公开(公告)号：US20220086551A1

公开(公告)日：2022-03-17

申请号：US17023246

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC: H04R1/10

Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

公开(公告)号：US11277679B1

公开(公告)日：2022-03-15

申请号：US17023246

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC: H04R1/10

Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

公开(公告)号：US20170066170A1

公开(公告)日：2017-03-09

申请号：US14856795

申请日：2015-09-17

Applicant: Apple Inc.

Inventor： Christopher A. Sandieson ,  Robert S. Murphy

IPC: B29C45/56 ,  B29C45/37 ,  G06F3/02 ,  B29C45/14

CPC classification number: G06F3/0202 ,  B29C45/14221 ,  B29L2031/466 ,  B29L2031/7676 ,  H01H2229/044

Abstract: Disclosed herein is an integrated embossing and injection molding tool that is used to overmold a frame on an embossed material. The embossed material and the frame may be used as a keyboard component of keyboard for a portable electronic device.

Abstract translation: 本文公开了一种用于在压花材料上包覆模制框架的集成压花和注射模制工具。 压花材料和框架可以用作便携式电子设备的键盘的键盘组件。