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    INTEGRATED SPEAKERS
    41.
    发明申请
    INTEGRATED SPEAKERS 有权
    综合演讲者

    公开(公告)号：US20160088379A1

    公开(公告)日：2016-03-24

    申请号：US14495777

    申请日：2014-09-24

    Applicant: Apple Inc.

    Inventor： G. Kyle Lobisser ,  Jason S. Keats ,  Ryan J. Mihelich ,  Pablo Seoane Vieites ,  Kevin M. Kenney ,  John Raff ,  Erik A. Uttermann ,  Melody L. Kuna ,  Oliver C. Ross

    IPC: H04R1/02 ,  H04R31/00

    CPC classification number: H04R1/2888 ,  H04R1/2834 ,  H04R2201/029 ,  H04R2499/11

    Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.

    Abstract translation: 封闭电子设备外壳。 外壳包括构造成改善结构支撑以防止损坏并消散整个外壳的振动的肋结构。 肋结构可以接收扬声器模块和盖构件。 肋结构和扬声器模块可以组合形成三维体积，从而允许扬声器模块可以投影声音的扬声器模块，从而增强声学性能。 此外，盖构件可以粘合地附接到肋结构，以提供抵抗由与落下事件相关联的负载力引起的振动和滥用的附加结构支撑。

    Electronic Device Assemblies
    43.
    发明申请
    Electronic Device Assemblies 审中-公开
    电子设备组件

    公开(公告)号：US20140226291A1

    公开(公告)日：2014-08-14

    申请号：US14258414

    申请日：2014-04-22

    Applicant: Apple Inc.

    Inventor： Kevin D. Gibbs ,  Carl R. Peterson ,  Erik A. Uttermann ,  Conor P. Lenahan ,  John P. Ternus ,  Justin R. Wodrich ,  Elvis M. Kibiti ,  Derek Wright

    IPC: H05K1/02 ,  H05K5/02

    CPC classification number: H05K1/028 ,  G03B1/00 ,  G03B17/02 ,  G03B17/22 ,  G03B17/30 ,  G03B19/04 ,  G03B2217/002 ,  G06F1/1698 ,  H01Q9/42 ,  H04M1/0264 ,  H04M1/0277 ,  H04N5/2252 ,  H05K5/0217 ,  H05K2201/055

    Abstract: An electronic device may have a conductive housing. A dielectric structure may be mounted in the conductive housing to form an antenna window. An electrical component such as a camera, light sensor, or other device may press against a conductive foam structure. A printed circuit may have conductive traces that form an antenna ground and antenna resonating element. The printed circuit may be wrapped around a support structure. The electrical component, the conductive foam structure, and the printed circuit wrapped around the support structure may be compressed between a display cover layer and the antenna window. A camera window may be attached to a camera window trim using multiple adhesives. The trim may have a curved exterior surface that matches a curved housing surface. A flexible printed circuit cable may have a folded portion. A band structure may surround the folded portion to form a service loop.

    Abstract translation: 电子设备可以具有导电外壳。 电介质结构可以安装在导电外壳中以形成天线窗。 诸如相机，光传感器或其他装置的电气部件可以压靠导电泡沫结构。 印刷电路可以具有形成天线接地和天线谐振元件的导电迹线。 印刷电路可以缠绕在支撑结构上。 缠绕在支撑结构上的电气部件，导电泡沫结构和印刷电路可以在显示器覆盖层和天线窗口之间被压缩。 相机窗口可以使用多种粘合剂连接到相机窗饰。 装饰件可以具有与弯曲的壳体表面匹配的弯曲外表面。 柔性印刷电路电缆可以具有折叠部分。 带结构可以围绕折叠部分以形成服务循环。

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