公开(公告)号：US06861642B2

公开(公告)日：2005-03-01

申请号：US10451633

申请日：2002-03-22

申请人： Katsunori Ichiki ,  Kazuo Yamauchi ,  Hirokuni Hiyama ,  Seiji Samukawa

发明人： Katsunori Ichiki ,  Kazuo Yamauchi ,  Hirokuni Hiyama ,  Seiji Samukawa

IPC分类号： C23C14/32 ,  G21K1/14 ,  H01J37/317 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46 ,  H05H3/00 ,  H05H3/02

CPC分类号： H01J37/32357 ,  G21K1/14 ,  H01J37/3178 ,  H05H3/02

摘要： A neutral particle beam processing apparatus comprises a workpiece holder (20) for holding a workpiece (X), a plasma generator for generating a plasma in a vacuum chamber (3), an orifice electrode (5) disposed between the workpiece holder (20) and the plasma generator, and a grid electrode (4) disposed upstream of the orifice electrode (5) in the vacuum chamber (3). The orifice electrode (5) has orifices (5a) defined therein. The neutral particle beam processing apparatus further comprises a voltage applying unit for applying a voltage between the orifice electrode (5) and the grid electrode (4) via a dielectric (5b) to extract positive ions from the plasma generated by the plasma generator and pass the extracted positive ions through the orifices (5a) in the orifice electrode (5).

摘要翻译： 中性粒子束处理装置包括用于保持工件（X）的工件保持器（20），用于在真空室（3）中产生等离子体的等离子体发生器，设置在工件保持器（20）之间的孔电极（5） 和等离子体发生器，以及设置在真空室（3）中的孔电极（5）的上游的栅电极（4）。 孔口电极（5）具有限定在其中的孔口（5a）。 中性粒子束处理装置还包括电压施加单元，用于通过电介质（5b）在孔电极（5）和栅电极（4）之间施加电压，以从等离子体发生器产生的等离子体中提取正离子并通过 通过孔电极（5）中的孔（5a）提取的正离子。

公开(公告)号：US06712678B1

公开(公告)日：2004-03-30

申请号：US09890880

申请日：2001-09-21

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  B24B57/02

摘要： It is an object of the present invention to provide a mechanism for effectively discharging debris produced when a substrate is polished by a bonded-abrasive element, and a polishing apparatus. According to the present invention, a polishing apparatus presses a surface of a substrate against a bonded-abrasive surface and moves the surface to be polished and the bonded-abrasive surface relative to each other to polish the surface. A mechanism is provided for discharging debris produced on the bonded-abrasive surface when the surface to be polished is polished.

摘要翻译： 本发明的目的是提供一种用于有效地排出当通过粘结研磨元件抛光基底时产生的碎屑的机构和抛光装置。 根据本发明，抛光装置将基板的表面压靠在粘合研磨表面上，并使被研磨表面和粘结研磨表面相对于彼此移动以抛光表面。 当抛光表面被抛光时，提供了用于排出在粘合研磨表面上产生的碎屑的机构。

公开(公告)号：US06579148B2

公开(公告)日：2003-06-17

申请号：US10166093

申请日：2002-06-11

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

IPC分类号： B24B4900

CPC分类号： B24B37/16 ,  B24B37/013 ,  B24B49/14 ,  B24B49/16 ,  B24B57/02

摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

公开(公告)号：US06458012B1

公开(公告)日：2002-10-01

申请号：US09612215

申请日：2000-07-07

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

IPC分类号： B24B4900

CPC分类号： B24B37/16 ,  B24B37/013 ,  B24B49/14 ,  B24B49/16 ,  B24B57/02

摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

摘要翻译： 抛光装置用于抛光诸如半导体晶片或玻璃基板的工件的表面。 抛光装置包括：抛光台，其上具有研磨面，多个工件保持件，每个工件保持件用于保持工件并将工件压靠在抛光表面上;以及控制器，其分别控制工件保持器，使得工件保持器的抛光操作 相互独立地控制。

公开(公告)号：US06315643B1

公开(公告)日：2001-11-13

申请号：US09344495

申请日：1999-06-25

申请人： Hirokuni Hiyama ,  Seiyo Maekawa ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Seiyo Maekawa ,  Yutaka Wada

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A polishing apparatus including a turntable having an upper polishing surface, at least one carrier for carrying an article with a surface to be polished in such a manner that the surface is engaged with the upper polishing surface of the turntable, and at least one slurry supply nozzle provided for the carrier and adapted to supply a slurry on the polishing surface of the turntable at a predetermined slurry supply point upstream of a line connecting the center axes of the turntable and the carrier in the direction of rotation of the turntable while the turntable and the carrier are rotated around their respective center axes with the surface of the article kept in engagement with the polishing surface. The nozzle is preferably positioned such that an angle is formed between the line connecting the center axis of the turntable and the center axis of the carrier and a line connecting the center axis of the carrier and the predetermined slurry supply point is in the range of from 5 degrees to 40 degrees.

摘要翻译： 一种抛光装置，包括具有上抛光表面的转台，至少一个载体，用于承载具有待抛光表面的制品，使得该表面与转台的上抛光表面接合，以及至少一个浆料供应 喷嘴，其设置用于载体，并且适于在转台的旋转方向上连接转台和载体的中心轴线的上游的预定浆料供应点处在转台的抛光表面上提供浆料，同时转盘和 载体围绕其各自的中心轴线旋转，同时制品的表面保持与抛光表面接合。 喷嘴优选地定位成使得在连接转盘的中心轴线和载体的中心轴线的线与连接载体的中心轴线与预定浆料供应点之间形成的角度在从 5度至40度。

公开(公告)号：US5888126A

公开(公告)日：1999-03-30

申请号：US590836

申请日：1996-01-24

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US5882244A

公开(公告)日：1999-03-16

申请号：US967767

申请日：1997-11-10

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

IPC分类号： B24B37/00 ,  B24B37/013 ,  B24B37/015 ,  B24B49/14 ,  B24B49/00

CPC分类号： B24B37/015 ,  B24B49/14

摘要： A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.

摘要翻译： 抛光装置使得可以精确地检测抛光期间工件的温度，并且基于该检测温度进行抛光终点确定。 抛光装置将诸如半导体晶片的工件的表面中的凹凸抛光到平坦的和镜面状的光洁度。 保持半导体晶片的顶环设置有温度传感器。 由温度传感器检测在半导体晶片中通过研磨产生的摩擦热，并且基于检测到的温度来确定研磨终点。