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    Electronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging means
    51.
    发明授权
    Electronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging means 失效
    电子部件包装装置，以及使用电子部件包装机构供给电子部件的供给机构和方法

    公开(公告)号：US5368193A

    公开(公告)日：1994-11-29

    申请号：US993734

    申请日：1992-12-17

    Applicant: Tetsuo Takahashi ,  Shinichi Araya ,  Kuniaki Takahashi ,  Kunio Mogi ,  Koji Kudo ,  Takeshi Ito ,  Hiroshi Ikeda

    Inventor： Tetsuo Takahashi ,  Shinichi Araya ,  Kuniaki Takahashi ,  Kunio Mogi ,  Koji Kudo ,  Takeshi Ito ,  Hiroshi Ikeda

    IPC: H05K13/00 ,  H05K13/04 ,  B65G59/00

    CPC classification number: H05K13/0434 ,  H05K13/0084 ,  Y10T29/53261

    Abstract: Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at an upper position when the case is supported on the base, the outlet being faced upward, above which outlet the mounting head is adapted to wait. Also, an electronic component supply mechanism for and a method of supplying electronic components to the mounting head by using the packaging case are disclosed.

    Abstract translation: 电子部件包装盒包括基本上为板状的主体，该主体具有形成在其内部的基本螺旋形通道，形成在其中的线性通道，作为所述黑色通道的最外圆形部分的延续部，其中形成为所述直线通道 与身体的外部连通，在螺旋通道中一排地容纳的多个电子部件，以及用于促进电子部件沿着螺旋通道转移到出口的多个进气口，进气口为 在壳体内以螺旋形通道的各圆形部分和壳体外部连通的方式形成在壳体内，该壳体适于支撑在电子部件供应机构的基座上，其身体站在基座上， 该壳体用作电子部件供应源，该出口形成在壳体的一部分 当壳体被支撑在基座上时位于上部位置的主体，出口面向上方，安装头的出口适于在其上方等待。 此外，公开了一种电子部件供给机构，以及通过使用包装盒向安装头供给电子部件的方法。

    Recording apparatus
    57.
    发明授权
    Recording apparatus 失效
    记录装置

    公开(公告)号：US4467331A

    公开(公告)日：1984-08-21

    申请号：US335287

    申请日：1981-12-28

    Applicant: Teruo Tsutsumi ,  Tetsuo Takahashi

    Inventor： Teruo Tsutsumi ,  Tetsuo Takahashi

    IPC: G03G15/22 ,  G03G15/00 ,  H04N1/00 ,  H04N1/29 ,  G01D9/00 ,  G01D15/06

    CPC classification number: H04N1/00631 ,  H04N1/00567 ,  H04N1/00676 ,  H04N1/29

    Abstract: A recording apparatus includes a recording section for sequentially recording reception signals on a continuous, unused recording paper, starting with one end thereof, a cutter for cutting the recording paper to a predetermined length after the recording of the recording paper portion is completed, a developing device for causing a latent image on the recording paper so cut to be developed into a visual image, and a fixing device for causing the visual image to be fixed as a permanent image. In the recording apparatus, a recording paper travelling path is provided which includes a diagonally upward travelling path along which the recording section and cutter are arranged, a first turning travelling path arranged at the exit side of the diagonally upward travelling path to permit the turning of a direction to be effected through a gradual curving guide member, a horizontal travelling path extending horizontally from the exit end of the first turning travelling path and along which the developing device and fixing device are arranged, and a second turning travelling path extending from the exit end of the horizontal travelling path to permit the turning of a direction to be effected through a gradually curving guide member. The recording paper is delivered from the second turning travelling path and stacked horizontally onto a stacker.

    Abstract translation: 记录装置包括：记录部分，用于在连续的未使用的记录纸上从其一端开始顺序地记录接收信号;在记录纸部分的记录完成之后用于将记录纸切割成预定长度的切割器， 用于使所述切割的所述记录纸上的潜像导致视觉图像的装置，以及用于使所述视觉图像固定为永久图像的定影装置。 在记录装置中，设置有记录纸行进路径，其包括布置有记录部分和切割器的对角向上行进路径，布置在对角线向上行进路径的出口侧的第一转动行进路径，以允许转动 通过逐渐弯曲引导构件实现的方向，从第一转动行进路径的出口端水平延伸并且布置有显影装置和定影装置的水平行进路径，以及从出口延伸的第二转动行进路径 水平行进路径的端部，以允许通过逐渐弯曲的引导构件转动要实现的方向。 记录纸从第二转动行进路径传送并水平堆叠在堆垛机上。

    Machine for inserting electronic components
    58.
    发明授权
    Machine for inserting electronic components 失效
    电子元器件插入机

    公开(公告)号：US4294000A

    公开(公告)日：1981-10-13

    申请号：US34014

    申请日：1979-04-27

    Applicant: Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito ,  Akihiro Kato

    Inventor： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane ,  Tetsuro Ito ,  Akihiro Kato

    IPC: H05K13/02 ,  B23P21/00 ,  B65G1/00 ,  H05K13/00 ,  H05K13/04 ,  H05K3/32

    CPC classification number: B65G1/00 ,  H05K13/0417 ,  Y10T29/5142 ,  Y10T29/5149 ,  Y10T29/515 ,  Y10T29/53183

    Abstract: An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device. A transfer device includes a reciprocating unit for producing reciprocative movements between the cutter and the lead holding and guiding device and an electronic component holding device for holding a lead of the electronic component to be separated by the cutter and transferring the component to the lead holding and guiding device after such component has been separated by the cutter.

    Abstract translation: 一种用于处理并将平行的铅电子部件从电子元件幅材载体插入到印刷电路板中的引线接收开口的机器的插入装置的插入子组件包括可滑动地安装在框架上的第一滑块装置。 安装在框架上的驱动器驱动第一滑块装置。 可滑动地安装在框架上的第二滑动装置与第一滑块装置的运动协调，并且包括用于保持和引导电子部件的引线保持和引导装置和用于将部件从预定位置移动到下面的插入位置的推杆 控制引线保持和引导装置。 安装在框架上的进给装置通过间歇驱动来驱动，以间歇地间歇地供给电子部件腹板载体。 切割器将一个电子元件与由馈送装置馈送的电子元件幅材载体分开。 传送装置包括：往复运动单元，用于在切割器和引线保持引导装置之间产生往复运动;以及电子部件保持装置，用于保持要由切割器分离的电子部件的引线并将部件传送到引线保持件， 在这种部件已经被切割器分离之后的引导装置。

    Field plate configuration of a semiconductor device
    60.
    发明授权
    Field plate configuration of a semiconductor device 有权
    半导体器件的场板配置

    公开(公告)号：US09349811B2

    公开(公告)日：2016-05-24

    申请号：US13619565

    申请日：2012-09-14

    Applicant: Tetsuo Takahashi

    Inventor： Tetsuo Takahashi

    IPC: H01L29/15 ,  H01L29/40 ,  H01L29/739 ,  H01L29/06 ,  H01L29/08

    CPC classification number: H01L29/7397 ,  H01L21/2253 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/063 ,  H01L29/0638 ,  H01L29/0834 ,  H01L29/404 ,  H01L29/4916 ,  H01L29/7395

    Abstract: A semiconductor device includes a semiconductor substrate having a principal surface, and an insulating film formed on the principal surface and continuously covering a top surface of a first boundary region and a top surface of a second boundary region, the first boundary region including a boundary between a well layer and a RESURF layer, the second boundary region including a boundary between the RESURF layer and a first impurity region. The semiconductor device further includes a plurality of lower field plates formed in the insulating film in such a manner that the plurality of lower field plates do not lie directly above the first and second boundary regions, and a plurality of upper field plates formed on the insulating film in such a manner that the plurality of upper field plates do not lie directly above the first and second boundary regions.

    Abstract translation: 半导体器件包括具有主表面的半导体衬底和形成在主表面上并连续覆盖第一边界区域的顶表面和第二边界区域的顶表面的绝缘膜，所述第一边界区域包括第一边界区域 阱层和RESURF层，第二边界区域包括RESURF层和第一杂质区域之间的边界。 半导体器件还包括形成在绝缘膜中的多个下场板，使得多个下场板不直接位于第一和第二边界区域上方，并且多个上场板形成在绝缘层上 膜以这样的方式使得多个上场板不直接位于第一和第二边界区域上方。

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