公开(公告)号：US20120167032A1

公开(公告)日：2012-06-28

申请号：US13338875

申请日：2011-12-28

申请人： Katsushi Mikuni ,  Toshiyuki Kudo ,  Masatoshi Yokouchi ,  Issei Sakurada ,  Tatsuo Inoue

发明人： Katsushi Mikuni ,  Toshiyuki Kudo ,  Masatoshi Yokouchi ,  Issei Sakurada ,  Tatsuo Inoue

IPC分类号： G06F17/50

CPC分类号： G06F17/5077

摘要： A computer program generates a wire routing pattern that connects one driver with a plurality of receivers. The overlapping length of each vector pair, which consists of any two vectors headed from the driver to the receivers, is calculated. One vector pair that has the greatest overlapping length is selected. For the selected vector pair, three kinds of common nodes are created, each of which is used to make a common path part of the way to the receivers, to generate three kinds of renewed vector patterns. The operations are repeated and plural candidate routing patters are acquired. One candidate routing pattern having the smallest total wiring length is selected as the optimum routing pattern. If there exist plural patterns that have the same smallest total wiring length, one pattern can be selected that has the smallest one of the greatest D-R path lengths.

摘要翻译： 计算机程序产生将一个驱动器与多个接收器相连接的布线图案。 计算由从驱动器到接收器的两个向量组成的每个矢量对的重叠长度。 选择一个具有最大重叠长度的矢量对。 对于所选择的向量对，创建了三种公共节点，每个节点用于将共同的路径部分作为接收机的方式，以生成三种更新的向量模式。 重复操作，并获取多个候选路由模式。 选择具有最小总布线长度的一个候选布线图案作为最佳布线图案。 如果存在具有相同最小总布线长度的多个图案，则可以选择具有最大D-R路径长度中最小的一个图案。

公开(公告)号：US07735221B2

公开(公告)日：2010-06-15

申请号：US12099691

申请日：2008-04-08

申请人： Tatsuo Inoue ,  Osamu Arai ,  Katsushi Mikuni ,  Norihiro Imai

发明人： Tatsuo Inoue ,  Osamu Arai ,  Katsushi Mikuni ,  Norihiro Imai

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/167 ,  G01R1/06766 ,  G01R1/07342 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/467 ,  H05K2201/0317 ,  H05K2201/0352 ,  H05K2201/09781 ,  H05K2203/025 ,  H05K2203/1453 ,  Y10T29/49099 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of manufacturing a multilayer wiring board is provided. A flat surface is formed on a surface of a multilayer wiring layer, and resistive material is deposited on the flat surface. The multilayer wiring board comprises a multilayer wiring layer on whose surface convexo-concave is formed, a dummy layer burying the convexo-concave, a resistance material layer made of an electrical resistance material deposited on the dummy layer and at an area going beyond the dummy layer, and a wire made of a conductive material deposited on the resistance material layer and ranging from the area going beyond the dummy layer to a part of the flat surface area of the dummy layer, wherein a resistive element is formed at an area of the resistance material layer that the wire does not reach.

摘要翻译： 提供一种制造多层布线板的方法。 平坦表面形成在多层布线层的表面上，并且电阻材料沉积在平坦表面上。 该多层布线基板包括其表面形成凹凸的多层布线层，埋入凹凸的虚设层，沉积在虚拟层上的电阻材料制成的电阻材料层和超过虚拟的区域 以及由电阻材料层上沉积的导电材料制成的线，并且从超出虚设层的区域延伸到虚设层的平坦表面区域的一部分，其中，电阻元件形成在 导线不能到达的电阻材料层。

公开(公告)号：US06758728B2

公开(公告)日：2004-07-06

申请号：US10196411

申请日：2002-07-17

申请人： Tatsuo Inoue ,  Mitsunori Komatsu

发明人： Tatsuo Inoue ,  Mitsunori Komatsu

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B55/02

摘要： A polishing surface cleaning method and apparatus are capable of effectively removing the polishing residue from the polishing surface of a polishing table in a polisher by using a minimal amount of cleaning liquid. In the polisher, a workpiece to be polished is pressed against the polishing surface of the polishing table to polish the workpiece by relative motion between the polishing surface and the workpiece. The polishing surface cleaning apparatus uses mixing spray nozzles for mixing together a cleaning liquid and a gas and spraying the resulting fluid mixture on the polishing surface to clean it.

摘要翻译： 抛光表面清洁方法和设备能够通过使用最少量的清洁液体来有效地从磨光机中抛光台的抛光表面去除抛光残留物。 在抛光机中，要抛光的工件被压在抛光台的抛光表面上，以通过抛光表面和工件之间的相对运动来抛光工件。 抛光表面清洁装置使用混合喷嘴将洗涤液和气体混合在一起，并将所得流体混合物喷射在抛光表面上以将其清洁。

公开(公告)号：US06443816B2

公开(公告)日：2002-09-03

申请号：US09790976

申请日：2001-02-23

申请人： Tatsuo Inoue ,  Mitsunori Komatsu

发明人： Tatsuo Inoue ,  Mitsunori Komatsu

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B55/02

摘要： A polishing surface cleaning method and apparatus are capable of effectively removing the polishing residue from the polishing surface of a polishing table in a polisher by using a minimal amount of cleaning liquid. In the polisher, a workpiece to be polished is pressed against the polishing surface of the polishing table to polish the workpiece by relative motion between the polishing surface and the workpiece. The polishing surface cleaning apparatus uses mixing spray nozzles for mixing together a cleaning liquid and a gas and spraying the resulting fluid mixture on the polishing surface to clean it.

公开(公告)号：US06378277B1

公开(公告)日：2002-04-30

申请号：US09438960

申请日：1999-11-12

申请人： Tatsuo Inoue ,  Eiji Yoshida ,  Naohiko Kakutani

发明人： Tatsuo Inoue ,  Eiji Yoshida ,  Naohiko Kakutani

IPC分类号： B65B920

CPC分类号： B65B9/2021 ,  B65B9/207 ,  B65B57/08

摘要： A vertical sealing device for a packing machine includes a pair of feed units for feeding a cylindrical-formed packaging material and a center heat sealer for the heat-sealing of a vertical seam of the packaging material. When the operation of the machine is halted, the feed units feed the packaging material from a steady speed mode to a deceleration mode. During this deceleration mode, the operation of the center heat sealer is stopped. On the other hand, when the operation of the packing machine is restarted, the feed units feed the packaging material in an acceleration mode, and during this acceleration mode, the center heat sealer starts operating.

摘要翻译： 用于包装机的立式密封装置包括用于供给圆柱形包装材料的一对进料单元和用于热封包装材料的垂直接缝的中心热封机。 当机器的操作停止时，进给单元将包装材料从稳定速度模式送入减速模式。 在该减速模式下，停止中央热封机的运转。 另一方面，当包装机的操作重新开始时，进给单元以加速模式进给包装材料，并且在该加速模式期间，中央热封机开始运转。

公开(公告)号：US06269471B1

公开(公告)日：2001-07-31

申请号：US09013475

申请日：1998-01-26

申请人： Yoshiaki Yamano ,  Tomonori Inagaki ,  Tatsuo Inoue

发明人： Yoshiaki Yamano ,  Tomonori Inagaki ,  Tatsuo Inoue

IPC分类号： G06F1750

CPC分类号： H02G3/00

摘要： On a floor of a building, a wiring layout of information circuits which are used by personnel who work at a plurality of blocks, has at each block outlet connectors connected to information devices at the block. An interconnection unit has primary connectors connected to extend devices e.g. telephone exchange or network controller, and secondary connectors. Wiring structures each having a plurality of wiring cables connect respective groups of the secondary connectors to respective blocks. Interconnection cables detachably and interchangeably connect the primary and secondary connectors at the interconnection unit. To enable efficient and simple re-arrangement for the information circuits, first identification signs, e.g. colors, identify blocks associated with the respective wiring cables, and at the interconnection unit, the secondary outlets connected by one of the wiring structures to one of the blocks are grouped together in space and have associated with them an identification sign which is the same as the first identification sign identifying the block to which they are connected.

摘要翻译： 在建筑物的地板上，在多个块上工作的人员使用的信息电路的布线布局在每个块出口连接到块上的信息装置。 互连单元具有连接以延伸装置的主要连接器，例如 电话交换机或网络控制器，以及辅助连接器。 每个具有多个布线电缆的接线结构将次要连接器的相应组连接到相应的块。互连电缆可拆卸地且可互换地连接互连单元处的主要和次要连接器。 为了实现对信息电路的有效和简单的重新布置，首先识别符号，例如， 颜色，识别与各个布线电缆相关联的块，并且在互连单元处，通过一个布线结构连接到其中一个块的次级出口在空间中被分组在一起，并且与它们相关联的识别符号与 标识它们所连接的块的第一识别符号。

公开(公告)号：US6153447A

公开(公告)日：2000-11-28

申请号：US182214

申请日：1998-10-30

申请人： Tatsuo Inoue

发明人： Tatsuo Inoue

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/64 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/486 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/647 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/3011

摘要： In an LSI package, terminal resistance elements are formed of resistive paste which, consisting of a mixture of fine powder of either oxidized metal or carbon and fine powder of glass, is buried and sintered in a ceramic wiring board in the direction to penetrate it. Front side wiring, connecting the parts of the terminal resistance elements exposed on the front face of the ceramic wiring board to input/output circuits of the LSI chip to be mounted on the front face of the ceramic wiring board, is formed on the front face of the ceramic wiring board and in the top layer of the ceramic wiring board. Back side wiring, connecting the parts of the terminal resistance elements exposed on the back face of the ceramic wiring board to a voltage clamp wiring network, is formed on the back face of the ceramic wiring board.

摘要翻译： 在LSI封装中，终端电阻元件由电阻糊形成，其由氧化金属或碳的细粉末与玻璃微细粉末的混合物构成，并在陶瓷布线板中沿着穿透方向进行烧结。 将暴露在陶瓷布线板的正面的端子电阻元件的部分连接到要安装在陶瓷布线板的正面上的LSI芯片的输入/输出电路的正面布线形成在前表面 的陶瓷布线板和陶瓷布线板的顶层。 在陶瓷布线板的背面上形成有将暴露在陶瓷布线板的背面上的端子电阻元件的部分连接到电压钳布线网的背面布线。

公开(公告)号：US6059461A

公开(公告)日：2000-05-09

申请号：US966086

申请日：1997-11-07

申请人： Kazunori Aoki ,  Tatsuo Inoue ,  Shinsuke Kunishi

发明人： Kazunori Aoki ,  Tatsuo Inoue ,  Shinsuke Kunishi

IPC分类号： G02B6/36 ,  G02B6/38 ,  G02B6/40 ,  G02B6/42

CPC分类号： G02B6/3893 ,  G02B6/3825 ,  G02B6/3879 ,  G02B6/4292 ,  G02B6/3869 ,  G02B6/3873 ,  G02B6/3878

摘要： An optical fiber connector assembly includes a connector housing having a plug-receiving cavity. A plug connector is provided for terminating an optical fiber and includes a forward mating end for surrounding a core of the fiber. The plug connector includes a rearward engaging portion for selective interengagement with a second plug connector in parallel with the first plug connector. The forward mating end is insertable into the plug-receiving cavity of the connector housing while the rearward engaging portion is exposed exteriorly of the cavity when the mating end is fully inserted into the cavity. Therefore, the plug connector can be used individually with the connector housing or interengaged with the second plug connector.

摘要翻译： 光纤连接器组件包括具有插头接收腔的连接器壳体。 提供插头连接器用于端接光纤并且包括用于围绕光纤的芯的前配合端。 插头连接器包括用于与第一插头连接器并联的第二插头连接器选择性地相互接合的向后接合部分。 当配合端完全插入空腔时，向前配合端可插入连接器壳体的插头容纳腔中，同时向后接合部暴露在空腔外部。 因此，插头连接器可以与连接器壳体单独使用或与第二插头连接器相互接合。

公开(公告)号：US5892657A

公开(公告)日：1999-04-06

申请号：US816671

申请日：1997-03-13

申请人： Tatsuo Inoue

发明人： Tatsuo Inoue

IPC分类号： H05K7/20 ,  H01L25/065 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC分类号： H01L25/0657 ,  H05K3/363 ,  H01L2224/16 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/15312 ,  H05K1/0269 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/094 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K3/3463 ,  H05K3/4614

摘要： An electronic-circuit assembly of the present invention comprises a plurality of film carriers which are stacked. Respective film carriers have a plurality of through-holes. One of through-holes is provided on corresponding position to another through-hole in the stacked direction of the substrate. Two of adjacent film carriers are connected by the corresponding through-holes. A connection member is provided in two of adjacent through-holes in the stacked direction of the substrates. A connection state between film carriers can be easily checked. Since it is visually checked that solder appears inside the topmost through-hole. Furthermore, wiring lengths for connection between substrates can be reduced. Since the plurality of substrates are three-dimensionally connected.

摘要翻译： 本发明的电子电路组件包括堆叠的多个薄膜载体。 各个胶片载体具有多个通孔。 在基板的堆叠方向上的另一通孔的相应位置上设置有一个通孔。 两个相邻的胶片载体通过相应的通孔连接。 连接构件沿着基板的堆叠方向设置在两个相邻的通孔中。 可以容易地检查胶片载体之间的连接状态。 由于目视检查焊料是否出现在最上面的通孔内。 此外，可以减少基板之间的连接的布线长度。 由于多个基板是三维连接的。

公开(公告)号：US4816323A

公开(公告)日：1989-03-28

申请号：US93602

申请日：1987-09-08

申请人： Tatsuo Inoue

发明人： Tatsuo Inoue

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  B32B3/00 ,  B32B15/00 ,  C03B29/00

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/024 ,  H05K1/0306 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/09581 ,  H05K3/4605 ,  H05K3/467 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A multilayer wiring substrate is disclosed. The wiring substrate is provided with a substrate section made of a ceramic material. A plurality of power-supply wiring layers are formed within the substrate section. Additionally, a plurality of first and second through-holes penetrate the substrate section. Formed on a wall surface of the section to define each of the first through-holes are first electrically conductive metal layers, each of which is connected electrically to at least one of the power supply wiring layers. Formed on a wall surface of the section to define each of the second through-holes are coating layers of a fluoride resin dielectric. Second electrically conductive metal layers are formed on the coating layers, respectively. There is also provided a circuit supplied with power via the first electrically conductive metal layers and with signals via the second electrically conductive metal layers.There is further disclosed a method of manufacturing a multilayer wiring substrate.

摘要翻译： 公开了一种多层布线基板。 布线基板设置有由陶瓷材料制成的基板部分。 在基板部内形成有多个电源布线层。 此外，多个第一和第二通孔穿透基板部分。 形成在所述部分的壁表面上以限定每个第一通孔的是第一导电金属层，每个导电金属层电连接到至少一个电源布线层。 形成在该部分的壁表面上以限定每个第二通孔的是氟化物树脂电介质的涂层。 第二导电金属层分别形成在涂层上。 还提供了经由第一导电金属层提供电力的电路和经由第二导电金属层的信号。 还公开了一种制造多层布线基板的方法。