知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

77 records (took 0.022 seconds)

    ANGLE SENSOR WITH DIVERSE MEASUREMENT PATHS AND A SAFETY PATH
    41.
    发明申请
    ANGLE SENSOR WITH DIVERSE MEASUREMENT PATHS AND A SAFETY PATH 有权

    公开(公告)号：US20220373318A1

    公开(公告)日：2022-11-24

    申请号：US17303191

    申请日：2021-05-24

    Applicant: Infineon Technologies AG

    Inventor： Friedrich RASBORNIG ,  Wolfgang GRANIG ,  Dirk HAMMERSCHMIDT ,  Benjamin KOLLMITZER ,  Bernhard SCHAFFER

    IPC: G01B7/30 ,  G01D5/12

    Abstract: An angle sensor may include a first angle measurement path to determine an angular position based on sensor values from a first set of sensing elements. The angle sensor may include a second angle measurement path to determine the angular position based on sensor values from a second set of sensing elements. A type of the second set of sensing elements is different from a type of the first set of sensing elements. The angle sensor may include a safety path to perform a set of safety checks, the set of safety checks including a first vector length check associated with the first angle measurement path and a second vector length check associated with the second angle measurement path. The angle sensor may include an output component to provide an indication of a result of the set of safety checks.

    INDUCTIVE SENSOR WITH IMPROVED SAFETY
    42.
    发明申请
    INDUCTIVE SENSOR WITH IMPROVED SAFETY 有权

    公开(公告)号：US20220326002A1

    公开(公告)日：2022-10-13

    申请号：US17301746

    申请日：2021-04-13

    Applicant: Infineon Technologies AG

    Inventor： Friedrich RASBORNIG ,  Dirk HAMMERSCHMIDT ,  Tobias WERTH

    IPC: G01B7/30 ,  G01L3/10

    Abstract: An inductive sensor may include a first angle measurement path associated with determining an angular position based on a first set of input signals. The inductive sensor may include a second angle measurement path associated with determining an angular position based on a second set of input signals. The inductive sensor may include an amplitude regulation path associated with regulating amplitudes of a set of output signals. The inductive sensor may include a safety path associated with performing one or more safety checks. Each safety check of the one or more safety checks may be associated with at least one of the first angle measurement path, the second angle measurement path, or the amplitude regulation path.

    TORQUE MEASUREMENT USING MILLIMETER-WAVE METAMATERIAL
    46.
    发明申请
    TORQUE MEASUREMENT USING MILLIMETER-WAVE METAMATERIAL 有权

    公开(公告)号：US20210102854A1

    公开(公告)日：2021-04-08

    申请号：US16911618

    申请日：2020-06-25

    Applicant: Infineon Technologies AG

    Inventor： Dirk HAMMERSCHMIDT ,  Christof MICHENTHALER

    IPC: G01L3/14

    Abstract: A torque measurement system includes a first rotatable carrier structure mechanically coupled to a rotational shaft; a second rotatable carrier structure mechanically coupled to the rotational shaft; a first mutually coupled structure including a first track mechanically coupled to the first rotatable carrier structure and a second track mechanically coupled to the second rotatable carrier structure, where the first track and the second track are coupled together by a first torque dependent coupling; a second mutually coupled structure including a third track mechanically coupled to the first rotatable carrier structure and a fourth track mechanically coupled to the second rotatable carrier structure, where the third track and the fourth track are coupled together by a second torque dependent coupling. In response to a rotation of the rotational shaft, the first torque dependent coupling is configured to increase and the second torque dependent coupling is configured to decrease.

    POSITION SENSOR AND POSITION MEASUREMENTS USING MILLIMETER-WAVE METAMATERIAL
    47.
    发明申请
    POSITION SENSOR AND POSITION MEASUREMENTS USING MILLIMETER-WAVE METAMATERIAL 有权

    公开(公告)号：US20210033703A1

    公开(公告)日：2021-02-04

    申请号：US16524543

    申请日：2019-07-29

    Applicant: Infineon Technologies AG

    Inventor： Dirk HAMMERSCHMIDT

    IPC: G01S7/41 ,  G01S13/06 ,  H01Q15/14

    Abstract: A rotation sensor system includes a rotatable target object configured to rotate about a rotational axis in a rotation direction; a first millimeter-wave (mm-wave) metamaterial track coupled to the rotatable target object, where the first mm-wave metamaterial track is arranged around the rotational axis, and where the first mm-wave metamaterial track includes a first array of elementary structures having at least one first characteristic that changes around a perimeter of the first mm-wave metamaterial track; at least one transmitter configured to transmit a first electro-magnetic transmit signal towards the first mm-wave metamaterial track, where the first mm-wave metamaterial track converts the first electro-magnetic transmit signal into a first electro-magnetic receive signal; at least one receiver configured to receive the first electro-magnetic receive signal; and at least one processor configured to determine a rotational position of the rotatable target object based on the received first electro-magnetic receive signal.

    PRESSURE SENSORS ON FLEXIBLE SUBSTRATES FOR STRESS DECOUPLING
    48.
    发明申请
    PRESSURE SENSORS ON FLEXIBLE SUBSTRATES FOR STRESS DECOUPLING 审中-公开

    公开(公告)号：US20200321256A1

    公开(公告)日：2020-10-08

    申请号：US16910595

    申请日：2020-06-24

    Applicant: Infineon Technologies AG

    Inventor： Dirk HAMMERSCHMIDT

    IPC: H01L23/053

    Abstract: A semiconductor device includes a semiconductor chip including a substrate having a first surface and a second surface arranged opposite to the first surface; and a microelectromechanical systems (MEMS) element, including a sensitive area, disposed at the first surface of the substrate. The semiconductor device further includes at least one electrical interconnect structure electrically connected to the first surface of the substrate, and a flexible carrier electrically connected to the at least one electrical interconnect structure, where the flexible carrier wraps around the semiconductor chip and extends over the second surface of the substrate such that a folded cavity is formed around the semiconductor chip.

    PRESSURE SENSORS ON FLEXIBLE SUBSTRATES FOR STRESS DECOUPLING
    49.
    发明申请
    PRESSURE SENSORS ON FLEXIBLE SUBSTRATES FOR STRESS DECOUPLING 审中-公开

    公开(公告)号：US20200283287A1

    公开(公告)日：2020-09-10

    申请号：US16294208

    申请日：2019-03-06

    Applicant: Infineon Technologies AG

    Inventor： Dirk HAMMERSCHMIDT

    IPC: B81B7/00 ,  H01L23/053

    Abstract: A semiconductor device includes a semiconductor chip including a substrate having a first surface and a second surface arranged opposite to the first surface; and a microelectromechanical systems (MEMS) element, including a sensitive area, disposed at the first surface of the substrate. The semiconductor device further includes at least one electrical interconnect structure electrically connected to the first surface of the substrate, and a flexible carrier electrically connected to the at least one electrical interconnect structure, where the flexible carrier wraps around the semiconductor chip and extends over the second surface of the substrate such that a folded cavity is formed around the semiconductor chip.

    PRESSURE MEASURING ARRANGEMENT
    50.
    发明申请
    PRESSURE MEASURING ARRANGEMENT 审中-公开

    公开(公告)号：US20190178740A1

    公开(公告)日：2019-06-13

    申请号：US16213543

    申请日：2018-12-07

    Applicant: Infineon Technologies AG

    Inventor： Dirk HAMMERSCHMIDT

    IPC: G01L19/00 ,  G01L13/00

    Abstract: A pressure measuring arrangement is proposed. The pressure measuring arrangement includes a first MEMS pressure sensor arranged on a carrier, and also a second MEMS pressure sensor arranged on the carrier. Furthermore, the pressure measuring arrangement includes an integrated circuit arranged on the carrier, the integrated circuit being coupled to the first MEMS pressure sensor and the second MEMS pressure sensor.

Patent Agency Ranking