Abstract:
An image capture unit includes an image sensor and a lens structure disposed proximate to the image sensor to focus an image onto the image sensor. A movable color filter grouping is disposed over the lens structure. The movable color filter grouping includes a plurality of N color filters arranged therein such that all light that is incident upon the image sensor through the lens structure is directed through only one of the plurality of N color filters of the movable color filter grouping per each exposure of the image sensor. A positioning device is attached to the movable color filter grouping to reposition the movable color filter grouping such that substantially all of the light that is incident upon the image sensor through the lens structure is directed through a different one of the plurality of N color filters for each successive exposure of the image sensor.
Abstract:
A wafer-level lens system includes a first substrate, a first lens having a planar surface in contact with the first substrate and a concave aspheric surface, a second substrate, a second lens having a convex aspheric surface facing the first lens and a planar surface in contact with the second substrate, a third lens having a planar surface in contact with the second substrate and a concave aspheric surface, a third substrate, a fourth lens having a convex aspheric surface facing the third lens and a planar surface in contact with the third substrate, and a fifth lens having a planar surface in contact with the third substrate and a concave aspheric surface.
Abstract:
A multichannel endoscope system includes a light module configured to emit illumination light on an object, an image module configured to capture an image of the object, and a multichannel sensor module configured to obtain a spectral information of the object. The multichannel sensor module includes an image lens, a light homogenizer and a multichannel array sensor, where the light homogenizer is formed between the multichannel array sensor and the image lens.
Abstract:
A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
Abstract:
A method includes capturing an image from a scene with an image sensor. The image sensor has a plurality of spectral pixels and a plurality of image pixels. The method also includes collecting gathered data from the spectral-imaging array based on the light received. The gathered data is separated into spectral pixel data and image pixel data. The spectral pixel data is provided by the spectral pixels and the image pixel data is provided by the image pixels. The method includes both generating spectral information of the image based on the spectral pixel data and generating image information of the image based on the image pixel data.
Abstract:
A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
Abstract:
A four-surface, near-infrared wafer-level lens system for imaging a scene onto an image plane includes (a) a first wafer-level lens having a first convex lens surface facing the scene and a second concave lens surface facing the image plane, and (b) a second wafer-level lens disposed between the first wafer-level lens and the image plane and including a third concave lens surface facing the scene and a fourth aspheric convex lens surface facing the image plane. The four-surface, near-infrared wafer-level lens system is further characterized by an image resolution corresponding to at least 60% contrast of 2 line pairs per millimeter in object plane across a scene portion having at least 10 millimeters extent in the object plane.
Abstract:
A wide-angle lens system comprises a first lens having a concave aspheric surface and a planar surface, a second lens having a convex aspheric surface and a planar surface, a substrate, wherein the planar surface of the first lens is adjacent to a first side of the substrate and the planar surface of the second lens is adjacent to a second side of the substrate, a third lens behind the second lens having a concave aspheric surface and a planar surface, and a stop disposed between the first lens and the substrate. The planar surface of the third lens is secured to an outermost surface of an image sensor.
Abstract:
A four-element athermal lens includes four coaxially aligned lenses including a (i) first lens and, in order of increasing distance therefrom and on a same side thereof, (ii) a second lens, a third lens, and a fourth lens. The first lens and the second lens are positive lenses. The third and fourth lenses are negative lenses. The first lens, second lens, third lens, and fourth lens have equal respective refractive indices n1, n2, n3, and n4. A difference between (i) the maximum of n1, n2, n3, and n4 and (ii) the minimum of n1, n2, n3, and n4 being less than 0.05 in a free-space wavelength range. Refractive indices n1, n2, n3, and n4 have respective temperature dependences Δ n 1 Δ T , Δ n 2 Δ T , Δ n 3 Δ T , Δ n 4 Δ T . Each of Δ n 1 Δ T and Δ n 2 Δ T exceeds, in the free-space wavelength range, each of Δ n 3 Δ T and Δ n 4 Δ T by a factor between 2.05 and 2.85, inclusive.
Abstract:
A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.