904 ,  G01R31/2874

Abstract: A thermal control unit with a heat pipe that conducts heat away from a device under test during burn-in. The heat pipe has a heater that allows control of the rate at which heat is transferred from the DUT to the heat pipe. A sensor and controller are provided to control the heat in response to the measured temperature of the DUT. The sensor and controller control the heater to maintain the surface temperature of the DUT within a specified range.

Abstract translation: 具有热管的热控制单元，其在老化期间将热量从被测器件传导出去。 热管具有加热器，其允许控制热量从DUT传递到热管的速率。 提供传感器和控制器以响应于测量的DUT的温度来控制热量。 传感器和控制器控制加热器，将DUT的表面温度保持在指定范围内。

公开(公告)号：US20120212247A1

公开(公告)日：2012-08-23

申请号：US13205646

申请日：2011-08-09

Applicant: Hiroshi Sakata ,  Ken Miyata

Inventor： Hiroshi Sakata ,  Ken Miyata

IPC: G01R31/26

CPC classification number: G01R31/2889 ,  G01R1/07371 ,  G01R31/2874 ,  G01R31/2893

Abstract: Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card.

Abstract translation: 提供了一种用于测试在半导体晶片上形成的多个待测器件的测试装置，包括：探针卡，用于连接到待测试的多个被测器件的相应触点，以​​在重叠在半导体晶片上的连接表面上， 所述探针卡在所述连接表面的后表面上设置有多个对应的触点; 以及测试头，通过依次连接到探针卡的多个触点的每个部分，在半导体晶片上测试被测试的多个器件。

公开(公告)号：US08232815B2

公开(公告)日：2012-07-31

申请号：US12599371

申请日：2008-10-02

Applicant: Max Schaule ,  Stefan Thiel ,  Franz Pichl ,  Günther Jeserer ,  Andreas Wiesböck ,  Alexander Bauer

Inventor： Max Schaule ,  Stefan Thiel ,  Franz Pichl ,  Günther Jeserer ,  Andreas Wiesböck ,  Alexander Bauer

IPC: G01R31/00 ,  G01R31/26

CPC classification number: G01R31/2874

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract translation: 用于将特定IC的电气部件保持并移动到连接到测试台的接触装置的柱塞包括具有流体分配室的头部件，温度控制的流体通过该流体分配室流动。 抽吸头被布置成使得温度受控的流体围绕吸头流动并且沿着吸头转向组件。