Abstract:
Various new and non-obvious apparatus and methods for testing embedded memories in an integrated circuit are disclosed. One of the disclosed embodiments is an apparatus for testing an embedded memory in an integrated circuit. This exemplary embodiment comprises input logic that includes one or more memory-input paths coupled to respective memory inputs of the embedded memory, a memory built-in self-test (MBIST) controller, and at least one scan cell coupled between the input logic and the MBIST controller. The scan cell of this embodiment is selectively operable in a memory-test mode and a system mode. In memory-test mode, the scan cell can apply memory-test data to the memory inputs along the memory-input paths of the integrated circuit. Any of the disclosed apparatus can be designed, simulated, and/or verified (and any of the disclosed methods can be performed) in a computer-executed application, such as an electronic-design-automation (“EDA”) software tool.
Abstract:
A test method sets a write value to a scan flip-flop for setting a value to a memory to be tested. It then performs a series of shift operation in scan paths until setting of a read value is completed. During the shift operation, a value for refresh operation is added to the value passing through the flip-flop for setting a value to the memory to be tested.
Abstract:
According to one embodiment, an electrical package includes: an external input portion; an external output portion; a plurality of integrated circuits that is compatible with a compressed deterministic pattern test, each of the integrated circuits including: an input portion; a decompressor that is connected to the input portion; scan chains that are connected to the decompressor; a compactor that is connected to the scan chains; a selector that is connected to the compactor and the input portion to selectively output an output of the compactor or an output of the input portion; and an output portion that is connected to the selector.
Abstract:
Peripheral input and output buffer circuitry is tested using scan path circuitry selectively connecting external signals TSA, TSB, and TSC to the buffer circuitry. This is in addition to testing the internal circuitry of the integrated circuit with the scan path circuitry. An external signal, TSC, provides a load to the output of the buffer circuitry. An external signal, TSA, receives a response from input buffer circuitry and supplies a stimulus signal to output buffer circuitry. An external signal, TSB, receives a response signal from output buffer circuitry and supplies a stimulus signal to input buffer circuitry. This avoids a wafer tester having to contact bond pads connected to the buffer circuitry.
Abstract:
A method of implementing a compilable memory structure configured for supporting multiple test methodologies includes configuring a first plurality of multiplexers for selectively coupling at least one data input path and at least one address path between an external customer connection and a corresponding internal memory connection associated therewith. A second multiplexer is configured for selectively coupling an input of a test latch between a functional memory array connection and a memory logic connection, the memory logic connection coupled to the at least one data input path, with an output of the test latch defining a data out customer connection. Flush logic is configured to direct data from the memory logic connection to the data out customer connection during a test of logic associated with a customer chip, facilitating observation of the memory logic connection at the customer chip.
Abstract:
A register file device has a memory array, a scan connection configuration circuit, a file writing unit, a file reading unit, and a scan control circuit. The memory includes first storage devices which are obtained by adding shift transfer gate and an output gate to a master flip-flop only latch in a conventional register file using master flip-flop only latch storage devices, and a scan connection configuration circuit and a scan control circuit using master flip-flop only second storage devices are added thereto to realize the scan function of internally constituting a shift register and reading contents thereof in testing. The size of the register file is reduced by using master flip-flop only latch storage devices, and a high test/diagnosis efficiency is achieved by using the internal scan function in master-slave type flip-flop (2 latches) storage devices.
Abstract:
There are provided a plurality of bridge circuits which convert the test data information from a common test bus connected to a plurality of memories of different access data widths and address decode logics to the inherent access data widths of each memory and also convert the test address information from the common test bus to the inherent bit format of each memory to supply the result to the corresponding memory. The test address information is supplied in parallel from the common test bus to a plurality of memories to realize the parallel tests. Accordingly, the test data information can be supplied in parallel to a plurality of memories of different data widths and the address scan direction in the respective memories for the test address information can be uniformed to the particular direction depending on the inherent bit format. Thereby, the memory test efficiency by the match pattern for a plurality of on-chip memories can be improved.
Abstract:
The inputs to an embedded core, e.g., the core terminals, may not be directly connected to pins on the SoC. The lack of direct access to an embedded core's terminals may complicate testing of the embedded core. A test wrapper including boundary scan test (BST) cells may be used to test an embedded core. Dual function BST/ATPG (Automatic Test Pattern Generation) cells may be used to perform both BST and ATPG tests on embedded cores. A BIST (Built-In Self Test) controller supporting a “resume” mode in addition to a “pass/fail” mode may be used to compensate for timing latencies introduced by pipeline staging in an embedded memory array.
Abstract:
A memory chip suitable for use in a daisy chain of memory chips. The memory chip receives an address/command word on a first input, determines if the address command word is directed to the memory chip; if so, the memory chip accesses an array on the memory chip respondent to the address/command word. If not, the memory chip re-drives the address/command word on a first output. Write data is received as part of the address/command word or from a first data bus port. Read data is read from the array or is received from a second data bus port for subsequent re-driving on the first data bus port. A bus clock is received and is used to receive and transmit information on the first input, the first output, the first data bus port and the second data bus port.
Abstract:
A memory chip suitable for use in a daisy chain of memory chips. The memory chip receives an address/command word on a first input, determines if the address command word is directed to the memory chip; if so, the memory chip accesses an array on the memory chip. If not, the memory chip re-drives the address/command word on a first output. Write data is received as part of the address/command word or from a first data bus port. A bus clock is received and is used to receive and transmit information on the first input, the first output, the first data bus port and the second data bus port. The memory chip is incorporated into a design structure that is embodied in a computer readable medium used for designing, manufacturing, or testing the memory chip.