Abstract:
A method for making polyesterimide varnishes by polycondensing and imidat a mixture of trimellitic anhydride, 4,4'-diamino-diphenyl methane, glycol, dimethyl terephthalate and glycerol or tris(hydroxyethyl) isocyanurate or optionally p,p'-dihydroxy-diphenyl-dimethyl methane, with a transesterification catalyst added, and subsequently dissolving the resulting polyesterimide resin in an organic solvent with a crosslinking catalyst added, characterized by the feature that 2-methyl-1,3-propanediol and/or 2-butyl-2-ethyl-1,3-propanediol is used as the glycol or as one of the glycols.
Abstract:
This invention relates to a process for making a thickened thermoset resin composition, comprising: mixing (A) a carboxylic acid containing thermoset resin composition; and (B) at least one compound represented by the formula ##STR1## wherein in Formula (B-I): R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently hydrogen or methyl; R.sup.5 is hydrogen, a hydrocarbon group or a substituted hydrocarbon group, the substituents on said substituted hydrocarbon group comprising oxygen and/or nitrogen; and n is at least 1.
Abstract:
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
Abstract:
The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.
Abstract:
Novel polyesters prepared from a diol, a dicarboxylic acid or ester forming reactive derivative thereof and an aromatic amino acid, ester or alcohol are disclosed.
Abstract:
Crosslinkable, polyaromatic, polyether or polyester oligomers can have glass transition temperatures above 900.degree. F. while exhibiting desirable toughness for aerospace applications and ease of processing. A plurality (i.e. three or more) of generally linear aryl arms extend outwardly like spokes from a central aromatic hub through ether or ester linkages. Each spoke usually includes electronegative linkages, and is capped with one or two crosslinking functionalities (i.e. unsaturated hydrocarbon sites) which may be thermally or chemically activated to complete the advanced composite during curing. Among other methods, linear and multidimensional polyether oligomers are synthesized using nitrophthalic anhydride or halophthalic anhydride, dialcohols, or polyols, diamines, and suitable end caps.
Abstract:
Thermoplastic poly(imide-esters) and poly(imide-amides) with repeat units derived from the title amino acid. In the polymer the amino group becomes part of an imide group and the carboxyl group becomes part of an ester or amide group. The polymers have a good balance of properties, making them useful for melt forming shaped articles, films and fibers.
Abstract:
Disclosed is a polyester-imide prepared from a condensation polymerization of aromatic diacid, diimide diacid, and diol, having a carboxy to hydroxy equivalent molar ratio of 0.9:1 to 1.1:1. The disclosed polyester-imide has outstanding heat-resistance, remarkable filming ability, and high solubility in both phenol series and amide series solvents.
Abstract:
A copolyesterimide composed of bis-trimellitimide units, 2,6-naphthalenedicarboxylic acid units, hydroquinone units and p-hydroxybenzic acid units. This copolyesterimide is melt-processable, and excels in heat resistance and mechanical properties.
Abstract:
A thermoplastic, liquid-crystalline, wholly aromatic polyimide ester comprising(a) at least one structural unit derived from an aromatic dicarboxylic acid,(b) at least one structural unit derived from a substituted hydroquinone having an aralykyl substituent group in its benzene nucleus, and at least one structural unit selected from (c) structural units derived from carboxy-N-(carboxyphenyl)phthalimides and (d) structural units derived from carboxy-N-(hydroxyphenyl)phthalimidesis able to be molded by injection molding, has excellent dimensional stability and dimensional accuracy in both flow direction and a direction making a right angle with the flow direction, and is also excels in strength, elastic modulus, and heat resistance. The thermoplastic, liquid-crystalline, wholly aromatic polyimide ester may be suitably produced by using, as the reaction materials, an aromatic dicarboxylic acid, a substituted hydroquinone substituted by an aralkyl substituent group in its benzene nucleus, and both or one of a carboxy-N-(carboxyphenyl)phthalimide and a carboxy-N-(hydroxyphenyl)phthalimide, or their derivatives, and polycondensing these compounds.