公开(公告)号：US20240162066A1

公开(公告)日：2024-05-16

申请号：US17984357

申请日：2022-11-10

Applicant: Applied Materials, Inc.

Inventor： Arvinder S. CHADHA ,  Kartik RAMASWAMY

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67288 ,  H01L21/6831 ,  H01J37/32715

Abstract: Methods and apparatus for clamping a substrate comprise i. placing a substrate on a clamping surface of a substrate support having a plurality of electrodes spaced from one another including a first electrode and a second electrode; ii. measuring substrate bow of the substrate; iii. determining, based on the measured substrate bow, a first voltage to be applied to the first electrode and a second voltage to be applied to the second electrode, wherein the first voltage is an AC voltage and the second voltage is an AC or a DC voltage; and iv. applying the first voltage to the first electrode and the second voltage to the second electrode to clamp the substrate to the substrate support.

公开(公告)号：US20250149361A1

公开(公告)日：2025-05-08

申请号：US19013048

申请日：2025-01-08

Applicant: Applied Materials, Inc.

Inventor： Arvinder S. CHADHA ,  Kartik RAMASWAMY

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: Methods and apparatus for clamping a substrate comprise i. placing a substrate on a clamping surface of a substrate support having a plurality of electrodes spaced from one another including a first electrode and a second electrode; ii. measuring substrate bow of the substrate; iii. determining, based on the measured substrate bow, a first voltage to be applied to the first electrode and a second voltage to be applied to the second electrode, wherein the first voltage is an AC voltage and the second voltage is an AC or a DC voltage; and iv. applying the first voltage to the first electrode and the second voltage to the second electrode to clamp the substrate to the substrate support.

公开(公告)号：US20230187250A1

公开(公告)日：2023-06-15

申请号：US17550932

申请日：2021-12-14

Applicant: Applied Materials, Inc.

Inventor： Arvinder S. CHADHA ,  Kartik RAMASWAMY

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/6719

Abstract: Electrostatic chucks for use in substrate processing chambers are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes: a dielectric plate having an electrode disposed therein, the dielectric plate further including a central portion and a peripheral portion, wherein the peripheral portion comprises at least one of: an outer sidewall having at least one asperity; a porosity greater than a porosity of the central portion of the dielectric plate; or one or more coatings made of a material different than a material of the central portion.