公开(公告)号：US08802506B2

公开(公告)日：2014-08-12

申请号：US12280248

申请日：2007-02-14

申请人： Minoru Isshiki ,  Tomoko Kato ,  Yoshitsugu Morita ,  Hiroshi Ueki

发明人： Minoru Isshiki ,  Tomoko Kato ,  Yoshitsugu Morita ,  Hiroshi Ueki

IPC分类号： H01L21/00

CPC分类号： B29C43/18 ,  B29C43/50 ,  C08L83/06 ,  C08L83/14 ,  H01L21/565 ,  H01L23/293 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

摘要翻译： 一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将供入到模具和未密封的半导体器件之间的空间中的可固化的硅氧烷组合物压缩成型，将密封在固化的硅氧烷体中的方法进行压缩成型 上述可固化硅氧烷组合物至少包含以下组分：（A）含环氧基的硅氧烷和（B）环氧树脂的固化剂; 可以减少半导体芯片和电路板翘曲，提高表面耐擦伤性。

公开(公告)号：US08796190B2

公开(公告)日：2014-08-05

申请号：US12865184

申请日：2009-01-22

申请人： Tomoko Kato ,  Kazumi Nakayoshi

发明人： Tomoko Kato ,  Kazumi Nakayoshi

IPC分类号： C10M125/04 ,  C10M169/04 ,  C10M141/10 ,  C10M139/04 ,  C10M105/76

CPC分类号： C10M169/02 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/60 ,  C08L83/04 ,  C08L83/14 ,  C09K5/14 ,  C10M2201/0416 ,  C10M2201/056 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/1056 ,  C10M2201/145 ,  C10M2227/04 ,  C10M2227/065 ,  C10M2229/0415 ,  C10M2229/0425 ,  C10M2229/0435 ,  C10M2229/0445 ,  C10M2229/0465 ,  C10M2229/0515 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2220/084 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/09701 ,  C08L83/00 ,  C08L2666/54 ,  H01L2924/00

摘要： A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.

摘要翻译： 至少包含以下组分的导热硅油组合物：由以下通式表示的有机聚硅氧烷（A）：其中R 1表示相同或不同的一价烃基; X表示相同或不同的具有以下通式的一价烃基或含烷氧基甲硅烷基的基团：-R2-SiR1a（OR3）（3-a）（其中R1表示前述基团; R2表示氧原子或亚烷基; R3表示 烷基;和'a'是0至2的整数）; 和'm'和'n'分别为等于或大于0的整数]; 导热填料（B）; 和在分子末端和分子链中具有硅键合氢原子的有机聚硅氧烷（C）; 其特征在于优异的耐热性和减少的油渗出。

公开(公告)号：US08373286B2

公开(公告)日：2013-02-12

申请号：US13062374

申请日：2009-09-04

申请人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

发明人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

IPC分类号： H01L23/29

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00

摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

摘要翻译： 一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元， 三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷 其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。 一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

公开(公告)号：US08217388B2

公开(公告)日：2012-07-10

申请号：US12438658

申请日：2007-07-24

申请人： Tomoko Kato ,  Yoshitsugu Morita ,  Shinichi Yamamoto ,  Toshio Saruyama

发明人： Tomoko Kato ,  Yoshitsugu Morita ,  Shinichi Yamamoto ,  Toshio Saruyama

IPC分类号： H01L35/24

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014

摘要： A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其至少包含以下组分：（A）质均分子量至少为3,000的直链二有机聚硅氧烷，（B）支链有机聚硅氧烷，（C）平均具有至少两个硅 - 在一个分子中平均具有至少两个与硅键合的氢原子，和（D）氢化硅烷化反应催化剂; 具有优异的固化性，并且当固化时形成高折射率，光透射性，对各种基材的优异粘附性，高硬度和轻微的表面粘性的柔性固化产物。

公开(公告)号：US08063143B2

公开(公告)日：2011-11-22

申请号：US12888050

申请日：2010-09-22

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

IPC分类号： C08L83/05

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L43/04 ,  C08L2205/03 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  C08L2666/02 ,  C08L2666/04 ,  H01L2924/00014

摘要： A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

摘要翻译： 包含含烯基和苯基的有机聚硅氧烷，有机氢聚硅氧烷，乙烯基单体和乙烯基单体与氢化硅烷基的共聚物和铂催化剂的可固化的有机聚硅氧烷组合物; 固化过程由两个或多个热固化阶段组成; 具有由上述组成的固化体制成的透光部的光半导体装置; 以及由乙烯基单体和乙烯基单体与氢化甲硅烷基的共聚物组成的粘合促进剂。

公开(公告)号：US20110188213A1

公开(公告)日：2011-08-04

申请号：US12994475

申请日：2009-05-12

申请人： Narumasa Domae ,  Tomoko Kato ,  Kazumi Nakayoshi

发明人： Narumasa Domae ,  Tomoko Kato ,  Kazumi Nakayoshi

IPC分类号： H05K1/18 ,  C09K5/00

CPC分类号： C08L83/04 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K5/56 ,  C08K2201/001 ,  C08L83/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

摘要翻译： 本发明的导热硅氧烷组合物包含：（A）在25℃下粘度至少为500mPa·s的有机聚硅氧烷; （B）导热填料; （C）二氧化硅细粉; （D）在25℃下具有可水解基团且粘度小于500mPa·s的有机聚硅氧烷; 和（E）含有可水解基团的硅烷化合物。 该组合物在低粘度下具有优异的可操作性和可加工性，并且在施加到表面上后，即使在苛刻的温度条件下，该表面呈垂直位置也不会滑脱。

公开(公告)号：US07919150B2

公开(公告)日：2011-04-05

申请号：US10580798

申请日：2004-11-24

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

IPC分类号： B05D5/00 ,  B05D1/38 ,  B05D3/10

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

公开(公告)号：US20110071266A1

公开(公告)日：2011-03-24

申请号：US12888050

申请日：2010-09-22

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

IPC分类号： C08F224/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L43/04 ,  C08L2205/03 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  C08L2666/02 ,  C08L2666/04 ,  H01L2924/00014

摘要： A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

摘要翻译： 包含含烯基和苯基的有机聚硅氧烷，有机氢聚硅氧烷，乙烯基单体和乙烯基单体与氢化硅烷基的共聚物和铂催化剂的可固化的有机聚硅氧烷组合物; 固化过程由两个或多个热固化阶段组成; 具有由上述组成的固化体制成的透光部的光半导体装置; 以及由乙烯基单体和乙烯基单体与氢化甲硅烷基的共聚物组成的粘合促进剂。

公开(公告)号：US07842755B2

公开(公告)日：2010-11-30

申请号：US11572660

申请日：2005-07-28

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

IPC分类号： C08L83/05

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L43/04 ,  C08L2205/03 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  C08L2666/02 ,  C08L2666/04 ,  H01L2924/00014

摘要： A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

摘要翻译： 包含含烯基和苯基的有机聚硅氧烷，有机氢聚硅氧烷，乙烯基单体和乙烯基单体与氢化硅烷基的共聚物和铂催化剂的可固化的有机聚硅氧烷组合物; 固化过程由两个或多个热固化阶段组成; 具有由上述组成的固化体制成的透光部的光半导体装置; 以及由乙烯基单体和乙烯基单体与氢化甲硅烷基的共聚物组成的粘合促进剂。

公开(公告)号：US20080262158A1

公开(公告)日：2008-10-23

申请号：US11572660

申请日：2005-07-28

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki

IPC分类号： C08L83/04 ,  C08F2/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L43/04 ,  C08L2205/03 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  C08L2666/02 ,  C08L2666/04 ,  H01L2924/00014

摘要： A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

摘要翻译： 包含含烯基和苯基的有机聚硅氧烷，有机氢聚硅氧烷，乙烯基单体和乙烯基单体与氢化硅烷基的共聚物和铂催化剂的可固化的有机聚硅氧烷组合物; 固化过程由两个或多个热固化阶段组成; 具有由上述组成的固化体制成的透光部的光半导体装置; 以及由乙烯基单体和乙烯基单体与氢化甲硅烷基的共聚物组成的粘合促进剂。