-
公开(公告)号:US12284481B2
公开(公告)日:2025-04-22
申请号:US17302714
申请日:2021-05-11
Applicant: QUALCOMM Incorporated
Inventor: Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Nicholas Ian Buchan , Yipeng Lu , Kostadin Dimitrov Djordjev
Abstract: A mobile device includes one or more piezoelectric polymer layers underlying a display. The one or more piezoelectric polymer layers may be electrically driven to operate in either a d33 stretching mode or a d31 bending mode. The mobile device functions as an ultrasonic sensor in the d33 stretching mode and as an audio speaker/microphone or a proximity sensor in the d31 bending mode. The piezoelectric polymer layer operating in the d31 bending mode may be directly mechanically coupled to a display, indirectly mechanically coupled to the display and underlying an ultrasonic sensor stack, or integrated in the ultrasonic sensor stack. Signal performance of the piezoelectric polymer layer operating in the d31 bending mode may be enhanced or modulated by having a larger area, multiple layers, bi-pole or uni-pole driving with multiple layers, one or more stiff adhesives, a spacer layer, one or more mass features, a thin TFT layer, a thick piezoelectric polymer layer, or combinations thereof.
-
公开(公告)号:US12217530B2
公开(公告)日:2025-02-04
申请号:US18302241
申请日:2023-04-18
Applicant: QUALCOMM Incorporated
Inventor: Shiang-Chi Lin , Hrishikesh Vijaykumar Panchawagh , Jessica Liu Strohmann , Yipeng Lu , Chin-Jen Tseng , Kostadin Dimitrov Djordjev , Min-Lun Yang , Chia-Wei Yang
Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.
-
公开(公告)号:US12183113B2
公开(公告)日:2024-12-31
申请号:US17247734
申请日:2020-12-21
Applicant: QUALCOMM Incorporated
Inventor: Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Yipeng Lu , Chin-Jen Tseng , Kostadin Dimitrov Djordjev
Abstract: Various aspects of the present disclosure relate generally to ultrasonic fingerprint sensor. In some aspects, a device may include a flexible display. The device may include an ultrasonic fingerprint sensor that is configured to transmit and receive an ultrasonic signal in an acoustic path through the flexible display. The device may include an acoustics configuration layer that is situated between the display and the ultrasonic fingerprint sensor. The acoustics configuration layer may be configured to optimize a signal strength of the ultrasonic signal based at least in part on a configuration of one or more layers of the flexible display. Numerous other aspects are provided
-
54.
公开(公告)号:US11823483B2
公开(公告)日:2023-11-21
申请号:US17448031
申请日:2021-09-17
Applicant: QUALCOMM Incorporated
Inventor: Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Nai-Kuei Kuo , Yipeng Lu , Ali Lopez , Kostadin Dimitrov Djordjev
CPC classification number: G06V40/1306 , G06F21/32 , H03H9/17
Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.
-
公开(公告)号:US20230177863A1
公开(公告)日:2023-06-08
申请号:US18103060
申请日:2023-01-30
Applicant: QUALCOMM Incorporated
Inventor: Hrishikesh Vijaykumar Panchawagh , IIa Ravindra Badge , Yipeng LU , Kostadin Dimitrov Djordjev , Suryaprakash Ganti , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Leonard Eugene Fennell , Firas Sammoura , Jessica Liu Strohmann , David William Burns
CPC classification number: G06V40/1306 , G01S15/8925 , G01S7/52079 , B06B1/0677 , G01S15/8913 , H10K59/00 , H10K59/65 , H10K77/111
Abstract: Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.
-
公开(公告)号:US11438703B2
公开(公告)日:2022-09-06
申请号:US16455472
申请日:2019-06-27
Applicant: QUALCOMM Incorporated
Inventor: Yuri Kusano , Yipeng Lu , Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh
Abstract: An ultrasonic sensor array includes a plurality of ultrasonic transducers, each transducer including a piezoelectric member. Each of the transducers includes an electret member, a receive (Rx) layer configured to exhibit a first d33 resonating mode coefficient and a transmit (Tx) layer configured to exhibit a second d33 resonating mode coefficient, the first coefficient being different from the second coefficient. The transducers are disposed on a flexible substrate.
-
公开(公告)号:US11182026B2
公开(公告)日:2021-11-23
申请号:US16854495
申请日:2020-04-21
Applicant: QUALCOMM Incorporated
Inventor: Yue Liang , Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Jessica Liu Strohmann , Changting Xu
Abstract: An example method of operation may include detecting a user touch in a first area based upon sensor data from one or more sensors of a first type, waking up one or more sensors of a second type configured to measure across some or all of the first area in response to the detecting, obtaining additional sensor data from the one or more sensors of the second type, and determining a location associated with the user touch based in part upon the sensor data from the one or more sensors of the second type.
-
公开(公告)号:US11126814B2
公开(公告)日:2021-09-21
申请号:US16525030
申请日:2019-07-29
Applicant: Qualcomm Incorporated
Inventor: Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Jae Hyeong Seo , Nicholas Ian Buchan , Chin-Jen Tseng , Tsongming Kao
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a flexible substrate. The ultrasonic fingerprint sensor system may include a film stack disposed on the flexible substrate that provides acceptable acoustic coupling for fingerprint sensing. The ultrasonic fingerprint sensor system includes a high acoustic impedance layer in an acoustic path of ultrasonic waves through a display. The high acoustic impedance layer can be electrically conductive or electrically nonconductive. In some implementations, the ultrasonic fingerprint sensor system includes an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
-
公开(公告)号:US11062010B2
公开(公告)日:2021-07-13
申请号:US16655039
申请日:2019-10-16
Applicant: QUALCOMM Incorporated
Inventor: Soon Joon Yoon , Changting Xu , Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev
Abstract: A method may involve controlling an apparatus to transmit a first ultrasonic wave by sending first electrical signals to a plurality of separate electrode elements proximate an ultrasonic transceiver layer. The method may involve receiving first electrode layer signals, corresponding to reflections of the first ultrasonic wave, from the electrode layer. The method may involve determining, based on the first electrode layer signals, a location of a target object in contact with the apparatus. The location of the target object may correspond with a proximate electrode element. The method may involve controlling the ultrasonic transceiver layer to transmit a second ultrasonic wave by sending second electrical signals to the proximate electrode element and for receiving receiver pixel signals from at least a portion of the plurality of ultrasonic receiver pixels in an area corresponding with the proximate electrode element.
-
公开(公告)号:US20210073511A1
公开(公告)日:2021-03-11
申请号:US16751849
申请日:2020-01-24
Applicant: QUALCOMM Incorporated
Inventor: Nicholas Ian Buchan , Sandeep Louis D'Souza , Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh
Abstract: An apparatus may include an ultrasonic sensor system, a low-frequency vibration source and a control system. The ultrasonic sensor system may include an ultrasonic receiver and an ultrasonic transmitter configured for transmitting ultrasonic waves in a first frequency range (e.g., 1 MHz to 30 MHz). The low-frequency vibration source may be configured for generating low-frequency vibrations in a second frequency range (e.g., the range of 5 Hz to 2000 Hz). The control system may be configured for synchronizing the generation of the first low-frequency vibrations and the transmission of the first ultrasonic waves.
-
-
-
-
-
-
-
-
-