Abstract:
A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.
Abstract:
According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.
Abstract:
In one embodiment, an apparatus includes a module for installation in a modular electronic system. The module generally comprises a subassembly for insertion into a front opening in a chassis of the modular electronic system or removal from the front opening in the chassis and an adapter comprising a first interface for mating with the subassembly and a second interface for mating with the modular electronic system. The adapter remains in the chassis during removal of the subassembly from the front opening in the chassis and the module is configured for insertion into a rear opening in the chassis or removal from the rear opening in the chassis with the subassembly coupled to the adapter.
Abstract:
A set of modular bracket units are mountable end-to-end in series on a support structure adjacent a cable interface area of an electronic equipment assembly, the form a composite cable management bracket. The bracket units are mountable in interchangeable positions in the series to define longitudinally extending series of segregated cable management openings through which cables are receivable for connection to respective electronic equipment ports, to restrain the cables against transverse escape from the respective cable management openings. The set of modular bracket units comprises at least one single-opening bracket unit that defines a single cable management opening, and at least one multi-opening bracket unit that defines, when mounted as part of the composite cable management bracket, two or more cable management openings. The bracket units that define different numbers of cable management openings are of equal modular length and has identical connection formations, to allow mounting of the bracket units in any desire sequence.
Abstract:
An enclosure has a perforated front door with a replaceable filter, and a perforated rear side allowing air to flow through the enclosure. The enclosure also has mounting brackets for heat generating elements, such as line cards or other rack mounted electronics. A fan draws air through the perforated front door, though the filter, and across the heat generating elements. Side brushes are disposed on a side wall near the front of the enclosure, which allow any cables attached to the heat generating elements to exit the enclosure. The front door is removable, opening up one side of the side brushes and allowing the cables to slide in the side brushes while still connected to the heat generating elements.
Abstract:
A high insertion force ejector may be provided. The high insertion force ejector may comprise an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth may be connected to the ejector mounting base. A lever handle may be operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam may be operatively connected to the pressure bar-ejector tooth and the lever handle.