公开(公告)号：US11438703B2

公开(公告)日：2022-09-06

申请号：US16455472

申请日：2019-06-27

Applicant: QUALCOMM Incorporated

Inventor： Yuri Kusano ,  Yipeng Lu ,  Jessica Liu Strohmann ,  Hrishikesh Vijaykumar Panchawagh

IPC: H04R17/00 ,  H04R31/00 ,  G06F3/041 ,  G06F3/043 ,  G06V40/13

Abstract: An ultrasonic sensor array includes a plurality of ultrasonic transducers, each transducer including a piezoelectric member. Each of the transducers includes an electret member, a receive (Rx) layer configured to exhibit a first d33 resonating mode coefficient and a transmit (Tx) layer configured to exhibit a second d33 resonating mode coefficient, the first coefficient being different from the second coefficient. The transducers are disposed on a flexible substrate.