Abstract:
An inspection method and apparatus irradiates a sample on which a pattern is formed with an electron beam, so that an inspection image and a reference image can be generated on the basis of a secondary electron or a reflected electron emitted by the sample. An abnormal pattern is determined based on a difference in halftone values of each pixel between the inspection image and the reference image. A plurality of feature quantities of the abnormal pattern are obtained from an image of the abnormal pattern, and, based on the distribution of the plurality of feature quantities of the abnormal pattern, a range for classifying the type of the abnormal pattern is designated. Thus, a desired defect can be extracted from many defects extracted by inspection.
Abstract:
A method for measuring dimensions of minute structures on a substrate include irradiating primary electrons onto the minute structures, and detecting secondary electrons generated from the minute structures. Image data of the minute structures is formed, and at least two measuring regions are determined over the minute structures using the image data. The dimensions of the minute structures corresponding to the measuring regions are calculated. The primary electrons are provided from an electron emission member to the minute structures, and the secondary electrons are converted into current signals and then imaged in a displaying member. An operation member calculates the dimensions of the minute structures corresponding to the measuring regions using the image data of the minute structures stored in a storage member and measurement data that is measured at the measuring regions.
Abstract:
A scanning electron microscope has an electron gun for producing an electron beam, a specimen holder holding the specimen, an objective lens for sharply focusing the beam onto the specimen, and a power supply for applying a negative voltage to the specimen. A shielding plate made of a conductive material and having at least one hole for limiting the region of the specimen surface illuminated by the beam is mounted on the holder. A voltage almost equal to the voltage applied to the specimen is applied to the shielding plate.
Abstract:
A method and apparatus for use in monitoring a sample with a charged particle beam are presented. A mechanical displacement between a plane defined by the sample's surface and an optical axis defined by a beam directing arrangement is provided so as to orient the sample at a certain non-right angle null1 with respect to the optical axis. A primary charged particle beam propagating towards the sample is deflected so as to affect the trajectory of the primary charged particle beam to provide a certain non-zero angle null2 between the primary beam propagation axis and said optical axis.
Abstract:
One embodiment disclosed pertains to a method for inspecting a substrate. The method includes inserting the substrate into a holding place of a substrate holder, moving the substrate holder under an electron beam, and applying a voltage to a conductive element of the substrate holder. The voltage applied to the conductive element reduces a substrate edge effect. Another embodiment disclosed relates to an apparatus for holding a substrate that reduces a substrate edge effect. The apparatus includes a holding place for insertion of the substrate and a conductive element. The conductive element is positioned so as to be located within a gap between an edge of the holding place and an edge of the substrate.
Abstract:
An electron beam irradiation apparatus which irradiates an electron beam to an object for easily detecting a defect of a backscattered electron detector, including: an electron beam generating section for generating an electron beam; a plurality of backscattered electron detectors for detecting backscattered electrons generated when the electron beam is irradiated on a mark; a plurality of attenuation sections for attenuating signal values indicating quantity of backscattered electrons detected by the plurality of backscattered electron detectors; and a defect detecting section for detecting a defect of the plurality of backscattered electron detectors based on the signal values attenuated by the plurality of attenuation sections, with attenuation factors for the plurality of attenuation sections being varied.
Abstract:
A method for process monitoring includes receiving a sample having a first layer that is at least partially conductive and a second layer formed over the first layer, following production of contact openings in the second layer by an etch process, the contact openings including a plurality of test openings having different, respective transverse dimensions. A beam of charged particles is directed to irradiate the test openings. In response to the beam, at least one of a specimen current flowing through the first layer and a total yield of electrons emitted from a surface of the sample is measured, thus producing an etch indicator signal. The etch indicator signal is analyzed as a function of the transverse dimensions of the test openings so as to assess a characteristic of the etch process.
Abstract:
The invention relates to a raster electron microscope having a specimen chamber and a detector for electrons mounted in the specimen chamber. The raster electron microscope also includes a specimen table having a specimen holder and the specimen table is mounted in the specimen chamber. A diaphragm system is provided on the specimen table and has a diaphragm between the specimen holder and the detector. The diaphragm system is adjustable relative to the specimen holder. The invention can be configured especially as an ancillary module which is accommodated on the specimen table of a conventional raster electron microscope. The system of raster electron microscope and ancillary unit serves for generating special contrastings, especially a dark-field contrast in transmission.
Abstract:
Eliminating electricity of the specimen is performed by applying an acceleration voltage to an electron gun and applying primary electrons to a charged-up specimen from the electron gun. The maximum value of the acceleration voltages of the primary electrons applied in the past is adopted as electricity elimination start acceleration voltage. The acceleration voltage is gradually dropped from the electricity elimination start voltage so as to emit electrons charged on the specimen. The acceleration voltage is applied continuously until the specimen charged negatively becomes uncharged or is charged positively. A plurality of specimens are previously compared with respect to the acceleration voltage at which the secondary electron emission efficiency becomes 1 and electricity elimination termination voltage at which dropping the acceleration voltage is terminated is set to the minimum acceleration voltage or less.
Abstract:
According to the present invention, there are newly provided in a scanning electron microscope with an in-lens system a first low-magnification mode that sets the current of the object lens to be zero or in a weak excitation state, and a second low-magnification mode that sets the current of the object lens to be a value that changes in proportion to the square root of the accelerating voltage. The scanning electron microscope has a configuration wherein normal sample image (secondary electron image) observation is performed in the first low-magnification mode, and it switches the first low-magnification mode to the second low-magnification mode when X-ray analysis is performed. As a result, both sample image (secondary electron image) observation and X-ray analysis can be performed in low-magnification mode.