公开(公告)号：US2560301A

公开(公告)日：1951-07-10

申请号：US10627749

申请日：1949-07-22

申请人： FILM N FILE INC

发明人： HARRISON MORRISON NATHAN

IPC分类号： G03D15/10

CPC分类号： G03D15/10 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1989

公开(公告)号：US20190248127A1

公开(公告)日：2019-08-15

申请号：US16392809

申请日：2019-04-24

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： ChunHung CHEN ,  Sheng-Chen WANG

IPC分类号： B32B43/00 ,  B32B7/12 ,  B32B37/12 ,  B24B37/34

CPC分类号： B32B43/006 ,  B24B37/34 ,  B32B7/12 ,  B32B37/12 ,  B32B2307/538 ,  Y10T156/1168 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A pad removal device includes a pad guide extending along a first direction. The pad guide includes a first affixing component configured to affix a first end of the pad guide to a pad at a first pad edge location, and a second affixing component configured to affix a second end of the pad guide to the pad at a second pad edge location opposite the first pad edge location. The pad removal device further includes an actuator attached to the pad guide, and a control assembly coupled to the actuator and configured to cause the actuator to move the first end toward the second end along the first direction. The pad guide is configured to extend in a second direction different from the first direction by an amount dependent on a distance between the first end and the second end.

公开(公告)号：US09895695B2

公开(公告)日：2018-02-20

申请号：US14316414

申请日：2014-06-26

申请人： Brooks Automation, Inc.

发明人： Robert K. Neeper ,  Rhett L. Affleck ,  Roger Howard

IPC分类号： B32B38/10 ,  B01L9/00 ,  B29C63/00 ,  B67B7/00 ,  B01L99/00 ,  B32B43/00

CPC分类号： B01L9/00 ,  B01L99/00 ,  B29C63/0013 ,  B32B38/10 ,  B32B43/006 ,  B67B7/00 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/19 ,  Y10T156/195 ,  Y10T156/1956 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

公开(公告)号：US09550351B2

公开(公告)日：2017-01-24

申请号：US14743068

申请日：2015-06-18

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

发明人： Shuang Ni ,  Shichu Zhang ,  Ziran Wang ,  Bin Chang ,  Zhenshan Lu

IPC分类号： B32B38/10 ,  B32B43/00 ,  B32B38/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B38/105 ,  B32B2457/202 ,  Y10T156/1132 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/195 ,  Y10T156/1978 ,  Y10T156/1989

摘要： This invention discloses a corner peeling device, a film peeling apparatus, and a film peeling method, and relates to the technical field of liquid crystal panel manufacture, for the purpose of solving the problem concerning low efficiency in film peeling. The corner peeling device comprises: a movable rack; a roller pivoted on the upper part of the rack; an evacuating device in communication with the air channel; and an automatic revolving device, which is connected to the roller so that at the beginning of corner peeling and after corner peeling, the opening of the same sucking hole at one end of the plurality of the sucking holes arranged at intervals is upward. The corner peeling device is used for peeling a corner of a release film adhered to a plate-like substrate. The film peeling apparatus comprises the corner peeling device mentioned in the technical solution described above.

摘要翻译： 本发明公开了一种角剥离装置，膜剥离装置和膜剥离方法，其目的在于解决薄膜剥离效率低的问题，涉及液晶面板制造技术领域。 角部剥离装置包括：可移动的支架; 一个在机架上部枢转的滚轮; 与空气通道连通的抽空装置; 以及自动旋转装置，其连接到辊子，使得在角落剥离开始和角落剥离之后，间隔设置的多个吸孔的一端的相同吸孔的开口向上。 角剥离装置用于剥离附着在板状基板上的剥离膜的角部。 膜剥离装置包括上述技术方案中提到的角部剥离装置。

公开(公告)号：US09475271B2

公开(公告)日：2016-10-25

申请号：US14509073

申请日：2014-10-08

申请人： FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

发明人： Tao Zhou

IPC分类号： B32B43/00 ,  B29C63/00

CPC分类号： B32B43/006 ,  B29C63/0013 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1967 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A peeling mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a driver, two clamping members coupled to the driver and spaced from each other, and two cutting members respectively coupled to the clamping members oppositely to each other. Each cutting member can include a protruding end extending towards the other cutting member. The protruding end protrudes out of the clamping member. The driver can be configured to move the two clamping members towards each other.

摘要翻译： 配置为与机械臂配合以从工件移除保护膜的剥离机构可以包括驱动器，联接到驱动器并彼此间隔开的两个夹紧构件以及分别与夹紧构件彼此相对地联接的两个切割构件 。 每个切割构件可以包括朝向另一个切割构件延伸的突出端。 突出端突​​出夹紧构件。 驱动器可以被配置成将两个夹紧构件朝向彼此移动。

公开(公告)号：US20150343755A1

公开(公告)日：2015-12-03

申请号：US14723778

申请日：2015-05-28

申请人： TOKYO ELECTRON LIMITED

发明人： Masaru HONDA ,  Ryoichi SAKAMOTO ,  Katsuhiro IKEDA

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B2309/16 ,  B32B2457/14 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/19 ,  Y10T156/1944 ,  Y10T156/1967 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.

摘要翻译： 一种剥离装置，其将从叠置基板的一个端部朝向其另一个端部粘接第一基板和第二基板而获得的叠置基板剥离，包括：第一保持单元，其被配置为保持叠置基板的第一基板 配置为保持所述叠置基板的所述第二基板的第二保持单元，以及移动单元，其被配置为使所述第一保持单元远离所述第二保持单元移动。 移动单元构造成在叠置基板的至少剥离方向上移动。

公开(公告)号：US20150096691A1

公开(公告)日：2015-04-09

申请号：US14509073

申请日：2014-10-08

申请人： FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO.,LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

发明人： TAO ZHOU

IPC分类号： B32B43/00 ,  B32B38/10 ,  B32B38/00

CPC分类号： B32B43/006 ,  B29C63/0013 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1967 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A peeling mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a driver, two clamping members coupled to the driver and spaced from each other, and two cutting members respectively coupled to the clamping members oppositely to each other. Each cutting member can include a protruding end extending towards the other cutting member. The protruding end protrudes out of the clamping member. The driver can be configured to move the two clamping members towards each other.

摘要翻译： 配置为与机械臂配合以从工件移除保护膜的剥离机构可以包括驱动器，联接到驱动器并彼此间隔开的两个夹紧构件以及分别与夹紧构件彼此相对地联接的两个切割构件 。 每个切割构件可以包括朝向另一个切割构件延伸的突出端。 突出端突​​出夹紧构件。 驱动器可以被配置成将两个夹紧构件朝向彼此移动。

公开(公告)号：US08852391B2

公开(公告)日：2014-10-07

申请号：US12819680

申请日：2010-06-21

申请人： Jeremy W. McCutcheon ,  Robert D. Brown

发明人： Jeremy W. McCutcheon ,  Robert D. Brown

IPC分类号： B32B38/10 ,  H01L21/683 ,  H01L21/18 ,  H01L21/687 ,  H01L21/67

CPC分类号： H01L21/187 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/68721 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1168 ,  Y10T156/1978 ,  Y10T156/1989

摘要： New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.

摘要翻译： 提供了用于分离由这些方法和装置形成的临时，永久或半永久粘合的基底和物品的新的拆卸方法和装置。 这些方法包括从仅在其外周强度结合的载体晶片或基底上拆卸器件晶片。 边缘粘合是化学，机械，声学或热软化，溶解或破坏，以允许晶片在非常低的力和在室温或在室温附近在制造过程中的适当阶段容易地分离。 还提供了一种用于便于分离键合衬底的夹具。

公开(公告)号：US20140174041A1

公开(公告)日：2014-06-26

申请号：US14060046

申请日：2013-10-22

申请人： Marchesini Group S.p.A

发明人： Giuseppe MONTI

IPC分类号： B65B69/00

CPC分类号： B65B69/0033 ,  B32B43/006 ,  B65B69/00 ,  B67B7/40 ,  Y10T156/1168 ,  Y10T156/1989

摘要： The method for removing a sealing film from a container includes use of a gripping device having a fixed lower jaw and a mobile upper jaw and comprises carrying out following steps: a first gripping step, in which the gripping device clamps the flap of film projecting from a rounded corner of the container; a step of partial detachment, in which the gripping device detaches only a portion of the film which is at the rounded corner; an adjusting step in which the mobile upper jaw is distanced from the fixed lower jaw and the gripping device is moved so as to capture, between the two jaws, a larger surface of film; a second gripping step in which the upper jaw lowers and locks against the lower jaw to grip the surface of film, and a complete detaching step, in which the gripping device performs complete detachment of the film.

摘要翻译： 从容器中去除密封膜的方法包括使用具有固定的下颌和移动上颚的夹持装置，并且包括执行以下步骤：第一夹紧步骤，其中夹持装置夹紧从所述夹子 容器的圆角; 夹持装置仅分离位于圆角处的胶片的一部分的部分脱离的步骤; 调整步骤，其中移动上颚远离固定下颚并且夹持装置移动，以便在两个颚之间捕获更大的薄膜表面; 第二夹持步骤，其中上钳口降低并锁定下钳口以夹持膜的表面，以及完全拆卸步骤，其中夹持装置执行膜的完全分离。

公开(公告)号：US20130240127A1

公开(公告)日：2013-09-19

申请号：US13780337

申请日：2013-02-28

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Daisuke YAMASHITA

IPC分类号： H01L21/48

CPC分类号： H01L21/48 ,  H01L21/6836 ,  Y10T156/12 ,  Y10T156/15 ,  Y10T156/1944 ,  Y10T156/1989

摘要： An aspect of the present embodiment, there is provided a method for fabricating a semiconductor device including placing a semiconductor substrate, onto which a BSG tape bonded via a supporting substrate, on a stage placed a peeling tape in a state that an adhesive surface of the peeling tape is oriented upwards and the BSG tape is oriented downwards to the stage, bonding the peeling tape onto the BSG tape in a state that the BSG tape is retained to be oriented downwards and placed on the adhesive surface of the peeling tape, drawing the peeling tape to a lower side of the stage to peel the peeling tape in a state that the peeling tape is retained to be bonded onto the BSG tape, and supporting the supporting substrate exposed from the BSG tape in the drawing of the peeling tape.

摘要翻译： 本实施例的一个方面，提供了一种制造半导体器件的方法，包括将通过支撑衬底接合的BSG带放置在其上的状态下放置在剥离带上的半导体衬底的状态， 剥离胶带向上取向，并且BSG胶带向下定向到舞台，将剥离胶带粘合到BSG胶带上，使其在保持BSG胶带以向下取向并放置在剥离胶带的粘合剂表面上的状态下， 将剥离带剥离到台阶的下侧，以剥离剥离带保持粘合到BSG带上的状态剥离剥离带，并且在剥离带的附图中支撑从BSG带露出的支撑基板。