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公开(公告)号：USD843934S1
公开(公告)日：2019-03-26
申请号：US29612830
申请日：2017-08-04
Applicant: Apple Inc.
Designer： Tang Yew Tan , David A. Pakula , Daniel W. Jarvis , Gregory Nicolaus Stephens
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公开(公告)号：US10244659B2
公开(公告)日：2019-03-26
申请号：US15712069
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , David A. Pakula , David J. Dunsmoor , Ian A. Spraggs , Lee E. Hooton , Marwan Rammah , Matthew D. Hill , Robert F. Meyer , James A. Bertin , Eric M. Bennett , Simon C. Helmore , Melissa A. Wah , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H05K7/20 , H05K1/02 , G06F3/041 , H01M2/10 , H05K1/14 , G06F1/16 , H01M2/08 , H02J7/00 , G06F3/044
Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
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公开(公告)号：US10219057B2
公开(公告)日：2019-02-26
申请号：US15699064
申请日：2017-09-08
Applicant: Apple Inc.
Inventor： Thomas R. Luce , Anthony P. Grazian , Hongdan Tao , Christopher Wilk , Daniel W. Jarvis , David A. Pakula
Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.
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公开(公告)号：US10154327B2
公开(公告)日：2018-12-11
申请号：US14821568
申请日：2015-08-07
Applicant: APPLE INC.
Inventor： Martin J. Auclair , Jared M. Kole , Marwan Rammah , David A. Pakula , Scott P. Porter
Abstract: An electronic device has a speaker housing secured within the device housing. The speaker housing has a cavity with a speaker at one end and a port at the other configured to communicate through an aperture in the housing of the electronic device. A panel of acoustic mesh is integrally formed within the cavity of the housing and is disposed between the port and the speaker. In other embodiments flexible structures are integrally molded onto a plate or the acoustic device and used to secure and acoustically seal the acoustic device within the device housing.
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公开(公告)号：USD832266S1
公开(公告)日：2018-10-30
申请号：US29612831
申请日：2017-08-04
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , Douglas G. Fournier , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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Patent Agency Ranking
公开(公告)号：US10052848B2
公开(公告)日：2018-08-21
申请号：US13783262
申请日：2013-03-02
Applicant: Apple Inc.
Inventor： Christopher D. Prest , Dale N. Memering , David A. Pakula , Richard Hung Minh Dinh , Vincent Yan , Jason Huey
IPC: C30B33/06 , C30B29/30 , B32B9/00 , B32B3/02 , B32B7/00 , B32B18/00 , B32B7/02 , B32B17/10 , C04B35/115 , C03C27/00 , C04B37/00 , C04B37/04 , C30B29/20
CPC classification number: B32B9/002 , B32B3/02 , B32B7/00 , B32B7/02 , B32B17/10 , B32B17/10045 , B32B17/10119 , B32B17/10733 , B32B18/00 , B32B2307/412 , C03C27/00 , C04B35/115 , C04B37/001 , C04B37/008 , C04B37/047 , C04B2235/76 , C04B2235/787 , C04B2237/343 , C04B2237/52 , C04B2237/704 , C30B29/20 , C30B33/06 , Y10T428/24488
Abstract: Various sapphire and laminate structures are discussed herein. One embodiment may take the form of a sapphire structure having a first sapphire sheet with a first sapphire plane type forming the major surface and a second sapphire sheet having a second different sapphire plane type forming the major surface. The first and second sapphire sheets are fused together to form the sapphire structure.
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公开(公告)号：USD824389S1
公开(公告)日：2018-07-31
申请号：US29554625
申请日：2016-02-12
Applicant: Apple Inc.
Designer： Richard Hung Minh Dinh , Richard P. Howarth , Scott A. Myers , David A. Pakula , Tang Yew Tan
Abstract: The said design consists of the visual features of shape and configuration of the Housing Plate shown in solid lines in the hereto annexed drawings. The portions shown in broken lines are for the purposes of illustration only and do not form part of the design.Figure 1 is a bottom rear perspective view of the design;Figure 2 is a top rear perspective view of the design;Figure 3 is a bottom front perspective view of the design;Figure 4 is a top front perspective view of the design;Figure 5 is a rear view of the design;Figure 6 is a front view of the design;Figure 7 is a bottom view of the design;Figure 8 is a top view of the design;Figure 9 is a left side view of the design; andFigure 10 is a right side view of the design.Drawings of the design are included.
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公开(公告)号：US20180164853A1
公开(公告)日：2018-06-14
申请号：US15892310
申请日：2018-02-08
Applicant: Apple Inc.
Inventor： Scott A. Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assembles can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US09898049B2
公开(公告)日：2018-02-20
申请号：US15168194
申请日：2016-05-30
Applicant: Apple Inc.
Inventor： Scott A. Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：USD795823S1
公开(公告)日：2017-08-29
申请号：US29581007
申请日：2016-10-14
Applicant: Apple Inc.
Designer： Shota Aoyagi , Richard P. Howarth , Shayan Malek , Scott A. Myers , David A. Pakula , Gregory Nicolaus Stephens
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