公开(公告)号：US10328521B2

公开(公告)日：2019-06-25

申请号：US15314170

申请日：2015-03-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi Sakamoto ,  Yasunori Igasaki ,  Mamiko Matsunaga

IPC: B23K26/00 ,  B23K26/06 ,  B23K26/064 ,  B23K26/067 ,  B23K26/073 ,  B23K26/53 ,  B23K101/40 ,  B23K103/00

Abstract: A laser processing device includes: a laser light source; a converging optical system; and a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point. In a case in which W1 is a radius of the first processing light at a front face of the object, W2 is a radius of the second processing light at the front face, and D is a distance between the first converging point and the second converging point when viewed from a direction orthogonal to the front face, the reflective spatial light modulator modulates the laser light such that D>W1+W2 is satisfied.

公开(公告)号：US08865568B2

公开(公告)日：2014-10-21

申请号：US14256370

申请日：2014-04-18

Applicant: Hamamatsu Photonics K.K.

Inventor： Takeshi Sakamoto ,  Aiko Nakagawa

IPC: H01L21/00 ,  H01L21/20 ,  H01L21/36 ,  H01L21/44 ,  H01L21/78

CPC classification number: H01L21/78 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/0222 ,  H01L21/67092

Abstract: Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed between the modified regions (7a, 7b). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate (12) when forming a plurality of rows of modified regions (7). By generating a stress in the object (1), the fractures (17a, 17b) are connected to each other in the unmodified region (2), so as to cut the object (1). This can prevent fractures from meandering in the rear face (12b) of the object (1) and so forth, whereby the object (1) can be cut accurately along a line to cut the object (5).

Abstract translation: 从修饰区域（7a，7b）分别向被处理物体（1）的前后面（12a，12b）分别产生断裂（17a，17b），而未改性区域（2） 区域（7a，7b）。 这可以防止当形成多行修改区域（7）时在硅衬底（12）的厚度方向上的断裂继续前进。 通过在物体（1）中产生应力，裂纹（17a，17b）在未修改区域（2）中彼此连接，从而切割物体（1）。 这可以防止在物体（1）的后表面（12b）等中产生蜿蜒的折痕，从而可以沿着切割物体（5）的线被精确地切割物体（1）。