LED DEVICE AND BACKLIGHT MODULE
    52.
    发明申请

    公开(公告)号:US20200287106A1

    公开(公告)日:2020-09-10

    申请号:US16533060

    申请日:2019-08-06

    IPC分类号: H01L33/52 H01L27/15 H01L33/60

    摘要: Provided is a LED device and a backlight module. The LED device comprises a bracket, a LED chip and an encapsulation layer. A reflective cup is arranged on the bracket, and the LED chip is arranged in the reflective cup. The encapsulation layer encases and encapsulates the LED chip in the reflective cup, the encapsulation layer has a top surface of the encapsulation layer. The top surface of the encapsulation layer is located above a top surface of the reflective cup, and is a lens curved surface. In an on-state, the LED device has virtual cross sections passing through a geometrical center of the LED chip and perpendicular to a top surface of the bracket, in at least one of the virtual cross sections of the LED device, the LED device has luminous efficiency greater than or equal to 95% within a beam angle of at least 60°.

    LED DISPLAY UNIT GROUP AND DISPLAY PANEL
    53.
    发明申请

    公开(公告)号:US20190355294A1

    公开(公告)日:2019-11-21

    申请号:US15995248

    申请日:2018-06-01

    IPC分类号: G09G3/32 G09G3/34

    摘要: The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.

    TRIANGULAR-COMBINATION LED CIRCUIT BOARD, TRIANGULAR LED DEVICE AND DISPLAY

    公开(公告)号:US20180233492A1

    公开(公告)日:2018-08-16

    申请号:US15729119

    申请日:2017-10-10

    IPC分类号: H01L25/075 H01L33/62

    摘要: A triangular-combination LED circuit board, comprising a plurality of triangular LED units, wherein vertexes of every six of the LED units are superimposed to jointly form a hexagonal central point such that every six of the LED units form a hexagonal LED array; the LED unit includes a substrate and pads disposed on the substrate; the pads include die bond pads; and three die bond pads are provided, respectively disposed at three vertexes of the triangular LED units. In the present invention, triangular LED units are set to form triangular LED devices which can be more densely arrayed on a PCB, so an LED display with LED devices arrayed at a smaller distance is generated, and pixel definition is strengthened. Meanwhile, in an LED circuit board, the LED units are closely arranged in a hexagonal shape, so the utilization rate of materials can be enhanced; moreover, a plurality of LED units can be bored at one time at the central point of the hexagon, and finally the LED devices can be quickly obtained by simple cutting, thus effectively enhancing the processing efficiency and reducing production cost.

    LED display unit group and display panel

    公开(公告)号:US12100690B2

    公开(公告)日:2024-09-24

    申请号:US17281433

    申请日:2019-09-26

    摘要: Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.

    White light emitting device, light bar and light apparatus

    公开(公告)号:US11898712B2

    公开(公告)日:2024-02-13

    申请号:US17607045

    申请日:2019-12-12

    IPC分类号: F21S4/28 F21V9/30

    CPC分类号: F21S4/28 F21V9/30

    摘要: A white light emitting device, a light bar and a light apparatus. A relative spectrum of the white light emitting device is ϕ(λ). A relative spectrum of a black body radiation with a corresponding color temperature is S(λ). An area normalization is performed on ϕ(λ) and S(λ) to convert an equal energy spectrum ϕ′(λ) of the white light emitting device and an equal energy spectrum S′(λ) of the black body radiation with the corresponding color temperature. A degree of similarity R of the equal energy spectrum of the white light emitting device and the equal energy spectrum of the black body radiation satisfies the following formula:





    R
    =

    1
    -



    Σ

    λ





    i


    λ

    n








    S




    (
    λ
    )


    -


    Φ




    (
    λ
    )








    Σ

    λ

    i


    λ

    n





    S




    (
    λ
    )






    ,




    when λi is 380 nm, λn is 680 nm, R≥85%.