Pluggable optical transceiver with highly shielded structure
    52.
    发明申请
    Pluggable optical transceiver with highly shielded structure 有权
    具有高度屏蔽结构的可插拔光收发器

    公开(公告)号:US20050281514A1

    公开(公告)日:2005-12-22

    申请号:US11115392

    申请日:2005-04-27

    摘要: The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield gasket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

    摘要翻译: 本发明是提供一种智能可插拔收发器,通过简单的机制改善EMI容限。 本发明的光收发器包括上和下壳体(11,12),保持器(81),光学组件(51,61),盖子(14),基底(15)和把手(13)。 所述光学组件通过插入所述导电弹性构件与所述保持器一起固定在所述上壳体和下壳体上。 虽然基板的后端暴露在收发器外部,屏蔽垫片和基板上的接地图案屏蔽了基板和上壳体之间以及基板和盖之间的接触部分。 此外,安装在下壳体中的把手和闩锁杆,弹性件实现与主机系统的收发器的锁定/释放机构。

    Optical module
    53.
    发明授权
    Optical module 失效
    光模块

    公开(公告)号:US06863451B2

    公开(公告)日:2005-03-08

    申请号:US10445810

    申请日:2003-05-28

    摘要: This invention provides an optical module with a hot-pluggable configuration in which a mechanical stress induced by the difference of the thermal co-efficient of the wiring substrate and the housing of the module, whereby the reliability of the module is enhanced. The optical module of the invention comprises tow optical sub-assemblies 12, 14, a wiring substrate 18, a housing 20, and holder 22. The housing includes a front space in which the sub-assemblies are enclosed and a rear space enclosing the wiring substrate. The holder has a resilient portion for pressing the wiring substrate against the rear space of the housing. A stopper is provided on the partition wall between the front space and the rear space of the housing, to which the wiring substrate is pressed.

    摘要翻译: 本发明提供了一种具有热插拔结构的光学模块,其中由布线基板和模块的壳体的热系数的差异引起的机械应力,从而提高了模块的可靠性。 本发明的光学组件包括丝束光学子组件12,14,布线基板18,壳体20和保持件22.壳体包括前部空间,子组件被封闭在其中,后部空间包围布线 基质。 保持器具有用于将布线基板压靠在壳体的后部空间上的弹性部分。 在壳体的前部空间和后部空间之间的分隔壁上设置有止动件,对该布线基板进行按压。

    Optical communication module
    54.
    发明授权
    Optical communication module 失效
    光通信模块

    公开(公告)号:US06808321B2

    公开(公告)日:2004-10-26

    申请号:US10230399

    申请日:2002-08-29

    IPC分类号: G02B638

    摘要: The present invention provides an optical module in which the level of the lead frame coincides with the optical axis of the fiber. The module 1 comprises a container 4, a subassembly 2 and a lead frame 6. The subassembly includes a substrate, on which the semiconductor optical device and the optical fiber are mounted. The lead frame has a pair of fixing bar and inner leads. The fixing bars extend along a first direction and attach to regions on the container. Respective inner leads extend along a second direction intersecting the first direction and have tips facing to respective fixing bars.

    摘要翻译: 本发明提供了一种光学模块,其中引线框架的高度与光纤的光轴重合。 模块1包括容器4,子组件2和引线框架6.子组件包括其上安装半导体光学器件和光纤的衬底。 引线框架有一对固定杆和内部引线。 固定杆沿着第一方向延伸并附接到容器上的区域。 相应的内引线沿着与第一方向相交的第二方向延伸并且具有面向相应固定杆的尖端。

    Transmitter/receiver for optical parallel transmission and board for optical module
    55.
    发明授权
    Transmitter/receiver for optical parallel transmission and board for optical module 失效
    用于光学并行传输的发射器/接收器和用于光学模块的板

    公开(公告)号:US06599032B1

    公开(公告)日:2003-07-29

    申请号:US09623094

    申请日:2000-10-10

    IPC分类号: G02B636

    摘要: An optical parallel transmission receiver in which a plurality of light-receiving elements and a plurality of optical fibers are optically coupled via guide pins (1) includes a pair of guide pins (1), a fiber holding means (2) for holding the pair of guide pins in parallel and holding the plurality of optical fibers between the pair of guide pins (1) at a predetermined interval, and a light-receiving element holding means for holding the plurality of light-receiving elements between the pair of guide pins (1) and holding one end of each of the pair of guide pins (1) so as to make a plane including light-receiving surfaces of the light-receiving elements perpendicular to longitudinal axes of the guide pins (1). The fiber holding means (2) and light-receiving element holding means (3) are integrally held by resin molding.

    摘要翻译: 一种光学并行传输接收器,其中多个光接收元件和多个光纤经由引导销(1)光学耦合,包括一对引导销(1),用于保持该对的光纤保持装置(2) 并且以预定的间隔将所述多个光纤保持在所述一对引导销(1)之间;以及光接收元件保持装置,用于将所述多个光接收元件保持在所述一对引导销之间( 1)并且保持一对引导销(1)中的每一个的一端,以使包括光接收元件的光接收表面垂直于引导销(1)的纵向轴线的平面。 光纤保持装置(2)和光接收元件保持装置(3)通过树脂模制一体地保持。

    Optical module, method of manufacturing the same, and sleeve
    57.
    发明授权
    Optical module, method of manufacturing the same, and sleeve 失效
    光模块,制造方法及套筒

    公开(公告)号:US5475783A

    公开(公告)日:1995-12-12

    申请号:US314652

    申请日:1994-09-29

    申请人: Hiromi Kurashima

    发明人: Hiromi Kurashima

    IPC分类号: G02B6/38 G02B6/42 G02B6/30

    摘要: An optical module comprises a plastic package constituted by a package main body and a cover, sleeves formed integrally with the package main body, a circuit board held in the package main body, light-activated elements fixed at predetermined positions of the circuit board, three projections formed integrally with an inner surface of the package main body and brought into contact with a periphery of the circuit board to position the circuit board, springs formed integrally with an inner surface of the package to press the periphery of the circuit board against the projections. Since the sleeve and the package main body are integrally formed by plastic molding, the number of components is reduced, thereby simplifying the assembling steps.

    摘要翻译: 光学模块包括由封装主体和盖构成的塑料封装,与封装主体一体形成的套筒,保持在封装主体中的电路板,固定在电路板的预定位置的光激活元件,三个 突起与封装主体的内表面一体地形成并与电路板的周边接触以定位电路板,与封装的内表面一体形成的弹簧将电路板的周边压靠在突起上 。 由于套筒和包装主体通过塑料成型一体形成,因此部件数量减少,从而简化组装步骤。