公开(公告)号：US08633276B2

公开(公告)日：2014-01-21

申请号：US12994475

申请日：2009-05-12

申请人： Narumasa Domae ,  Tomoko Kato ,  Kazumi Nakayoshi

发明人： Narumasa Domae ,  Tomoko Kato ,  Kazumi Nakayoshi

IPC分类号： C08L83/06

CPC分类号： C08L83/04 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K5/56 ,  C08K2201/001 ,  C08L83/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

摘要翻译： 本发明的导热硅氧烷组合物包含：（A）在25℃下粘度至少为500mPa·s的有机聚硅氧烷; （B）导热填料; （C）二氧化硅细粉; （D）在25℃下具有可水解基团且粘度小于500mPa·s的有机聚硅氧烷; 和（E）含有可水解基团的硅烷化合物。 该组合物在低粘度下具有优异的可操作性和可加工性，并且在施加到表面上后，即使在苛刻的温度条件下，该表面呈垂直位置也不会滑脱。

公开(公告)号：US20110188213A1

公开(公告)日：2011-08-04

申请号：US12994475

申请日：2009-05-12

申请人： Narumasa Domae ,  Tomoko Kato ,  Kazumi Nakayoshi

发明人： Narumasa Domae ,  Tomoko Kato ,  Kazumi Nakayoshi

IPC分类号： H05K1/18 ,  C09K5/00

CPC分类号： C08L83/04 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K5/56 ,  C08K2201/001 ,  C08L83/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

摘要翻译： 本发明的导热硅氧烷组合物包含：（A）在25℃下粘度至少为500mPa·s的有机聚硅氧烷; （B）导热填料; （C）二氧化硅细粉; （D）在25℃下具有可水解基团且粘度小于500mPa·s的有机聚硅氧烷; 和（E）含有可水解基团的硅烷化合物。 该组合物在低粘度下具有优异的可操作性和可加工性，并且在施加到表面上后，即使在苛刻的温度条件下，该表面呈垂直位置也不会滑脱。