公开(公告)号：US09266105B2

公开(公告)日：2016-02-23

申请号：US14311970

申请日：2014-06-23

Applicant: Xerox Corporation

Inventor： James R. Beachner ,  Jing Zhou ,  Mandakini Kanungo ,  Nancy Y. Jia ,  Paul J. McConville ,  Wei Hong

IPC: G01N21/75 ,  B01L3/00 ,  B32B41/00

CPC classification number: B01L3/5023 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2300/126 ,  B01L2300/161 ,  B32B7/12 ,  B32B29/005 ,  B32B33/00 ,  B32B37/0053 ,  B32B37/0076 ,  B32B37/06 ,  B32B37/12 ,  B32B37/1292 ,  B32B38/145 ,  B32B38/1841 ,  B32B41/00 ,  B32B2255/12 ,  B32B2307/73 ,  B32B2309/02 ,  B32B2317/12 ,  B32B2391/00 ,  B32B2535/00 ,  G01N2035/00108 ,  Y10T156/1741

Abstract: An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.

Abstract translation: 用于接合两个基板的装置包括第一辊，与第一辊形成辊隙的第二辊，配置成使得第一基板和第二基板通过辊隙同时移动的基板输送器和控制器。 所述控制器操作所述衬底输送以同时移动所述第一衬底和所述第二衬底，并且所述第一衬底的第一侧上的疏水材料的图案接合所述第二衬底的第一侧。 第一基板接合第一辊，其具有比第二辊更高的温度，并且疏水材料穿透第一和第二基板以将基板结合在一起。

公开(公告)号：US20150367340A1

公开(公告)日：2015-12-24

申请号：US14311970

申请日：2014-06-23

Applicant: Xerox Corporation

Inventor： James R. Beachner ,  Jing Zhou ,  Mandakini Kanungo ,  Nancy Y. Jia ,  Paul J. McConville ,  Wei Hong

IPC: B01L3/00 ,  B32B41/00

CPC classification number: B01L3/5023 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2300/126 ,  B01L2300/161 ,  B32B7/12 ,  B32B29/005 ,  B32B33/00 ,  B32B37/0053 ,  B32B37/0076 ,  B32B37/06 ,  B32B37/12 ,  B32B37/1292 ,  B32B38/145 ,  B32B38/1841 ,  B32B41/00 ,  B32B2255/12 ,  B32B2307/73 ,  B32B2309/02 ,  B32B2317/12 ,  B32B2391/00 ,  B32B2535/00 ,  G01N2035/00108 ,  Y10T156/1741

Abstract: An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.

Abstract translation: 用于接合两个基板的装置包括第一辊，与第一辊形成辊隙的第二辊，配置成使得第一基板和第二基板通过辊隙同时移动的基板输送器和控制器。 所述控制器操作所述衬底输送以同时移动所述第一衬底和所述第二衬底，并且所述第一衬底的第一侧上的疏水材料的图案接合所述第二衬底的第一侧。 第一基板接合第一辊，其具有比第二辊更高的温度，并且疏水材料穿透第一和第二基板以将基板结合在一起。