公开(公告)号：US20090268663A1

公开(公告)日：2009-10-29

申请号：US11908307

申请日：2006-03-03

Applicant: Hidenori Aoki ,  Kengo Yagyu ,  Shinji Takeda ,  Atsushi Fujiwara ,  Yoichi Matsumoto

Inventor： Hidenori Aoki ,  Kengo Yagyu ,  Shinji Takeda ,  Atsushi Fujiwara ,  Yoichi Matsumoto

IPC: H04W84/18 ,  H04W88/02

CPC classification number: H04W48/08 ,  H04L41/00 ,  H04W28/18 ,  H04W40/24 ,  H04W84/18 ,  H04W88/02

Abstract: A wireless communication apparatus is provided. The wireless communication apparatus includes: detection means that detects that there is another wireless communication apparatus around the wireless communication apparatus; comparison means that compares a first reference value managed in the wireless communication apparatus with a second reference value managed in the another wireless communication apparatus; means that corrects the first reference value based on the comparison result; and means that announces the first reference value to the another wireless communication apparatus. Frequencies are set such that a frequency of the wireless communication apparatus becomes same as a frequency of still another wireless communication apparatus to which a radio wave of the wireless communication apparatus does not reach but a radio wave of the another wireless communication apparatus reaches.

Abstract translation: 提供一种无线通信装置。 无线通信装置包括：检测装置，用于检测在无线通信装置周围有另一无线通信装置; 比较装置将在无线通信装置中管理的第一参考值与在另一无线通信装置中管理的第二参考值进行比较; 意味着根据比较结果校正第一个参考值; 以及向另一无线通信装置通知第一参考值的装置。 频率被设置为使得无线通信装置的频率变得与无线通信装置的无线电波未到达的另一无线通信装置的频率相同，但是另一无线通信装置的无线电波达到的频率相同。

公开(公告)号：US20090201737A1

公开(公告)日：2009-08-13

申请号：US12368667

申请日：2009-02-10

Applicant: Shinji Takeda ,  Yoshiharu Hirata

Inventor： Shinji Takeda ,  Yoshiharu Hirata

IPC: G11C16/04 ,  G11C7/00 ,  G11C16/06

CPC classification number: G11C16/0483 ,  G11C16/10

Abstract: A semiconductor memory device comprises: a write circuit including a latch circuit configured by two inverters having a positive side power supply terminal supplied with a first voltage and a negative side power supply terminal supplied with a second voltage; and a write state machine controlling the first and second voltages. When writing data to a memory cell, the first voltage is changed to a second value that is lower than a first value. When writing data to a memory cell, the second voltage is changed to a third value that is lower than the second value. The write state machine lowers the second voltage to an intermediate value between the second value and the third value and, while maintaining this intermediate value, lowers the first voltage from the first value to the second value.

Abstract translation: 一种半导体存储器件，包括：写入电路，包括由具有提供有第一电压的正侧电源端子和被提供有第二电压的负侧电源端子的两个反相器构成的锁存电路; 以及控制第一和第二电压的写状态机。 当将数据写入存储单元时，将第一电压改变为低于第一值的第二值。 当将数据写入存储单元时，第二电压被改变为低于第二值的第三值。 写状态机将第二电压降低到第二值和第三值之间的中间值，并且在保持该中间值的同时，将第一电压从第一值降低到第二值。

公开(公告)号：US07519029B2

公开(公告)日：2009-04-14

申请号：US10328025

申请日：2002-12-26

Applicant: Shinji Takeda ,  Atsushi Fujiwara ,  Hitoshi Yoshino ,  Toru Otsu ,  Yasushi Yamao

Inventor： Shinji Takeda ,  Atsushi Fujiwara ,  Hitoshi Yoshino ,  Toru Otsu ,  Yasushi Yamao

IPC: H04B7/216 ,  H04B7/00

CPC classification number: H04W52/247 ,  H04W24/10 ,  H04W28/18 ,  H04W48/08 ,  H04W52/286 ,  H04W52/46 ,  H04W68/00 ,  H04W88/04 ,  H04W92/10

Abstract: The object is to control interference in a permissible range by applying the CDMA system to signal collision in the conventional CSMA and TDMA base multihop systems and to relax the hidden terminal problem and others to enhance the throughput of the entire system by grouping of channel groups in multihop transmission and by control of transmission based on an interference level from another station. A multihop relay station calculates a desired signal level, for example, from an interference level at its own station of a packet sent from a mobile station, and notifies the mobile station of the desired signal level; and the mobile station calculates a transmission power amount of a packet from the desired signal level, determines whether the packet is transmissible to the station as a source of the desired signal level, and transmits the packet to the source station determined as a packet-transmissible station.

Abstract translation: 目的是通过将CDMA系统应用于常规CSMA和TDMA基多跳系统中的信号冲突来控制在允许范围内的干扰，并且放松隐藏终端问题等，以通过将信道组分组来提高整个系统的吞吐量 基于来自另一台的干扰电平的多跳传输和传输控制。 多跳中继站例如从移动站发送的分组的本站的干扰级别计算期望的信号电平，并将移动台通知所需的信号电平; 并且移动台根据期望的信号电平计算分组的发送功率量，确定该分组是否作为期望的信号电平的来源发送到该电台，并将该分组发送到被确定为分组可传输的源站 站。

公开(公告)号：US07387914B2

公开(公告)日：2008-06-17

申请号：US11379921

申请日：2006-04-24

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L21/48 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US20050243757A1

公开(公告)日：2005-11-03

申请号：US11060443

申请日：2005-02-18

Applicant: Kengo Yagyu ,  Shinji Takeda ,  Hidenori Aoki

Inventor： Kengo Yagyu ,  Shinji Takeda ,  Hidenori Aoki

IPC: H04L12/725 ,  H04L12/751 ,  H04W28/00 ,  H04W40/34 ,  H04W60/04 ,  H04W74/08 ,  H04W84/12 ,  H04W88/08 ,  H04W92/00 ,  H04Q7/00

CPC classification number: H04L45/00 ,  H04L12/4625 ,  H04L45/48 ,  H04W40/02 ,  H04W88/08 ,  Y02D70/142 ,  Y02D70/22 ,  Y02D70/30

Abstract: In a wireless packet transmission system that includes multiple wireless basestations and one or more wireless terminals belonging to one of the wireless basestations, transmission trees extending from two or more wireless basestations as root stations are used. Each of the wireless basestations has a tree table configured to record the root stations in association with the ID information about the transmission trees. When receiving a packet, each of the wireless basestations determines the transmission tree to be used for the packet transmission, and transmits the packet to a next node along the determined transmission tree.

Abstract translation: 在包括多个无线基站的无线分组传输系统和属于无线基站之一的一个或多个无线终端的情况下，使用从两个或多个无线基站作为根站延伸的传输树。 无线基站中的每一个具有树表，其被配置为与关于传输树的ID信息相关联地记录根站。 当接收到分组时，无线基站中的每一个确定要用于分组传输的传输树，并且将分组发送到沿着确定的传输树的下一个节点。

公开(公告)号：US20050237973A1

公开(公告)日：2005-10-27

申请号：US11105429

申请日：2005-04-14

Applicant: Shinji Takeda ,  Kengo Yagyu ,  Atsushi Fujiwara

Inventor： Shinji Takeda ,  Kengo Yagyu ,  Atsushi Fujiwara

IPC: H04L12/28 ,  H04W4/24 ,  H04W28/14 ,  H04W40/00 ,  H04W74/08 ,  H04W84/12 ,  H04W88/08 ,  H04W92/00 ,  H04Q7/00 ,  H04Q7/24 ,  H04Q7/28

CPC classification number: H04W40/12 ,  H04L45/124 ,  H04L45/125 ,  H04L45/127 ,  H04W4/24 ,  H04W28/14

Abstract: A wireless communications apparatus used in a wireless communications network consisting of multiple wireless communications apparatuses mutually connected via wireless links includes (a) a buffer configured to temporarily store information received from an adjacent wireless communications apparatus or a user terminal located under the wireless communications apparatus; (b) a routing control information processing unit that estimates a node cost representing traffic at the wireless communications apparatus and a link cost representing a radio condition of the link to determine a transmission route based on cost information reflecting both the node cost and the link cost; and (c) a routing control unit that designates a next hop to which information accumulated in the buffer is to be transmitted according to the determined transmission route.

Abstract translation: 在由经由无线链路相互连接的多个无线通信装置构成的无线通信网络中使用的无线通信装置包括：（a）缓冲器，被配置为临时存储从相邻无线通信装置或位于无线通信装置下方的用户终端接收的信息; （b）路由控制信息处理单元，其估计表示无线通信装置的业务的节点成本，以及表示链路的无线状态的链路成本，以基于反映节点成本和链路成本的成本信息来确定传输路由 ; 以及（c）路由控制单元，其根据所确定的传输路由指定要发送在缓冲器中的信息的下一跳。

公开(公告)号：US06641792B2

公开(公告)日：2003-11-04

申请号：US10270452

申请日：2002-10-15

Applicant: Shinji Takeda ,  Noriyuki Taguchi ,  Kazumi Kokaji ,  Osamu Hirai

Inventor： Shinji Takeda ,  Noriyuki Taguchi ,  Kazumi Kokaji ,  Osamu Hirai

IPC: D01F912

CPC classification number: B82Y30/00 ,  D01D5/24 ,  D01F9/12 ,  Y10S977/776 ,  Y10S977/788 ,  Y10S977/842 ,  Y10S977/846 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/2913 ,  Y10T428/2918 ,  Y10T428/30

Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.

公开(公告)号：US5667899A

公开(公告)日：1997-09-16

申请号：US482516

申请日：1995-06-07

Applicant: Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

Inventor： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

IPC: C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  B32B27/18 ,  C09J7/00

CPC classification number: C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  C08J2379/08 ,  Y10S428/901 ,  Y10S525/928 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Abstract translation: 用于将IC或LSI与引线框架接合的导电接合膜。 该膜包含（A）通过使四羧酸二酐组分反应得到的聚酰亚胺树脂，其中由下式（I）表示的四羧酸二酐的含量：其中n表示2-20的整数 至少70摩尔％，与二胺; 和（B）导电填料。 任选地，该膜还可以包含每分子具有至少两个热交联的酰亚胺基的热固性树脂或酰亚胺化合物。

公开(公告)号：US4094725A

公开(公告)日：1978-06-13

申请号：US761906

申请日：1977-01-24

Applicant: Shinji Takeda ,  Noriyoshi Mitsui ,  Nobuharu Kato

Inventor： Shinji Takeda ,  Noriyoshi Mitsui ,  Nobuharu Kato

IPC: B29C53/00 ,  B29C65/00 ,  B29C65/10 ,  B29C65/20 ,  B29C65/78 ,  B32B31/00

CPC classification number: B29C66/54 ,  B29C65/103 ,  B29C65/20 ,  B29C66/73921 ,  B29C66/83221 ,  B29C66/9121 ,  B29C66/9141 ,  B29C66/91443 ,  B29C66/91643 ,  B29C66/919 ,  B29C66/91951 ,  B29C65/7847 ,  B29C66/71 ,  B29C66/9241 ,  B29C66/92655 ,  B29C66/94 ,  B29C66/9592 ,  B29C66/961

Abstract: A process for welding a pair of thermoplastic workpieces by hot gas ejecting, which includes the steps of (a) positioning a pair of works to be welded in opposed relation with each other, (b) positioning heat blast nozzles between the works, (c) ejecting heat blast from the nozzles to the opposed surfaces of the works, (d) retracting the nozzles from the position between the works (e) advancing one of the works to be in pressure contact with the other, and (f) pressurizing the two works for firmly combining the two.

Abstract translation: 一种通过热气体喷射焊接一对热塑性工件的方法，包括以下步骤：（a）将一对待焊接的工件彼此相对定位，（b）在工件之间定位热风喷嘴，（c 将喷嘴从喷嘴喷射到工件的相对表面，（d）从工件（e）之间的位置缩回喷嘴（e），使工件中的一个与另一个进行压力接触，以及（f） 两件作品牢牢结合两者。

公开(公告)号：US4094056A

公开(公告)日：1978-06-13

申请号：US773757

申请日：1977-03-02

Applicant: Shinji Takeda ,  Shoji Kobayashi ,  Yutaka Watanabe

Inventor： Shinji Takeda ,  Shoji Kobayashi ,  Yutaka Watanabe

IPC: B60R13/04 ,  B29B7/00 ,  B29C47/00 ,  B29C47/02 ,  B29C47/06 ,  B29C53/04 ,  B29C53/06 ,  B21D5/06 ,  B29F3/00

CPC classification number: B29C53/066 ,  B29C53/04 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/003 ,  B29C47/0038 ,  B29C47/0059 ,  B29C47/025 ,  B29C47/026 ,  B29C47/043 ,  B29C47/065 ,  Y10S29/033 ,  Y10T29/49982

Abstract: A process for forming a decorative trim strip by extruding a thermoplastic material around a continuous length of metal strip. The thermoplastic material is shaped with longitudinal grooves and when the strip is bent along the groove, the thermoplastic material on opposite sides of the grooves comes into contact. The strip is heated and the thermoplastic material in contact fuses to essentially eliminate the grooves.

Abstract translation: 通过在连续长度的金属条上挤出热塑性材料来形成装饰性饰条的方法。 热塑性材料成型为纵向凹槽，并且当条带沿着凹槽弯曲时，沟槽相对侧上的热塑性材料接触。 条带被加热并且接触的热塑性材料熔化以基本上消除凹槽。