Organic light-emitting display substrate, manufacturing method thereof, and organic light-emitting display device

    公开(公告)号:US11832498B2

    公开(公告)日:2023-11-28

    申请号:US17043358

    申请日:2020-03-09

    CPC classification number: H10K59/60 H10K59/38 H10K71/00

    Abstract: The present disclosure relates to an organic light-emitting display substrate, manufacturing method thereof, and organic light-emitting display device. The organic light-emitting display substrate includes a base and a plurality of sub-pixel structures on the base, the sub-pixel structure includes: a first protrusion including a photoelectric sensing device and a second protrusion including a color filter layer, a protrusion height of the first protrusion relative to the base being smaller than that of the second protrusion relative to the base; a planarization layer on the first and second protrusions, and in contact with the first and second protrusions, a material wettability of the planarization layer with respect to the surface of the first protrusion being greater than that with respect to the surface of the second protrusion; and a white organic light-emitting diode on the planarization layer, and emitting light towards the first and second protrusions.

    Bonding method
    58.
    发明授权

    公开(公告)号:US11533812B2

    公开(公告)日:2022-12-20

    申请号:US16825172

    申请日:2020-03-20

    Abstract: The disclosure provides a bonding method, the bonding method includes: bonding first areas of a plurality of flexible printed circuit boards on a substrate, the plurality of flexible printed circuit boards being sequentially arranged along a direction parallel to a first side of the substrate, and a second area of each of the flexible printed circuit boards exceeds the first side; cutting at least one of the flexible printed circuit boards to enable second sides of all the flexible printed circuit boards to be flush and parallel to the first side, wherein each of the second sides is a side of the second area away from the first area; and bonding second areas of the flexible printed circuit boards with a connection circuit board.

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