Process for thickening thermoset resin molding compound compositions
    32.
    发明授权
    Process for thickening thermoset resin molding compound compositions 失效
    加热热固性树脂模塑料组合物的方法

    公开(公告)号:US5854317A

    公开(公告)日:1998-12-29

    申请号:US769454

    申请日:1996-12-18

    Applicant: James E. Rinz

    Inventor: James E. Rinz

    Abstract: This invention relates to a process for making a thickened thermoset resin composition, comprising: mixing (A) a carboxylic acid containing thermoset resin composition; and (B) at least one compound represented by the formula ##STR1## wherein in Formula (B-I): R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently hydrogen or methyl; R.sup.5 is hydrogen, a hydrocarbon group or a substituted hydrocarbon group, the substituents on said substituted hydrocarbon group comprising oxygen and/or nitrogen; and n is at least 1.

    Abstract translation: 本发明涉及一种制备增稠的热固性树脂组合物的方法,包括:(A)含羧酸的热固性树脂组合物; (B-1)表示的至少一种化合物,其中在式(B-I)中:R 1,R 2,R 3和R 4独立地为氢或甲基; R5是氢,烃基或取代烃基,所述取代烃基上的取代基包括氧和/或氮; 且n至少为1。

    Thermoplastic polyimide, polyamide acid, and thermally fusible laminated
film for covering conductive wires
    34.
    发明授权
    Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires 失效
    热塑性聚酰亚胺,聚酰胺酸和用于覆盖导电线的热熔层叠膜

    公开(公告)号:US5668247A

    公开(公告)日:1997-09-16

    申请号:US167024

    申请日:1993-12-16

    Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

    Abstract translation: 本发明提供了新型热塑性聚酰亚胺,其在低温下具有固体粘合性,低吸湿系数和对放射线的固体电阻率。 本发明还提供了基本上是热塑性聚酰亚胺前体的新型聚酰胺酸,并且还提供了用于覆盖导电线的新型热熔性层压膜,其特征在于在低温下具有固体粘合性,对放射线具有固体电阻率,并且具有明显的适用于覆盖超导线 尤其是。 新型热塑性聚酰亚胺由对应于下述化学结构的通式(1)表示; 其中,Ar1,Ar2,Ar4和Ar6分别表示二价有机基团,Ar3和Ar5分别表示四价有机基团,其中,1,m和n分别表示 正整数0至1或大于1,其中1和m的和聚合1或大于1,其中t表示1或大于1的正整数。

    Polyimides from 4-(3-aminophenoxy)benzoic acid
    37.
    发明授权
    Polyimides from 4-(3-aminophenoxy)benzoic acid 失效
    来自4-(3-氨基苯氧基)苯甲酸的聚酰亚胺

    公开(公告)号:US5395917A

    公开(公告)日:1995-03-07

    申请号:US65502

    申请日:1993-05-21

    Inventor: Robert S. Irwin

    CPC classification number: C08G73/14 C08G73/16

    Abstract: Thermoplastic poly(imide-esters) and poly(imide-amides) with repeat units derived from the title amino acid. In the polymer the amino group becomes part of an imide group and the carboxyl group becomes part of an ester or amide group. The polymers have a good balance of properties, making them useful for melt forming shaped articles, films and fibers.

    Abstract translation: 具有衍生自标题氨基酸的重复单元的热塑性聚(酰亚胺 - 酯)和聚(酰亚胺 - 酰胺)。 在聚合物中,氨基成为酰亚胺基的一部分,羧基成为酯或酰胺基的一部分。 聚合物具有良好的性能平衡,使其可用于熔体成型成型制品,薄膜和纤维。

    Soluble polyesterimide
    38.
    发明授权
    Soluble polyesterimide 失效
    可溶性聚酰亚胺

    公开(公告)号:US5349039A

    公开(公告)日:1994-09-20

    申请号:US963464

    申请日:1992-10-20

    CPC classification number: C08G73/16

    Abstract: Disclosed is a polyester-imide prepared from a condensation polymerization of aromatic diacid, diimide diacid, and diol, having a carboxy to hydroxy equivalent molar ratio of 0.9:1 to 1.1:1. The disclosed polyester-imide has outstanding heat-resistance, remarkable filming ability, and high solubility in both phenol series and amide series solvents.

    Abstract translation: 公开了由羧基与羟基当量的摩尔比为0.9:1至1.1:1的芳族二酸,二酰亚胺二酸和二醇的缩聚制备的聚酯酰亚胺。 所公开的聚酯酰亚胺在苯酚系列和酰胺系溶剂中具有优异的耐热性,显着的成膜能力和高的溶解性。

    Thermoplastic, liquid-crystalline, wholly aromatic polyimide ester and
method of producing the same
    40.
    发明授权
    Thermoplastic, liquid-crystalline, wholly aromatic polyimide ester and method of producing the same 失效
    热塑性,液晶,异丙醇酰胺和其制备方法

    公开(公告)号:US5109100A

    公开(公告)日:1992-04-28

    申请号:US443253

    申请日:1989-11-30

    CPC classification number: C08G73/16 C09K19/3809

    Abstract: A thermoplastic, liquid-crystalline, wholly aromatic polyimide ester comprising(a) at least one structural unit derived from an aromatic dicarboxylic acid,(b) at least one structural unit derived from a substituted hydroquinone having an aralykyl substituent group in its benzene nucleus, and at least one structural unit selected from (c) structural units derived from carboxy-N-(carboxyphenyl)phthalimides and (d) structural units derived from carboxy-N-(hydroxyphenyl)phthalimidesis able to be molded by injection molding, has excellent dimensional stability and dimensional accuracy in both flow direction and a direction making a right angle with the flow direction, and is also excels in strength, elastic modulus, and heat resistance. The thermoplastic, liquid-crystalline, wholly aromatic polyimide ester may be suitably produced by using, as the reaction materials, an aromatic dicarboxylic acid, a substituted hydroquinone substituted by an aralkyl substituent group in its benzene nucleus, and both or one of a carboxy-N-(carboxyphenyl)phthalimide and a carboxy-N-(hydroxyphenyl)phthalimide, or their derivatives, and polycondensing these compounds.

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