Abstract:
An assembly and a method for accurately aligning optical fibers in an optical switch are described. An optical switch assembly is described having a pair of optical arrays mounted on a mounting apparatus. The mounting apparatus may include a base structure with either integral rails or affixed fibers. Alternatively, the mounting apparatus may include a base structure with grooves and a plurality of spheres in the grooves. An alternative arrangement includes a base structure with some grooves extending transverse to other grooves and mounting structures in each groove. One of the optical arrays is rendered immobile while the other array is freely movable on the mounting apparatus. Switching is provided by moving the movable fiber array relative to the fixed fiber array.
Abstract:
An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is positioned on V-grooves located on the upper surface. The imaging assembly, which preferably includes a plurality of lenses, such as GRIN lenses, is lowered at least partially into the cut-out portion. The optical fibers are optically coupled with said lenses. A waveguide, having a plurality of waveguide cores within a cladding, may further be optically coupled with the lenses, or alternatively, directly to the optical fibers. An integrated optic chip may also be affixed to the substrate or mounted on the substrate.
Abstract:
An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex profile than the remainder of the flex plate and that is located beneath the optical arrays interface. Flexing of the flex plate optically couples the optical arrays. A tool with grooves is used to align the optical arrays relative to each other. The tool uses grooves and spheres to mate with the optical arrays in such a way as to provide an appropriate interface between the optical arrays.
Abstract:
A first waveguide holding member has a principal surface which confronts the principal surface of a second waveguide holding member. Each principal surface has a stepped configuration defined by an upper surface region, a lower surface region and a transverse region which separates the upper and lower surface regions. At least guide member guides the first and second waveguide holding members to operatively couple and decouple opposing ends of first and second optical waveguides which terminate at the transverse regions of the first and second waveguide holding members, respectively.
Abstract:
Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.
Abstract:
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Abstract:
Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
Abstract:
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract:
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.