Abstract:
A fluid level sensor is configured for identifying a fluid level in a small volume reservoir, such as a fluid reservoir in an ejector head. The reservoir includes a plurality of vertically arranged chambers. A plurality of piezoelectric transducers is distributed over the chambers in a one-to-one correspondence. At least one electrical conductor is electrically connected to each piezoelectric transducer in the plurality of piezoelectric transducers to enable each piezoelectric sensor to receive an electrical signal to a portion of a wall of the chamber to produce an acoustical wave in the chamber and to transmit an electrical signal from each piezoelectric transducer in response to a fluctuating pressure on each piezoelectric transducer produced by the acoustical wave in the chamber.
Abstract:
An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.
Abstract:
An apparatus for distributing a hydrophobic material in a hydrophilic substrate includes a first plate, a second plate, a heater operatively connected to the first plate and configured to heat the first plate to a first temperature that is greater than a second temperature of the second plate, and an actuator configured to move the first plate and second plate together with a hydrophilic substrate between the plates. The first plate and second plate form a temperature gradient to enable a hydrophobic material on one side of a hydrophilic substrate that faces the second plate to penetrate into the hydrophilic substrate towards the first plate.
Abstract:
An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.
Abstract:
A method of forming a lenticle on a substrate includes operating a plurality of inkjets to eject a plurality of ink drops of an optically transparent ink onto a surface of a substrate between a first printed line of an optically opaque ink and a second printed line of the optically opaque ink to form a lenticle from the optically transparent ink, the first printed line being formed substantially parallel to the second printed line with a separation between the first printed line and the second printed line corresponding to a predetermined width of a lenticle to be formed on the substrate.
Abstract:
A technique, including a system and a method, for measuring a fluid property using a piezo-actuated fluid dispenser, is disclosed. The technique includes generating a pressure wave in a channel in the piezo-actuated fluid dispenser using a piezo element, detecting, using the piezo element, a residual pressure oscillation in the channel caused by the generating, obtaining a resonance frequency of the pressure oscillation, and determining, using the resonance frequency, the fluid property.