FIXTURE, TRAY AND SPUTTERING SYSTEM

    公开(公告)号:US20220186359A1

    公开(公告)日:2022-06-16

    申请号:US17485170

    申请日:2021-09-24

    IPC分类号: C23C14/50

    摘要: A fixture, a tray and a sputtering system. The fixture is internally provided with a support structure and a clamping structure connected with each other, wherein the clamping structure is configured to clamp a to-be-sputtered substrate; an orthographic projection of the clamping structure on a plane where the support structure is located and the support structure share an superimposed area and are separate in non-superimposed areas; wherein the support structure located in the non-superimposed area and/or the clamping structure located in the non-superimposed area has a first hollowed structure. The fixture is internally provided with the first hollowed structure, such that a part of an area of the to-be-sputtered substrate covered by the fixture may be exposed via the first hollowed structure when the fixture holds the to-be-sputtered substrate, so as to reduce the area of the to-be-sputtered substrate covered by the fixture.

    ARRAY SUBSTRATE, PREPARATION METHOD THEREOF AND DISPLAY PANEL

    公开(公告)号:US20190123069A1

    公开(公告)日:2019-04-25

    申请号:US16166356

    申请日:2018-10-22

    摘要: The present disclosure relates to array substrate, preparation method thereof and display panel. An array substrate comprises: a first thin film transistor and a second thin film transistor over a substrate; wherein the first thin film transistor comprises a first portion of a first insulating layer, the first insulating layer comprises a first recess corresponding to the second thin film transistor, and the second thin film transistor is located in the first recess; and wherein a thickness of a second portion of the first insulating layer, which is below the bottom of the first recess, is smaller than that of the first portion of the first insulating layer.