公开(公告)号：US11586259B2

公开(公告)日：2023-02-21

申请号：US17235040

申请日：2021-04-20

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Joseph Francis Jacques ,  John Scott Scheeler

IPC: G06F1/20 ,  H05K7/20

Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

公开(公告)号：US20220334624A1

公开(公告)日：2022-10-20

申请号：US17235040

申请日：2021-04-20

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Joseph Francis Jacques ,  John Scott Scheeler

IPC: G06F1/20 ,  H05K7/20

Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.