公开(公告)号：US11784673B2

公开(公告)日：2023-10-10

申请号：US17469001

申请日：2021-09-08

Applicant: Apple Inc.

Inventor： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC: H04B1/3827

CPC classification number: H04B1/3827

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

公开(公告)号：US11184696B1

公开(公告)日：2021-11-23

申请号：US17023240

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Tian Shi Li ,  Daniel R. Bloom ,  Jerzy S. Guterman ,  Jue Wang ,  Toni Ristoski ,  Jared M. Kole ,  Edward Siahaan ,  Eugene Antony Whang

IPC: H04R25/00 ,  H04R1/10 ,  H01Q13/10 ,  H01Q1/24 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20230421196A1

公开(公告)日：2023-12-28

申请号：US18367072

申请日：2023-09-12

Applicant: Apple Inc.

Inventor： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC: H04B1/3827

CPC classification number: H04B1/3827

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

公开(公告)号：US20220085843A1

公开(公告)日：2022-03-17

申请号：US17469001

申请日：2021-09-08

Applicant: Apple Inc.

Inventor： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC: H04B1/3827

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.