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公开(公告)号：US20250024183A1
公开(公告)日：2025-01-16
申请号：US18801180
申请日：2024-08-12
Applicant: APPLE INC.
Inventor： Dustin A. Hatfield , Michael B. Minerbi , Eugene Antony Whang , Benjamin A. Shaffer , Edward Siahaan , Daniel R. Bloom
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.
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公开(公告)号：US20240357271A1
公开(公告)日：2024-10-24
申请号：US18626112
申请日：2024-04-03
Applicant: APPLE INC.
Inventor： Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
CPC classification number: H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/105 , H04R1/1066 , H04R1/1075 , H04R1/1083 , H04R5/0335 , H04R5/04 , G10K11/17861 , G10K11/17873
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US11985463B2
公开(公告)日：2024-05-14
申请号：US18197672
申请日：2023-05-15
Applicant: APPLE INC.
Inventor： Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R25/00 , H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
CPC classification number: H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/105 , H04R1/1066 , H04R1/1075 , H04R1/1083 , H04R5/0335 , H04R5/04 , G10K11/17861 , G10K11/17873
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US20230421196A1
公开(公告)日：2023-12-28
申请号：US18367072
申请日：2023-09-12
Applicant: Apple Inc.
Inventor： Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski
IPC: H04B1/3827
CPC classification number: H04B1/3827
Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
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公开(公告)号：US20230345162A1
公开(公告)日：2023-10-26
申请号：US18212133
申请日：2023-06-20
Applicant: APPLE INC.
Inventor： Dustin A. Hatfield , Michael B. Minerbi , Eugene Antony Whang , Benjamin A. Shaffer , Edward Siahaan , Daniel R. Bloom
CPC classification number: H04R1/1008 , H04R1/1066 , H04R5/0335 , H04R1/105 , H04R1/1075
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.
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Patent Agency Ranking
公开(公告)号：US11450999B2
公开(公告)日：2022-09-20
申请号：US17023013
申请日：2020-09-16
Applicant: Apple Inc.
Inventor： Eric T. SooHoo , Mahmoud R. Amini , Daniel R. Bloom , Sean T. McIntosh , Tian Shi Li , Jared M. Kole , Jason Joseph LeBlanc , Colin M. Ely , Peter J. Cameron , Michael A. Kinney , Eric S. Jol , Edward Siahaan , Robert D. Zupke , Rohan Gupta , Jordan J. Francis
IPC: H01R39/12 , H01R12/61 , H01R12/77 , H01R13/422
Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.
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公开(公告)号：US20220086551A1
公开(公告)日：2022-03-17
申请号：US17023246
申请日：2020-09-16
Applicant: Apple Inc.
Inventor： Jarrett B. Lagler , Michael B. Minerbi , Miikka O. Tikander , Lee M. Panecki , Trang Fisher , Esge Andersen , Eugene Whang , Ben Shaffer , Edward Siahaan , Daniel R. Bloom , Kitty Yung , Tyler A. Green , Krithika Elangovan , Sarah Gysbers , Michael Burello , Matthew Zaverl , Christopher A. Sandieson , Casey L. Baran
IPC: H04R1/10
Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.
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公开(公告)号：US20220085560A1
公开(公告)日：2022-03-17
申请号：US17023013
申请日：2020-09-16
Applicant: Apple Inc.
Inventor： Eric T. SooHoo , Mahmoud R. Amini , Daniel R. Bloom , Sean T. McIntosh , Tian Shi Li , Jared M. Kole , Jason Joseph LeBlanc , Colin M. Ely , Peter J. Cameron , Michael A. Kinney , Eric S. Jol , Edward Siahaan , Robert D. Zupke , Rohan Gupta , Jordan J. Francis
IPC: H01R39/12 , H01R12/77 , H01R12/61 , H01R13/422
Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.
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公开(公告)号：US11102567B2
公开(公告)日：2021-08-24
申请号：US16362399
申请日：2019-03-22
Applicant: Apple Inc.
Inventor： Michael E. Leclerc , Brett W. Degner , David H. Narajowski , Kristopher P. Laurent , Daniel R. Bloom , Daniele de Iuliis , Christopher J. Stringer , Sung-Ho Tan , Markus Diebel
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US20210029436A1
公开(公告)日：2021-01-28
申请号：US17071819
申请日：2020-10-15
Applicant: Apple Inc.
Inventor： Brett W. Degner , Christopher J. Stringer , Daniel R. Bloom , Michael E. Leclerc , David H. Narajowski , Kristopher P. Laurent , Daniele de luliis , Markus Diebel , Sung-Ho Tan
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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