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公开(公告)号:US11190837B2
公开(公告)日:2021-11-30
申请号:US16431886
申请日:2019-06-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jiwoong Choi , Hyunsoo Choi , Minsoo Kim , Sungjin Kim , Younguk Kim , Ilkoo Kim , Hyunhan Kim
IPC: H04N21/44 , H04N21/439 , H04N21/234 , H04N21/442 , H04N5/14 , H04N21/434
Abstract: An electronic apparatus is provided. The electronic apparatus includes a memory configured to store computer executable instructions, an interface, a display, and a processor configured to, by executing the computer executable instructions control the display to display an image corresponding to a broadcasting content input through the interface, based on a mute interval being detected by analyzing an input signal, compare a signal before the mute interval with a signal after the mute interval and identify whether the signals before and after the mute interval are continuous, and identify an occurrence of a channel change event in which the broadcasting content is changed to another broadcasting content based on the identification.
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公开(公告)号:US11184679B2
公开(公告)日:2021-11-23
申请号:US16584017
申请日:2019-09-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Minsoo Kim , Taekwon Chang , Jaehyun Park
IPC: H04N21/482 , H04N21/466 , H04N21/435 , H04N21/8405 , G06K9/62 , G06T7/70 , H04N21/44 , G10L15/18 , G10L15/22
Abstract: An electronic apparatus and a method for controlling the same are disclosed. The method for controlling an electronic apparatus includes acquiring multimedia content including a plurality of image frames, acquiring information related to the multimedia content, selecting at least one image frame including an object related to the acquired information among objects included in the plurality of image frames, generating description information for the at least one selected image frame based on the acquired information, and acquiring description information for the multimedia content based on the generated description information. Thus, the electronic apparatus may generate description information for more elaborate scene analysis regarding multimedia content.
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公开(公告)号:US11159891B2
公开(公告)日:2021-10-26
申请号:US16684661
申请日:2019-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungho Kim , Minsoo Kim , Jinwan An
Abstract: Provided is an electronic device. The electronic device may include: a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a first space between the front plate and the rear plate; a display panel exposed to an exterior of the electronic device through the front plate and configured to detect a pen input using a magnetic field; a speaker structure disposed between the display panel and the rear plate, and including a first surface facing the display panel, a second surface facing in a direction opposite the display panel, a side surface surrounding a second space between the first surface and the second surface, and a yoke facing the first surface; and a first shield structure made of a ferromagnetic material and disposed on the first surface.
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公开(公告)号:US11105547B2
公开(公告)日:2021-08-31
申请号:US16962350
申请日:2019-01-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Myungseob Song , Minsoo Kim , Jinkook Yoon , Jinseung Choi
Abstract: Disclosed is an ice making device that is able to selectively make ices having different transparencies from each other. The ice making device includes: an ice making chamber including an ice making container to accommodate ice making water therein; a cooler configured to supply cool air to the ice making chamber to cool the ice making water; an ice making fan configured to circulate the supplied cool air; an ice making heater configured to supply heat to the ice making water when the ice making water is cooled; and a controller configured to control at least one of the cooling unit, the ice making fan and the ice making heater to adjust a rate of change of temperature of the ice making container to generate one of two types of ice having different transparency.
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公开(公告)号:US10996772B2
公开(公告)日:2021-05-04
申请号:US16547800
申请日:2019-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyukjin Jung , Minsoo Kim , Jinman Kim , Kwangho Shin , Jinwan An
Abstract: An electronic device includes a housing that includes a first end portion and a second end portion, a pen tip that is disposed at the first end portion, a first coil that is disposed in the housing adjacent to the first end portion, is wound around an axis of the housing, and includes a first conductive line of a first length, and a second coil that surrounds the first coil, is wound around the axis of the housing, and includes a second conductive line of a second length shorter than the first length.
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公开(公告)号:USD847019S1
公开(公告)日:2019-04-30
申请号:US29600866
申请日:2017-04-17
Applicant: Samsung Electronics Co., Ltd.
Designer: Minsoo Kim
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公开(公告)号:USD846438S1
公开(公告)日:2019-04-23
申请号:US29600859
申请日:2017-04-17
Applicant: Samsung Electronics Co., Ltd.
Designer: Minsoo Kim
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公开(公告)号:USD822017S1
公开(公告)日:2018-07-03
申请号:US29587467
申请日:2016-12-13
Applicant: Samsung Electronics Co., Ltd.
Designer: Kyunghan Noh , Minsoo Kim , Jiwoong Hwang
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公开(公告)号:USD749580S1
公开(公告)日:2016-02-16
申请号:US29527549
申请日:2015-05-20
Applicant: Samsung Electronics Co., Ltd.
Designer: Minsoo Kim , Yongseok Bang , Jinsoo Kim
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60.
公开(公告)号:US20250167174A1
公开(公告)日:2025-05-22
申请号:US18737484
申请日:2024-06-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yunseok YANG , Yunsang Lee , Minsoo Kim , Jaewoo Shin , Minhwan An , Yunkyeong Jeong , Jinsuk Chung
IPC: H01L25/065 , H01L23/00 , H01L23/28 , H01L23/48 , H01L23/498 , H10B80/00
Abstract: A semiconductor package includes a plurality of first semiconductor chips sequentially stacked in a vertical direction, and connected to each other via a plurality of first through electrodes, each of the plurality of first semiconductor chips having a first width in a horizontal direction, a second semiconductor chip under the plurality of first semiconductor chips, and connected to the plurality of first semiconductor chips via a plurality of second through electrodes, the second semiconductor chip having a second width in the horizontal direction, the second width being greater than the first width, a redistribution layer under the second semiconductor chip, the redistribution layer having a third width in the horizontal direction, the third width being substantially equal to the second width, and a plurality of first connection bumps between the second semiconductor chip and the redistribution layer.
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