公开(公告)号：US11999133B2

公开(公告)日：2024-06-04

申请号：US17951955

申请日：2022-09-23

申请人： NITTO DENKO CORPORATION ,  Nippon Electric Glass Co., Ltd.

发明人： Takeshi Murashige ,  Junichi Inagaki ,  Kazuhito Hosokawa ,  Kota Nakai ,  Toshihiro Kanno ,  Yoshinori Hasegawa ,  Kaoru Mitsugi ,  Naohiro Ikai ,  Hiroki Mori ,  Yohei Kirihata

IPC分类号： B32B17/10 ,  B29C65/48 ,  B65D57/00 ,  B65D85/672 ,  B65H39/16 ,  C03B17/06 ,  C03B25/04 ,  C03B33/02 ,  C03C17/32

CPC分类号： B32B17/10 ,  B29C65/48 ,  B32B17/10018 ,  B32B17/10366 ,  B65D57/004 ,  B65D85/672 ,  B65H39/16 ,  C03B17/06 ,  C03B25/04 ,  C03B33/02 ,  C03C17/32 ,  B32B2329/00 ,  B32B2367/00 ,  B32B2369/00 ,  B65H2701/17

摘要： Provided is a method comprises: continuously forming an elongated, glass film having marginal portions from molten glass into a given shape having two marginal portions, in width-directional opposite edge regions thereof, wherein the glass film having marginal portions has the marginal portions, and an effective portion formed in a width-directional central region of the glass film having marginal portions; annealing the glass film having marginal portions; continuously forming resin tapes on the glass film having marginal portions at positions adjacent to and away by a given distance from the respective marginal portions, to extend in a length direction of the glass film having marginal portions; and continuously removing each of the marginal portions from the glass film having marginal portions, along a position between the marginal portion and a corresponding one of the resin tapes, or at a given width-directional position within the corresponding resin tape.

公开(公告)号：US20240170491A1

公开(公告)日：2024-05-23

申请号：US18255325

申请日：2023-05-19

申请人： BENGBU CHINA OPTOELECTRONIC TECHNOLOGY CO., LTD ,  CNBM RESEARCH INSTITUTE FOR ADVANCED GLASS MATERIALS GROUP CO.,LTD ,  CHINA NATIONAL BUILDING MATERIAL GROUP CO., LTD.

发明人： Shou PENG ,  Chong ZHANG ,  Zhiqiang CAO ,  Nan ZHAN ,  Longyue JIANG ,  Kui WU ,  Liangmao JIN ,  Changzhen WANG

IPC分类号： H01L27/12 ,  B24B9/10 ,  C03B33/02

CPC分类号： H01L27/1218 ,  B24B9/10 ,  C03B33/02

摘要： The embodiment of the present application proposes a TFT-LCD float glass substrate processing line, which is sequentially divided into a precision cutting and edge grinding working area, a surface grinding working area, and an inspection and packaging working area. In the precision cutting and edge grinding working area, a cold-end cutting device, a precision cutting and breaking device, a multi-axis edge grinding device, an after-edge-grinding cleaning device, a first edge inspection machine device, a first size measurement device, a grinding range measurement device, a flipping conveyor belt, and a loading frame are sequentially installed. In the surface grinding working area, a bonding machine entry conveyor belt, a first vacuum transfer suction cup, a bonding machine device, a surface grinding device, a peeling machine device, a second vacuum transfer suction cup, an after-surface-grinding cleaning machine, a first surface inspection machine device, a final cleaning machine, a third surface inspection machine device, a second edge inspection machine device, a second size measurement device, and a thickness measurement device.

公开(公告)号：US09573835B2

公开(公告)日：2017-02-21

申请号：US14966730

申请日：2015-12-11

申请人： CORNING INCORPORATED

发明人： Shawn Rachelle Markham ,  Windsor Pipes Thomas, III

IPC分类号： B44C1/22 ,  C03B33/02 ,  B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H01L21/304 ,  H01L21/306 ,  C03B17/06 ,  H01L21/683

CPC分类号： C03B33/02 ,  B24B1/00 ,  B24B7/228 ,  B24B37/042 ,  C03B17/064 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/30625 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y02P40/57 ,  Y10T428/21 ,  Y10T428/24628

摘要： A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.

摘要翻译： 这里描述了非抛光玻璃晶片，减薄系统以及使用非抛光玻璃晶片来薄化半导体晶片的方法。 在一个实施例中，玻璃晶片具有包括未经抛光的第一表面和基本上彼此平行的未抛光的第二表面的主体（例如圆形主体）。 此外，圆形体具有的晶片质量指数等于微米的总厚度变化加上小于6.0的千分之几十分之一的翘曲。

公开(公告)号：US09413134B2

公开(公告)日：2016-08-09

申请号：US14753275

申请日：2015-06-29

申请人： KLA-Tencor Corporation

发明人： Vladimir Dribinski ,  Yung-Ho Alex Chuang ,  J. Joseph Armstrong

IPC分类号： H01S3/10 ,  H01S5/00 ,  H01S3/11 ,  G02F1/37 ,  H01S3/00 ,  C30B29/10 ,  C30B33/02 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  C03B33/02 ,  C30B1/02 ,  C30B29/14 ,  C30B29/22 ,  C30B29/30 ,  G02F1/35 ,  G02F1/355

CPC分类号： H01S5/0092 ,  C03B33/02 ,  C30B1/02 ,  C30B29/10 ,  C30B29/14 ,  C30B29/22 ,  C30B29/30 ,  C30B33/02 ,  G01N21/88 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N2201/06113 ,  G01N2201/0637 ,  G01N2201/068 ,  G02F1/353 ,  G02F1/3551 ,  G02F1/3553 ,  G02F1/37 ,  G02F2001/3505 ,  G02F2001/3507 ,  G02F2001/354 ,  G02F2202/20 ,  H01S3/0092 ,  H01S3/10 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/11

摘要： A frequency-conversion crystal annealing process includes a first ramp-up period (e.g., increasing the crystal's temperature to a first set point in the range of 100° C. to 150° C. over about 2 hours), a first fixed temperature period (e.g., maintaining at the first set point for 10 to 20 hours), a second ramp-up period (e.g., increasing from the first set point to a second set point above 150° C. over about 1 hour or more), a second fixed period (e.g., maintaining at the second set point for 48 to 300 hours), and then a temperature ramp-down period (e.g., decreasing from the second set point to room temperature over about 3 hours). Transitions from the first and second fixed temperature periods are optionally determined by —OH bonds absorption levels that are measured using Fourier transform infrared spectroscopy, e.g., by monitoring the absorption of —OH bonds (including H2O) near 3580 cm−1 in the infra-red spectrum.

摘要翻译： 频率转换晶体退火处理包括第一斜坡上升​​周期（例如，在约2小时内将晶体的温度提高到在100℃至150℃的范围内的第一设定点），第一固定温度周期 （例如，在第一设定点保持10至20小时），第二加速时间段（例如，在大约1小时或更长时间内从第一设定点增加到高于150℃的第二设定点），a 第二固定时间（例如，在第二设定点保持48至300小时），然后温度降低时间（例如，从大约3小时的第二设定点降低到室温）。 从第一和第二固定温度周期的转变可任选地由使用傅立叶变换红外光谱法测量的-OH键吸收水平确定，例如通过监测基底内的3580cm-1附近的-OH键（包括H 2 O）的吸收， 红色光谱。

公开(公告)号：US20150299893A1

公开(公告)日：2015-10-22

申请号：US14753275

申请日：2015-06-29

申请人： KLA-Tencor Corporation

发明人： Vladimir Dribinski ,  Yung-Ho Alex Chuang ,  J. Joseph Armstrong

IPC分类号： C30B1/02 ,  C30B29/14 ,  C30B29/30 ,  G02F1/355 ,  C30B29/22

CPC分类号： H01S5/0092 ,  C03B33/02 ,  C30B1/02 ,  C30B29/10 ,  C30B29/14 ,  C30B29/22 ,  C30B29/30 ,  C30B33/02 ,  G01N21/88 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N2201/06113 ,  G01N2201/0637 ,  G01N2201/068 ,  G02F1/353 ,  G02F1/3551 ,  G02F1/3553 ,  G02F1/37 ,  G02F2001/3505 ,  G02F2001/3507 ,  G02F2001/354 ,  G02F2202/20 ,  H01S3/0092 ,  H01S3/10 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/11

摘要： A frequency-conversion crystal annealing process includes a first ramp-up period (e.g., increasing the crystal's temperature to a first set point in the range of 100° C. to 150° C. over about 2 hours), a first fixed temperature period (e.g., maintaining at the first set point for 10 to 20 hours), a second ramp-up period (e.g., increasing from the first set point to a second set point above 150° C. over about 1 hour or more), a second fixed period (e.g., maintaining at the second set point for 48 to 300 hours), and then a temperature ramp-down period (e.g., decreasing from the second set point to room temperature over about 3 hours). Transitions from the first and second fixed temperature periods are optionally determined by —OH bonds absorption levels that are measured using Fourier transform infrared spectroscopy, e.g., by monitoring the absorption of —OH bonds (including H2O) near 3580 cm−1 in the infra-red spectrum.

摘要翻译： 频率转换晶体退火处理包括第一斜坡上升​​周期（例如，在约2小时内将晶体的温度提高到在100℃至150℃的范围内的第一设定点），第一固定温度周期 （例如，在第一设定点保持10至20小时），第二加速时间段（例如，在大约1小时或更长时间内从第一设定点增加到高于150℃的第二设定点），a 第二固定时间（例如，在第二设定点保持48至300小时），然后温度降低时间（例如，从大约3小时的第二设定点降低到室温）。 从第一和第二固定温度周期的转变可任选地由使用傅立叶变换红外光谱法测量的-OH键吸收水平确定，例如通过监测基底内的3580cm-1附近的-OH键（包括H 2 O）的吸收， 红色光谱。

公开(公告)号：US09097683B2

公开(公告)日：2015-08-04

申请号：US14507758

申请日：2014-10-06

申请人： KLA-Tencor Corporation

发明人： Vladimir Dribinski ,  Yung-Ho Alex Chuang ,  J. Joseph Armstrong ,  John Fielden

IPC分类号： H01S3/13 ,  G01N21/88 ,  H01S3/11 ,  H01S3/10 ,  H01S5/00 ,  G02F1/37 ,  H01S3/00 ,  C30B29/10 ,  C03B33/02 ,  G01N21/94 ,  G01N21/95 ,  G02F1/35 ,  G02F1/355

CPC分类号： H01S5/0092 ,  C03B33/02 ,  C30B1/02 ,  C30B29/10 ,  C30B29/14 ,  C30B29/22 ,  C30B29/30 ,  C30B33/02 ,  G01N21/88 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N2201/06113 ,  G01N2201/0637 ,  G01N2201/068 ,  G02F1/353 ,  G02F1/3551 ,  G02F1/3553 ,  G02F1/37 ,  G02F2001/3505 ,  G02F2001/3507 ,  G02F2001/354 ,  G02F2202/20 ,  H01S3/0092 ,  H01S3/10 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/11

摘要： An optical system for detecting contaminants and defects on a test surface includes an improved laser system for generating a laser beam and optics directing the laser beam along a path onto the test surface, and producing an illuminated spot thereon. A detector and ellipsoidal mirrored surface are also provided with an axis of symmetry about a line perpendicular to the test surface. In one embodiment, an optical system for detecting anomalies of a sample includes the improved laser system for generating first and second beams, first optics for directing the first beam of radiation onto a first spot on the sample, second optics for directing the second beam onto a second spot on the sample, with the first and second paths at different angles of incidence to the sample surface. In another embodiment, a surface inspection apparatus includes an illumination system configured to focus beams at non-normal incidence angles.

摘要翻译： 用于检测测试表面上的污染物和缺陷的光学系统包括用于产生激光束的改进的激光系统和将激光束沿着路径引导到测试表面上并在其上产生照明点的光学系统。 检测器和椭圆形镜面也具有围绕垂直于测试表面的线的对称轴。 在一个实施例中，用于检测样本异常的光学系统包括用于产生第一和第二光束的改进的激光系统，用于将第一辐射束引导到样品上的第一光点上的第一光学器件，用于将第二光束引导到 样品上的第二个点，第一和第二个路径与样品表面的入射角不同。 在另一个实施例中，表面检查装置包括被配置为以非正常入射角聚焦光束的照明系统。

公开(公告)号：US08873596B2

公开(公告)日：2014-10-28

申请号：US13412564

申请日：2012-03-05

申请人： Vladimir Dribinski ,  Yung-Ho Alex Chuang ,  J. Joseph Armstrong ,  John Fielden

发明人： Vladimir Dribinski ,  Yung-Ho Alex Chuang ,  J. Joseph Armstrong ,  John Fielden

IPC分类号： H01S3/098 ,  G01N21/94 ,  C30B29/10 ,  G02F1/37 ,  C30B33/02 ,  G01N21/95 ,  H01S3/00 ,  G01N21/88 ,  G02F1/35 ,  G02F1/355

CPC分类号： H01S5/0092 ,  C03B33/02 ,  C30B1/02 ,  C30B29/10 ,  C30B29/14 ,  C30B29/22 ,  C30B29/30 ,  C30B33/02 ,  G01N21/88 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N2201/06113 ,  G01N2201/0637 ,  G01N2201/068 ,  G02F1/353 ,  G02F1/3551 ,  G02F1/3553 ,  G02F1/37 ,  G02F2001/3505 ,  G02F2001/3507 ,  G02F2001/354 ,  G02F2202/20 ,  H01S3/0092 ,  H01S3/10 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/11

摘要： A mode-locked laser system operable at low temperature can include an annealed, frequency-conversion crystal and a housing to maintain an annealed condition of the crystal during standard operation at the low temperature. In one embodiment, the crystal can have an increased length. First beam shaping optics can be configured to focus a beam from a light source to an elliptical cross section at a beam waist located in or proximate to the crystal. A harmonic separation block can divide an output from the crystal into beams of different frequencies separated in space. In one embodiment, the mode-locked laser system can further include second beam shaping optics configured to convert an elliptical cross section of the desired frequency beam into a beam with a desired aspect ratio, such as a circular cross section.

摘要翻译： 可在低温下操作的模式锁定激光系统可以包括退火的频率转换晶体和壳体，以在低温下的标准操作期间保持晶体的退火状态。 在一个实施例中，晶体可以具有增加的长度。 第一光束整形光学元件可以被配置成将来自光源的光束聚焦到位于或接近晶体的光束腰部处的椭圆形横截面。 谐波分离块可以将来自晶体的输出分成在空间中分离的不同频率的波束。 在一个实施例中，锁模激光系统还可以包括第二光束整形光学器件，其被配置为将期望的频率波束的椭圆形横截面转换成具有期望的纵横比的光束，例如圆形横截面。

公开(公告)号：US08864005B2

公开(公告)日：2014-10-21

申请号：US13159756

申请日：2011-06-14

申请人： James William Brown

发明人： James William Brown

IPC分类号： B26F3/00 ,  B26D3/08 ,  C03B33/10 ,  C03B33/02 ,  C03B23/027 ,  C03B33/023

CPC分类号： C03B33/02 ,  B26D3/085 ,  C03B23/027 ,  C03B33/023 ,  C03B33/107 ,  Y10T83/0341 ,  Y10T225/12

摘要： A method of forming a scribe line in a strengthened glass substrate includes providing a strengthened glass substrate having a first surface, a second surface, a first edge and a second edge. The first and second surfaces have a strengthened surface layer under a compressive stress, and a central region under tensile stress. The method further includes applying a scoring blade to the first surface at an initiation location that is offset from the first edge by an initiation offset distance greater than a diameter of the scoring blade, and translating the scoring blade or the strengthened glass substrate such that the scoring blade scores the first surface. The translation is terminated such that the scoring blade stops at a termination location that is offset from the second edge of the strengthened glass substrate by a termination offset distance greater than the diameter of the scoring blade.

摘要翻译： 在强化玻璃基板中形成划线的方法包括提供具有第一表面，第二表面，第一边缘和第二边缘的强化玻璃基板。 第一表面和第二表面在压缩应力下具有增强的表面层，在拉伸应力下具有中心区域。 该方法还包括在起始位置处将刻划刀片施加到第一表面，该起始位置与第一边缘偏移大于刻痕刀片的直径的起始偏移距离，以及平移刻痕刀片或加强玻璃基板，使得 得分刀评分第一个表面。 平移终止，使得刻划刀片在距加强玻璃基板的第二边缘偏移大于刻划刀片的直径的终端偏移距离的终止位置处停止。

公开(公告)号：US08776549B2

公开(公告)日：2014-07-15

申请号：US12677188

申请日：2008-09-03

申请人： Edwin Lang

发明人： Edwin Lang

IPC分类号： C03B33/023 ,  C03B33/02 ,  C03B17/06 ,  B23D33/02

CPC分类号： C03B33/023 ,  B23D33/025 ,  B65G49/064 ,  C03B17/06 ,  C03B33/02 ,  C03B33/0235 ,  C03B33/03 ,  C03B33/033 ,  C03B35/167 ,  Y10T83/0333 ,  Y10T83/2092 ,  Y10T83/2198

摘要： The invention relates to a method and a device for severing a marked region of a glass strip (1) produced continuously on a conveyor belt (11), having the following characteristics: a) a line (12) highlighting the severing of the marked region is scored on the continuous glass strip (1), b) once the scored line (12) reaches the crusher roll (6), the two lock rolls (7, 8) following the crusher roll (6) are folded away downward, c) once the scored line (12) is located in the region of the highest area of the crusher roll (6), means for shearing off (5) push onto the glass strip (1) and break it off, d) after the broken-off glass piece (10) has dropped, the lock rolls (7, 8, 9) are folded back in the conveyor belt (11), and to a computer program and a machine-readable carrier with the program code thereof.

摘要翻译： 本发明涉及一种用于切断在输送带（11）上连续生产的玻璃带（1）的标记区域的方法和装置，具有以下特征：a）突出显示标记区域的切断线（12） 在连续玻璃条（1）上刻痕，b）一旦刻痕线（12）到达破碎机辊（6），随着​​破碎辊（6）跟随的两个锁辊（7,8）向下折叠，c 一旦刻痕线（12）位于破碎机辊（6）的最高区域的区域中，剪切装置（5）推到玻璃条（1）上并将其分解，d）破碎后 （10）已经下降，锁定辊（7,8,9）在传送带（11）中被折回，并且具有其程序代码的计算机程序和机器可读载体。

公开(公告)号：US20140170380A1

公开(公告)日：2014-06-19

申请号：US14239808

申请日：2012-08-17

申请人： Takashi Murata ,  Takako Tojyo

发明人： Takashi Murata ,  Takako Tojyo

IPC分类号： C03C3/11 ,  C03C3/097 ,  C03C21/00 ,  C03B33/02 ,  C03C15/00

CPC分类号： C03B33/02 ,  C03C3/087 ,  C03C3/097 ,  C03C3/11 ,  C03C15/00 ,  C03C21/002 ,  Y10T428/24355 ,  Y10T428/315

摘要： A tempered glass of the present invention is a tempered glass having a compression stress layer in a surface thereof, the tempered glass comprising, as a glass composition in terms of mol %, 45 to 75% of SiO2, 3 to 15% of Al2O3, 0 to 12% of Li2O, 0.3 to 20% of Na2O, 0 to 10% of K2O, and 1 to 15% of MgO+CaO, and having a molar ratio (Al2O3+Na2O+P2O5)/SiO2 of 0.1 to 1, a molar ratio (B2O3+Na2O)/SiO2 of 0.1 to 1, a molar ratio P2O5/SiO2 of 0 to 1, a molar ratio Al2O3/SiO2 of 0.01 to 1, and a molar ratio Na2O/Al2O3 of 0.1 to 5, characterized in that the surface or an end surface of the tempered glass is etched after tempering treatment.

摘要翻译： 本发明的钢化玻璃是在其表面具有压应力层的钢化玻璃，所述钢化玻璃以玻璃组合物的摩尔％为45〜75％，SiO 2为3〜15％，Al 2 O 3， 0〜12％的Li 2 O，0.3〜20％的Na 2 O，0〜10％的K 2 O和1〜15％的MgO + CaO，摩尔比（Al 2 O 3 + Na 2 O + P 2 O 5）/ SiO 2为0.1〜 摩尔比（B 2 O 3 + Na 2 O）/ SiO 2为0.1〜1，摩尔比P 2 O 5 / SiO 2为0〜1，Al 2 O 3 / SiO 2的摩尔比为0.01〜1，Na 2 O / Al 2 O 3的摩尔比为0.1〜5 因为钢化玻璃的表面或端面在回火处理后被蚀刻。