-
公开(公告)号：US4138267A
公开(公告)日：1979-02-06
申请号：US755030
申请日：1976-12-28
申请人： Yasunori Arisato , Hideaki Koriyama
发明人： Yasunori Arisato , Hideaki Koriyama
CPC分类号： C23C18/40
摘要： A composition for chemical copper plating having a pH of 12 to 14 and containing a boron hydride compound serving as a reducing agent, a water-soluble copper compound and a copper complexing agent, the composition being characterized in that the copper complexing agent is at least one of hydroxyalkyl-substituted ethylenediamines represented by the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are each unsubstituted lower alkyl or hydroxyl- and/or carboxyl-substituted lower alkyl, and at least one of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 is hydroxyl-substituted lower alkyl, and hydroxyalkyl-substituted diethylenetriamines represented by the formula ##STR2## wherein R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are the same or different and are each unsubstituted lower alkyl or hydroxyl-and/or carboxyl substituted lower alkyl, R.sub.9 is hydrogen or unsubstituted lower alkyl or hydroxyl-and/or carboxyl-substituted lower alkyl, and at least one of R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 is hydroxyl-substituted lower alkyl.
摘要翻译： 一种pH为12〜14，含有作为还原剂的氢化硼化合物的化学镀铜组合物，水溶性铜化合物和铜络合剂，其特征在于铜络合剂为至少 由式（I）表示的羟烷基取代的亚乙二胺之一，其中R 1，R 2，R 3和R 4相同或不同，并且各自为未取代的低级烷基或羟基和/或羧基取代的低级烷基，并且至少 R 1，R 2，R 3和R 4中的一个是羟基取代的低级烷基，和由式（II）表示的羟烷基取代的二亚乙基三胺，其中R 5，R 6，R 7和R 8相同或不同，并且各自为未取代的低级烷基 或羟基和/或羧基取代的低级烷基，R 9为氢或未取代的低级烷基或羟基和/或羧基取代的低级烷基，R 5，R 6，R 7，R 8和R 9中的至少一个为羟基取代的低级烷基 。
-
公开(公告)号：US4133908A
公开(公告)日：1979-01-09
申请号：US848001
申请日：1977-11-03
申请人： Bruce S. Madsen
发明人： Bruce S. Madsen
IPC分类号： C23C18/16 , C23C18/18 , C23C18/20 , C23C18/28 , C23C18/31 , C23C18/40 , G03C5/58 , H05K3/18 , C23C3/02 , G03C5/24
CPC分类号： C23C18/1612 , C23C18/1608 , G03C5/58 , H05K3/185
摘要： A method for depositing a metal on a surface is disclosed. The method comprises treating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal and a radiation-sensitive reducing agent for the salt to form a sensitized surface. The sensitized surface is exposed to a source of light radiation to reduce the metal salt to a reduced metal salt species. Either or both of the preceding sensitizing or radiation exposing steps is restricted to a selected pattern on the surface to form a catalytic real image capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The catalytic real image is treated with a stabilizer comprising (a) a reducing agent for the non-noble metal ions of said reducible salt, (b) a complexing agent and (c) an accelerator to at least stabilize the catalytic real image.
摘要翻译： 公开了一种在表面上沉积金属的方法。 该方法包括用包含至少一种非贵金属的可还原盐和用于该盐的辐射敏感还原剂的敏化溶液处理该表面以形成敏化表面。 致敏表面暴露于光辐射源，以将金属盐还原成还原的金属盐物质。 前述的敏化或辐射暴露步骤中的任何一个或两个被限制在表面上的选定图案，以形成能够从无电金属沉积溶液直接催化其上沉积金属的催化真实图像。 催化真实图像用稳定剂处理，所述稳定剂包括（a）用于所述可还原盐的非贵金属离子的还原剂，（b）络合剂和（c）促进剂以至少稳定催化真实图像。
-
公开(公告)号：US4131698A
公开(公告)日：1978-12-26
申请号：US861453
申请日：1977-12-16
申请人： Cheryl A. Deckert
发明人： Cheryl A. Deckert
CPC分类号： C23C18/22
摘要： A process for pretreating polyvinyl chloride plastics to form adherent non-grainy conformal metal coatings by electroless deposition comprising immersing the polyvinyl chloride plastic in a solution comprising at least about 10 grams of alkali metal hydroxide dissolved in a solution consisting of about 5% to about 30% by volume of a water-soluble mono-, di-, or polyhydric alcohol and about 70% to about 95% by volume of water. The immersion time is variable from about 5 minutes in ultrasonically agitated, mildly heated solutions to about 6 to about 8 hours in non-agitated, unheated solutions. After pretreatment, the polyvinyl chloride plastic is treated by standard electroless plating procedures known in the art.
摘要翻译： 一种用于通过无电沉积来预处理聚氯乙烯塑料以形成粘附的非颗粒状共形金属涂层的方法，包括将聚氯乙烯塑料浸入溶液中，该溶液包含溶解在约5％至约30％的溶液中的至少约10克碱金属氢氧化物 体积％的水溶性单，二或多元醇和约70体积％至约95体积％的水。 在非搅拌，未加热的溶液中，浸泡时间在超声搅拌，温和加热溶液中约5分钟变化至约6至约8小时。 在预处理之后，通过本领域已知的标准化学镀处理来处理聚氯乙烯塑料。
-
公开(公告)号：US4131692A
公开(公告)日：1978-12-26
申请号：US713355
申请日：1976-08-11
申请人： Baerbel Seebacher
发明人： Baerbel Seebacher
CPC分类号： C23C18/1865 , C23C18/1879 , H01C1/142 , H01C17/288
摘要： A ceramic electric resistor and a method for making the same. The resistor has a body which is formed of a material having a Perovskite structure with semiconducting doping and on its surface is contacted with two layers of different materials. The first layer is palladium or in association with palladium chloride and the second layer is one from a group of nickel, nickel-phosphorus or nickel-boron alloys. The process includes stoving-in the palladium or palladium chloride solution and providing a given composition of nickel bath for the second layer.
摘要翻译： 一种陶瓷电阻器及其制造方法。 电阻器具有由具有半导体掺杂的钙钛矿结构的材料形成的主体，并且其表面与两层不同的材料接触。 第一层是钯或与氯化钯结合，第二层是一组镍，镍 - 磷或镍 - 硼合金。 该方法包括浸入钯或氯化钯溶液中，并为第二层提供给定的镍浴组合物。
-
公开(公告)号：US4125642A
公开(公告)日：1978-11-14
申请号：US827658
申请日：1977-08-25
申请人： George S. Petit , Ralph R. Wright
发明人： George S. Petit , Ralph R. Wright
CPC分类号： C23C18/1675
摘要： This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank.The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.
摘要翻译： 本发明是在暴露于电镀槽的金属罐中进行无电镀金属镀工艺的改进方法。 本发明解决了这种过程中常遇到的问题：如何确定何时建议关闭该过程以清洁和/或重新启用油箱。
-
公开(公告)号：US4118234A
公开(公告)日：1978-10-03
申请号：US714111
申请日：1976-08-13
申请人： Johannes M. Jans
发明人： Johannes M. Jans
CPC分类号： C23C18/405
摘要： An electroless aqueous copper plating bath to which an aromatic nitro compound has been added as a stabilizer.
摘要翻译： 将作为稳定剂添加了芳香族硝基化合物的无电镀铜浴。
-
公开(公告)号：US4091127A
公开(公告)日：1978-05-23
申请号：US737639
申请日：1976-11-01
CPC分类号： H05K3/387 , C08G59/226 , H05K2201/0133 , Y10T428/31522
摘要： A cured epoxy polymer having improved adhesive properties is disclosed. The epoxy polymer is the reaction product of a mixture comprising a resin component comprising (a) a diglycidyl ether based upon linoleic dimer acid, (b) an elastomerically modified epoxy resin blend and (c) a diglycidyl ether of bisphenol A and/or bisphenol F and a suitable curing agent. The reaction mixture is heated at a suitable temperature for a period of time sufficient to attain a full cure of the epoxy.
摘要翻译： 公开了具有改进的粘合性能的固化的环氧聚合物。 环氧聚合物是包含树脂组分的混合物的反应产物，其包含（a）基于亚油酸二聚酸的二缩水甘油醚，（b）弹性体改性的环氧树脂共混物和（c）双酚A和/或双酚的二缩水甘油醚 F和合适的固化剂。 将反应混合物在合适的温度下加热足以使环氧树脂完全固化的时间。
-
48.发明授权Method of making sensitized polyimide polymers, having catalyst and electroless metal, metal deposits thereon and circuit patterns of various metallization schemes 失效制造具有催化剂和无电金属的敏化聚酰亚胺聚合物，金属沉积物和各种金属化方案的电路图案的方法
公开(公告)号：US4078096A
公开(公告)日：1978-03-07
申请号：US724810
申请日：1976-09-20
CPC分类号： H05K3/381 , C09K13/02 , C23C18/1608 , C23C18/1612 , C23C18/2086 , C23C18/285 , C23C18/30
摘要： A method is disclosed for the generation of circuit patterns on a polyimide type of substrate by preconditioning the substrate's surface with a hydrazine/caustic solution, depositing a catalyst on the surface treated polymer, and exposing the polymer with the catalyst thereon to a bath having a metal therein capable of deposition electrolessly on the polymer surface containing catalyst.
摘要翻译： 公开了一种用于通过用肼/苛性碱溶液预处理基板的表面，在表面处理的聚合物上沉积催化剂并将聚合物与催化剂在其上暴露于具有 其中能够在含有催化剂的聚合物表面上无电沉积的金属。
-
49.发明授权Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization 失效用于非金属表面的催化敏化以用于随后的无电镀金属化的方法
公开(公告)号：US4020197A
公开(公告)日：1977-04-26
申请号：US547360
申请日：1975-02-05
申请人： Horst Steffen
发明人： Horst Steffen
CPC分类号： C23C18/28
摘要： The present invention provides copper (I) ion compound bath solutions for the catalytic sensitization and metallization by electroless metal deposition of non-metallic surfaces, as well as processes for the application and re-claiming of said solutions.
摘要翻译： 本发明提供了用于通过无金属金属沉积非金属表面的催化敏化和金属化的铜（I）离子化合物浴溶液，以及用于所述溶液的应用和重新申请的方法。
-
公开(公告)号：US4019910A
公开(公告)日：1977-04-26
申请号：US473147
申请日：1974-05-24
CPC分类号： C23C18/50 , H05K3/244 , H05K2201/0347 , H05K2203/0723
摘要： Electroless, polymetallic nickel alloys containing an element of boron or phosphorus and one or more metals selected from tin, tungsten, molybdenum or copper which have unique properties and are produced as a plated deposit in an electroless nickel plating bath containing an ester complex of polyhydric acid or alcohol such as the diboron ester of glucoheptonic acid.
摘要翻译： 含有硼或磷的元素的无电镀多金属镍合金和选自锡，钨，钼或铜的一种或多种金属，其具有独特的性质，并且在含有多元酸的酯络合物的无电镀镍浴中作为电镀沉积物 或醇如葡庚糖酸的二硼酸酯。
-
-
-
-
-
-
-
-
-
搜索结果
483 条记录 (耗时 0.016 秒)
