公开(公告)号：US10912216B1

公开(公告)日：2021-02-02

申请号：US16246243

申请日：2019-01-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Vic Hong Chia ,  Edward John Kliewer ,  Amrik S. Bains ,  Khanh Tieu Ly

IPC: H05K5/02 ,  H05K7/20 ,  H05K7/14

Abstract: In one embodiment, an apparatus includes a module for installation in a modular electronic system. The module generally comprises a subassembly for insertion into a front opening in a chassis of the modular electronic system or removal from the front opening in the chassis and an adapter comprising a first interface for mating with the subassembly and a second interface for mating with the modular electronic system. The adapter remains in the chassis during removal of the subassembly from the front opening in the chassis and the module is configured for insertion into a rear opening in the chassis or removal from the rear opening in the chassis with the subassembly coupled to the adapter.