摘要:
Perforations in the recessed area of a surface mold are provided to produce smooth, even, relatively stress-free deposition on the recessed area. Fusible fillets may also be used to form rigid bridges over parts of the recessed area. A specific product is an integrally formed, rigidly supported, relatively stress-free electroplated mirror.
摘要:
The specification describes a method for processing junction or barrier layer arrays to eliminate leakage defects. The array is anodized under mild electrolytic conditions which reverse bias the diodes. Since the array is reverse biased, anodization occurs selectively at the sites of current leakage and in proportion to the amount of leakage until the leakage is effectively eliminated. Properly formed elements of the array are essentially unaffected.
摘要:
AN APPARATUS AND METHOD FOR GROWING SINGLE CRYSTALS COMPRISING AN ELECTROCHEMICAL CIRCUIT INCLUDING A MEANS FOR ALTERNATING IN AN ASYMMETRICALLY TIMED MANNER THE DIRECTION OF CURRENT FLOW WITHIN THE ELECTROCHEMICAL CIRCUIT. ALSO INCLUDED IS A MEANS TO EFFECT THE VERTICAL MOVEMENT OF THE ELECTROCHEMICAL CIRUIT''S ELECTROLYTE IN A DOWNWARD DIRECTION AWAY FROM A GROWING CRYSTAL AT A RATE SUBSTANTIALLY SIMILAR TO THE RATE OF GROWTH OF THE GROWING CRYSTAL.
摘要:
A combustion chamber construction includes an inner wall having longitudinally extending cooling channels defined in the exterior thereof and an outer wall which is bonded to the inner wall by galvanizing, both the inner wall and outer wall are made of a single piece of an oxygen-free copper or equivalent material such as silver or molybdenum. The cooling channels are advantageously cut in accordance with the method of the invention such as by machining and formed with the least wall thickness in the area of the thrust nozzle and with the relatively greatest wall thickness in the area of the discharge of the combustion chamber. The internal wall thickness at the head portion of the combustion chamber is made of medium thickness. After the cooling channels are machined into the inner wall portion the channels are filled with a filler material which is electrically conductive and has a low melting point so that upon galvanizing it is melted out. In some instances an intermediate layer is positioned between an outer relatively thick and strong layer and inner wall of the combustion chamber, and the three layers are galvanized together.
摘要:
ELECTRODEPOSITION IS CONDUCTED IN ROTATING CELL HAVING ROTATING DEPOSITION ELECTRODE. MATERIAL TO BE INCLUDED (E.G. INORGANIC FIBERS) IN THE ELECTRODEPOSIT IS ADDED TO THE BATH, AND IS HELD BY CENTRIFUGAL FORCE AGAINST WORKPIECE WHILE DEPOSITION CONTINUES FURTHER, FIRMLY INVESTING INCLUSION IN DEPOSTI.
摘要:
A BASE IN THE FORM OF AN ELECTRICALLY CONDUCTIVE CYLINDER IS PROVIDED WITH A SCREEN OF ELECTRICALLY INSULATED SPOTS TO FORM A DESIRED PATTERN. THROUGH AN ELECTROCHEMICAL PROCESS, A METALLIC LAYER OF THE DESIRED THICKNESS IS DEPOSITED UPON THE BASE BUT THE SPOTS REMAIN UNCOVERED WITH METAL. THE OUTER DIAMETER OF THE BASE CYLINDER IS REDUCED TO FACILITATE THE REMOVAL OF THE METAL LAYER THEREFROM. THE METAL LAYER WILL BE THE DESIGNED STENCIL.
摘要:
IN ACCORDANCE WITH CERTAIN OF ITS ASPECTS, THIS INVENTION RELATES TO NOVEL COMPOSITIONS AND TO THE PROCESS FOR PREPARING A METAL PLATE RECEPTIVE TO A DECORATIVE NOBLE METAL DEPOSIT, CHARACTERIZED BY THE PRESENCE OF MICROPOROUS AREAS AND MICROCRACKED AREAS OVER SUBSTANTIALLY THE ENTIRE SURFACE OF SAID NOBLE METAL PLATE, WHICH COMPRISES AFFIXING TO A BASIS MATERIAL BEARING A CONDUCTIVE METAL SURFACE A STRATUM OF PARTICLES HAVING A PARTICLE SIZE OF ABOUT 0.05-15 MICRONS AND A DENSITY ON SAID CONDUCTIVE METAL
SURFACE OF ABOUT 100-5,000,000 PARTICLES/CM.2, AND DEPOSITING IN SAID STRATUM OF PARTICLES A CONDUCTIVE METAL LAYER HAVING AN EFFECTIVE THICKNESS LESS THAN THE MAXIMUM THICKNESS OF SAID STRATUM OF PARTICLES THEREBY FORMING A MATRIX WHEREIN SAID PARTICLES ARE RETAINED AFFIXED TO SAID SURFACE IN FIXED POSITION IN SAID CONDUCTIVE METAL LAYER, AND AT LEAST SOME OF SAID PARTICLES INTERCEPT THE SURFACE OF SAID CONDUCTIVE METAL LAYER.
摘要:
TO BOTH MAJOR FACES OF A FLAT MATRIX OF THERMOELEMENTS ELECTROPLATING REIST MATERIAL IS APPLIED IN A GRID-LIKE PATTERN. THE MATRIX WITH THE RESIST ON ITS FACES IS THEN PUT IN AN ELECTROPLATING BATH AND CONSTITUTES THE CATHODE THEREIN. METALLIC ELECTRICAL CONNECTING LINKS ARE THEN FORMED ON THE THERMOELEMENTS BY ELECTRODEPOSITION. THE COMMUTATION OF THE DEPOSITIED LINKS IS DETERMINED BY THE PATTERN OF THE RESIST MATERIAL. THE COMMUTATIONS OF THE TWO FACES ARE DIFFERENT.