DRIVE BACKPLANE, DISPLAY PANEL, ELECTRONIC APPARATUS, AND METHOD FOR PREPARING DRIVE BACKPLANE

    公开(公告)号:US20200286930A1

    公开(公告)日:2020-09-10

    申请号:US16651400

    申请日:2019-09-17

    Inventor: Haixu Li

    Abstract: A drive backplane, a display panel, an electronic apparatus, and a method for preparing a drive backplane are provided in embodiments of the disclosure, all relating to the technical field of display technology, the drive backplane including: a base substrate; a driving device layer on the base substrate, comprising an electrode layer; a planarization layer, on a surface of the driving device layer facing away from the base substrate, and the planarization layer being provided with at least one projection portion and at least one base portion adjacent to the at least one projection portion both on a surface of the planarization layer facing away from the driving device layer, each projection portion having a greater thickness than that of each base portion; a conductive layer, on respective surface of each projection portion facing away from the driving device layer, the conductive layer being connected with the electrode layer of the driving device layer; a spacer layer, on a surface of the conductive layer facing away from the planarization layer; and a binding layer, covering both a surface of the spacer layer facing away from the conductive layer and the surface of the conductive layer facing away from the planarization layer, the binding layer being where a light-emitting device is to be provided.

    CONDUCTIVE LAYER, THIN FILM TRANSISTOR AND MANUFACTURING METHODS THEREFOR, ARRAY SUBSTRATE AND DISPLAY DEVICE

    公开(公告)号:US20180212032A1

    公开(公告)日:2018-07-26

    申请号:US15828768

    申请日:2017-12-01

    Inventor: Haixu Li

    Abstract: The present disclosure relates to a conductive layer, a thin film transistor and manufacturing methods therefor, an array substrate and a display device, in the field of displays. The conductive layer comprises: a metal layer and an organophosphorus-metal complex covering the metal layer. In the embodiments of the present disclosure, the organophosphorus-metal complex is manufactured on the surface of the metal layer to form the conductive layer. The conductive layer is adopted as an electrode material. In one aspect, the organophosphorus-metal complex has conductivity and can prevent the surface of metal from making contact with oxygen, thereby avoiding metal oxidation under the premise of not affecting the performances of the electrode when serving as a material of the electrode in a TFT. In the other aspect, the organophosphorus-metal complex can increase a binding force between the metal and photoresist and avoids stripping of the photoresist. Therefore, etching liquid is prevented from etching the metal in a position without the need of etching. The conductive layer provided by the present disclosure has the performances in the above two aspects. Therefore, the stability and electronic transmission performances of the electrode can be improved by adopting such a conductive layer to manufacture the electrode of the thin film transistor.

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