公开(公告)号：US20160314936A1

公开(公告)日：2016-10-27

申请号：US15198969

申请日：2016-06-30

Applicant: Applied Materials, Inc.

Inventor： James D. CARDUCCI ,  Hamid TAVASSOLI ,  Ajit BALAKRISHNA ,  Zhigang CHEN ,  Andrew NGUYEN ,  Douglas A. BUCHBERGER, JR. ,  Kartik RAMASWAMY ,  Shahid RAUF ,  Kenneth S. COLLINS

IPC: H01J37/32

Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.

公开(公告)号：US20160139503A1

公开(公告)日：2016-05-19

申请号：US14589987

申请日：2015-01-05

Applicant: Applied Materials, Inc.

Inventor： Kartik RAMASWAMY ,  Srinivas D. NEMANI

IPC: G03F1/80

CPC classification number: G03F7/20 ,  G03F7/26 ,  H01J11/22 ,  H01J11/32 ,  H01J37/32541 ,  H01J37/32568 ,  H05H2001/2462 ,  H05H2001/485

Abstract: A method and apparatus disclosed herein apply to processing a substrate, and more specifically to a method and apparatus for improving photolithography processes. The apparatus includes a chamber body, a substrate support disposed within the chamber body, and an electrode assembly. The substrate support has a top plate disposed above the substrate support, a bottom plate disposed below the substrate support, and a plurality of electrodes connecting the top plate to the bottom plate. A voltage is applied to the plurality of electrodes to generate an electric field. Methods for exposing a photoresist layer on a substrate to an electric field are also disclosed herein.

Abstract translation: 本文公开的方法和装置适用于处理衬底，更具体地涉及用于改进光刻工艺的方法和装置。 该装置包括室主体，设置在室主体内的基板支撑件和电极组件。 衬底支撑件具有设置在衬底支撑件上方的顶板，设置在衬底支撑件下方的底板以及将顶板连接到底板的多个电极。 电压施加到多个电极以产生电场。 本文还公开了将基板上的光致抗蚀剂层暴露于电场的方法。

公开(公告)号：US20160064197A1

公开(公告)日：2016-03-03

申请号：US14939787

申请日：2015-11-12

Applicant: Applied Materials, Inc.

Inventor： Banqiu WU ,  Ajay KUMAR ,  Kartik RAMASWAMY ,  Omkaram NALAMASU

IPC: H01J37/32

CPC classification number: H01J37/32669 ,  H01J37/32009 ,  H01J37/32422 ,  H01J37/3244 ,  H01L21/0273 ,  H01L21/31144

Abstract: The present disclosure provides methods and an apparatus for controlling and modifying line width roughness (LWR) of a photoresist layer with enhanced electron spinning control. In one embodiment, an apparatus for controlling a line width roughness of a photoresist layer disposed on a substrate includes a processing chamber having a chamber body having a top wall, side wall and a bottom wall defining an interior processing region, a support pedestal disposed in the interior processing region of the processing chamber, and a plasma generator source disposed in the processing chamber operable to provide predominantly an electron beam source to the interior processing region.

Abstract translation: 本公开提供了通过增强的电子纺丝控制来控制和修改光致抗蚀剂层的线宽粗糙度（LWR）的方法和装置。 在一个实施例中，用于控制设置在基板上的光致抗蚀剂层的线宽粗糙度的装置包括处理室，该处理室具有室主体，该室主体具有限定内部处理区域的顶壁，侧壁和底壁， 处理室的内部处理区域和设置在处理室中的等离子体发生器源，其可操作以主要向内部处理区域提供电子束源。

公开(公告)号：US20150040829A1

公开(公告)日：2015-02-12

申请号：US14026921

申请日：2013-09-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik RAMASWAMY ,  Andrew NGUYEN ,  Sergey G. BELOSTOTSKIY

IPC: H01J37/32

CPC classification number: H01J37/32596

Abstract: Embodiments of the present invention relate to hollow cathode plasma sources with improved uniformity. One embodiment of the present invention provides a hollow cathode assembly having a conductive rod disposed in an inner volume along a central axis of a hollow cathode. The conductive rod being closest to the ground electrode and having the sharpest features of the hollow cathode becomes the point of plasma ignition. Since the conductive rod is positioned along the central axis, the plasma is ignited at symmetrically about the central axis thus improving plasma uniformity and reducing skews.

Abstract translation: 本发明的实施例涉及具有改进的均匀性的中空阴极等离子体源。 本发明的一个实施例提供一种空心阴极组件，其具有沿中空阴极的中心轴设置在内部容积中的导电棒。 最接近接地电极的导电棒具有中空阴极的最尖锐特征，成为等离子点火点。 由于导电棒沿着中心轴定位，所以等离子体围绕中心轴对称地点燃，从而改善等离子体均匀性并减少倾斜。

公开(公告)号：US20250149361A1

公开(公告)日：2025-05-08

申请号：US19013048

申请日：2025-01-08

Applicant: Applied Materials, Inc.

Inventor： Arvinder S. CHADHA ,  Kartik RAMASWAMY

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: Methods and apparatus for clamping a substrate comprise i. placing a substrate on a clamping surface of a substrate support having a plurality of electrodes spaced from one another including a first electrode and a second electrode; ii. measuring substrate bow of the substrate; iii. determining, based on the measured substrate bow, a first voltage to be applied to the first electrode and a second voltage to be applied to the second electrode, wherein the first voltage is an AC voltage and the second voltage is an AC or a DC voltage; and iv. applying the first voltage to the first electrode and the second voltage to the second electrode to clamp the substrate to the substrate support.

公开(公告)号：US20250069921A1

公开(公告)日：2025-02-27

申请号：US18943632

申请日：2024-11-11

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Yogananda SARODE ,  Xue CHANG ,  Kartik RAMASWAMY

IPC: H01L21/67 ,  C23C16/455 ,  H01J37/32 ,  H10N10/13

Abstract: Methods and systems for in-situ temperature control are provided. The system includes a temperature-sensing dis. The temperature-sensing disc has a body, a front surface and a back surface opposing the front surface. One or more cameras are positioned on the front surface, the back surface, or both the front surface and the back surface. The one or more cameras are configured for performing infrared-based imaging of a surface of a processing chamber.

公开(公告)号：US20240290578A1

公开(公告)日：2024-08-29

申请号：US18115537

申请日：2023-02-28

Applicant: Applied Materials, Inc.

Inventor： Kartik RAMASWAMY ,  Yue GUO ,  A N M Wasekul AZAD ,  Yang YANG ,  Nicolas J. BRIGHT

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32091 ,  H01J37/321

Abstract: A method and apparatus for spatially switching radio frequency (RF) power from a single RF power generator to a selected one of two or more impedance matching networks coupled to associated RF electrodes for forming plasma in a plasma chamber. Full RF power may be switched within microseconds to the selected one of the two or more impedance matching networks. The two or more impedance matching networks may be coupled to one or more plasma generating electrodes. The two or more impedance matching networks may be interleaved during plasma processing recipe operation. Impedance matching networks can alternate back and forth during operation of a plasma processing recipe. This interleaving in operation and impedance transformation capabilities may also be performed with more than two impedance matching networks, and may be beneficial in enabling the use of fixed tuned impedance matching networks instead of requiring variable impedance matching networks having variable tuning capabilities.

公开(公告)号：US20240234087A1

公开(公告)日：2024-07-11

申请号：US18612757

申请日：2024-03-21

Applicant: Applied Materials, Inc.

Inventor： A N M Wasekul AZAD ,  Kartik RAMASWAMY ,  Yang YANG ,  Yue GUO ,  Fernando SILVEIRA

IPC: H01J37/32 ,  H03K17/687

CPC classification number: H01J37/32091 ,  H03K17/687 ,  H01J2237/327

Abstract: Embodiments provided herein generally include apparatus, e.g., plasma processing systems, and methods for the plasma processing of a substrate in a processing chamber. Some embodiments are directed to a waveform generator. The waveform generator generally includes a first voltage stage having: a first voltage source; a first switch; a ground reference; a transformer having a first transformer ratio, the first transformer comprising: a primary winding coupled to the first voltage source and the ground reference; and a secondary winding having a first end and a second end, wherein the first end is coupled to the ground reference, and the second end is configured to be coupled to a load through a common node; and a first diode coupled in parallel with the primary winding of the first transformer. The waveform generator generally also includes one or more additional voltage stages coupled to a load through the common node.

公开(公告)号：US20240177968A1

公开(公告)日：2024-05-30

申请号：US18059658

申请日：2022-11-29

Applicant: Applied Materials, Inc.

Inventor： A N M Wasekul AZAD ,  Kartik RAMASWAMY ,  Yue GUO ,  Nicolas J. BRIGHT ,  Yang YANG

IPC: H01J37/32

CPC classification number: H01J37/32146 ,  H01J37/32128

Abstract: Embodiments of the disclosure provided herein include an apparatus and method for processing a substrate in a plasma processing system. The apparatus includes a pulse voltage (PV) waveform generator comprising at least one synchronization signal and a plurality of pulsers to provide a plurality of TTL inputs. The PV waveform generator generates a waveform containing pulses or bursts which contain micropulses corresponding to the plurality of TTL input signals and the at least one synchronization signal. The method includes receiving a first TTL input signal and a synchronization waveform signal from a controller, delivering a first micropulse to an electrode assembly after receiving the first TTL input signal and synchronization signal, and delivering a second micropulse to the electrode assembly after receiving the second TTL input signal and the synchronization signal.

公开(公告)号：US20240118328A1

公开(公告)日：2024-04-11

申请号：US17960666

申请日：2022-10-05

Applicant: Applied Materials, Inc.

Inventor： Yue GUO ,  Yang YANG ,  Kartik RAMASWAMY ,  Fernando SILVEIRA ,  A N M Wasekul AZAD

IPC: G01R29/08

CPC classification number: G01R29/0885

Abstract: Embodiments of the disclosure include an electric field measurement system that includes a first light source, a first light sensor configured to receive electromagnetic energy transmitted from the first light source, an electro-optic sensor, and a controller. The electro-optic sensor may include a package comprising a first electro-optic crystal disposed within a body; and at least one optical fiber. The optical fiber is configured to transmit electromagnetic energy transmitted from the first light source to a surface of the first electro-optic crystal, and transmit at least a portion of the electromagnetic energy transmitted to the surface of the first electro-optic crystal and subsequently passed through at least a portion of the first electro-optic crystal to the first light sensor that is configured to generate a signal based on an attribute of the electromagnetic energy received by the first light sensor from the at least one optical fiber. The controller is configured to generate a command signal based on a signal received from the first light sensor.