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公开(公告)号：US11703578B2
公开(公告)日：2023-07-18
申请号：US17663357
申请日：2022-05-13
Applicant: QUALCOMM Incorporated
Inventor： Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev
CPC classification number: G01S7/5205 , G06F3/0418 , G06V40/1306 , G06F3/044
Abstract: Techniques for operating an ultrasonic sensor array, the ultrasonic sensor array disposed under a platen, include making a determination whether or not to recalibrate the ultrasonic sensor array based on whether a first screen protector disposed above the platen has been removed or replaced by a second screen protector; and recalibrating the ultrasonic sensor array, when the determination is to recalibrate the ultrasonic sensor array. In some cases, the techniques include prompting a user to indicate whether or not the screen protector has been changed or removed, and recalibrating the ultrasonic sensor array only after confirmation from the user.
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公开(公告)号：US11346927B2
公开(公告)日：2022-05-31
申请号：US16414164
申请日：2019-05-16
Applicant: Qualcomm Incorporated
Inventor： Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev
Abstract: Techniques for operating an ultrasonic sensor array, the ultrasonic sensor array disposed under a platen, include: making a determination whether or not to recalibrate the ultrasonic sensor array based on whether a first screen protector disposed above the platen has been removed or replaced by a second screen protector; and recalibrating the ultrasonic sensor array, when the determination is to recalibrate the ultrasonic sensor array. In some cases, the techniques include prompting a user to indicate whether or not the screen protector has been changed or removed, and recalibrating the ultrasonic sensor array only after confirmation from the user.
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公开(公告)号：US20220004728A1
公开(公告)日：2022-01-06
申请号：US16946717
申请日：2020-07-01
Applicant: QUALCOMM Incorporated
Inventor： Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Nicholas Ian Buchan , Yipeng Lu , Kostadin Dimitrov Djordjev
Abstract: An ultrasonic sensor system may include an ultrasonic transceiver layer, a thin-film transistor (TFT) layer proximate a first side of the ultrasonic transceiver layer, a frequency-splitting layer proximate a second side of the ultrasonic transceiver layer and a high-impedance layer proximate the frequency-splitting layer. The frequency-splitting layer may reside between the ultrasonic transceiver layer and the high-impedance layer. The high-impedance layer may have a higher acoustic impedance than the frequency-splitting layer.
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公开(公告)号：US20210150239A1
公开(公告)日：2021-05-20
申请号：US16686063
申请日：2019-11-15
Applicant: QUALCOMM Incorporated
Inventor： Soon Joon Yoon , Changting Xu , Hrishikesh Panchawagh , Kostadin Dimitrov Djordjev
Abstract: Methods, systems, and devices for anti-spoofing detection are described. The methods, systems, and devices include scanning, by a sensor associated with a device, an object placed within a scanning distance of the sensor, identifying a test signal based on scanning the object, comparing the test signal to a reference signal, identifying a first match between the object and a biometric model based on the comparing, identifying, based on the scanning, a second match between a first biometric pattern associated with the object and a stored second biometric pattern, and enabling access to a secure resource associated with the device based on the first match and the second match.
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公开(公告)号：US20210117519A1
公开(公告)日：2021-04-22
申请号：US16655039
申请日：2019-10-16
Applicant: QUALCOMM Incorporated
Inventor： Soon Joon Yoon , Changting Xu , Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev
Abstract: A method may involve controlling an apparatus to transmit a first ultrasonic wave by sending first electrical signals to a plurality of separate electrode elements proximate an ultrasonic transceiver layer. The method may involve receiving first electrode layer signals, corresponding to reflections of the first ultrasonic wave, from the electrode layer. The method may involve determining, based on the first electrode layer signals, a location of a target object in contact with the apparatus. The location of the target object may correspond with a proximate electrode element. The method may involve controlling the ultrasonic transceiver layer to transmit a second ultrasonic wave by sending second electrical signals to the proximate electrode element and for receiving receiver pixel signals from at least a portion of the plurality of ultrasonic receiver pixels in an area corresponding with the proximate electrode element.
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Patent Agency Ranking
公开(公告)号：US20200234021A1
公开(公告)日：2020-07-23
申请号：US16252408
申请日：2019-01-18
Applicant: QUALCOMM Incorporated
Inventor： Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Jae Hyeong Seo
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号：US10274590B2
公开(公告)日：2019-04-30
申请号：US15782750
申请日：2017-10-12
Applicant: QUALCOMM Incorporated
Inventor： Nai-Kuei Kuo , Kostadin Dimitrov Djordjev , Ranjith Ranganathan , Nao Sugawara Chuei , Ashish Hinger , David William Burns
Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
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公开(公告)号：US10067229B2
公开(公告)日：2018-09-04
申请号：US14864555
申请日：2015-09-24
Applicant: QUALCOMM Incorporated
Inventor： Kostadin Dimitrov Djordjev , Christopher Mark William Daft , David William Burns , Ashish Hinger , Hrishikesh Vijaykumar Panchawagh
Abstract: Methods, systems and storage media are described, each of which may be used to generate an image of an object using ultrasonic plane waves. For example, the generated image may be of a target object positioned on a platen surface. The image may be derived from corrected output signals obtained from a plurality of selected sensor pixels. The corrected output signals may adjust for diffraction of reflected ultrasonic plane waves from a target object positioned on the platen surface. The target object may be a finger or a tip of a stylus.
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公开(公告)号：US20170364726A1
公开(公告)日：2017-12-21
申请号：US15430389
申请日：2017-02-10
Applicant: QUALCOMM Incorporated
Inventor： Nicholas Ian Buchan , Mario Francisco Velez , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh , Firas Sammoura , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev , David Williams Burns , Leonard Eugene Fennell , Jon Gregory Aday
IPC: G06K9/00 , H01L41/107 , H01L41/047 , G02F1/1333 , H01L27/32
CPC classification number: G06K9/0002 , G01N29/22 , G01N29/2437 , G02F1/13338 , H01L27/323 , H01L41/047 , H01L41/107
Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
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公开(公告)号：US09817108B2
公开(公告)日：2017-11-14
申请号：US14589783
申请日：2015-01-05
Applicant: QUALCOMM Incorporated
Inventor： Nai-Kuei Kuo , Kostadin Dimitrov Djordjev , Ranjith Ranganathan , Nao Sugawara Chuei
CPC classification number: G01S7/52017 , G01S15/02 , G06K9/0002
Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
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