LIQUID-COOLING APPARATUS WITH INTEGRATED COOLANT FILTER

    公开(公告)号:US20150359139A1

    公开(公告)日:2015-12-10

    申请号:US14826433

    申请日:2015-08-14

    IPC分类号: H05K7/20

    摘要: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

    FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS AND SEPARABLE HEAT SINKS
    34.
    发明申请
    FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS AND SEPARABLE HEAT SINKS 有权
    冷却电子元件和可分离式散热器的现场可更换容器

    公开(公告)号:US20150109729A1

    公开(公告)日:2015-04-23

    申请号:US14058592

    申请日:2013-10-21

    IPC分类号: H05K7/20

    摘要: Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.

    摘要翻译: 提供冷却的电子系统和冷却方法,其中现场可替换的电子部件组由包括至少部分围绕电子部件周围并形成隔室的外壳的设备冷却,设置在隔间内的流体和热量 水槽与电子系统相关联。 现场可更换组件部分地延伸穿过外壳,以便于将电子部件的操作对接到例如电子系统的一个或多个相应的接收插座。 现场可更换组的电子部件至少部分地浸没在流体内以便于部件的浸入冷却,并且散热器被配置和设置成物理耦合到外壳并有利于排除来自流体的热量 当现场可更换的电子组件组可操作地插入到电子系统中时,设置在隔间内。

    VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S)
    35.
    发明申请
    VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) 有权
    阀门控制,双相加热器的水位蒸汽冷凝(S)

    公开(公告)号:US20150062804A1

    公开(公告)日:2015-03-05

    申请号:US14519401

    申请日:2014-10-21

    IPC分类号: H05K7/20

    摘要: Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.

    摘要翻译: 提供了用于冷却电子部件的装置,电子部件包括耦合到电子部件的散热器,并且具有用于第一冷却剂的冷却剂传送通道。 第一冷却剂向电子部件提供两相冷却,并且作为包括冷却剂蒸气的冷却剂排出物从散热器排出。 该装置还包括联接到散热器以接收冷却剂排气的节点级冷凝模块。 冷凝模块通过第二冷却剂冷却,并且有助于冷凝冷却剂排出物中的冷却剂蒸气。 控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。 控制阀调节节点级冷凝模块的第二冷却剂的流量,基于冷却剂排气中的冷却剂蒸气的表征,阀被控制器自动控制。

    EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS
    36.
    发明申请
    EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS 有权
    冷却系统组件的有效加权控制

    公开(公告)号:US20140163767A1

    公开(公告)日:2014-06-12

    申请号:US13783618

    申请日:2013-03-04

    IPC分类号: G05D23/19

    摘要: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

    摘要翻译: 部分地基于组件的加权冷却效率来提供电子系统的冷却系统冷却的能量效率控制。 该控制包括自动确定冷却系统的多个可调冷却部件的速度控制设置。 所述自动确定至少部分地基于所述冷却系统的组件的加权冷却效果,并且所述确定操作以限制至少所述冷却系统的功率消耗,同时确保与至少一个 冷却系统或电子系统在所需的范围内,通过基于加权的冷却效果,提供冷却系统的多个可调冷却部件之间的期望的目标温度变化。 供应包括至少部分地通过所确定的控制设置向多个可调冷却部件供应应用的功率。

    COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES
    37.
    发明申请
    COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES 有权
    具有自动控制冷却液流量的冷却液调节装置

    公开(公告)号:US20140124189A1

    公开(公告)日:2014-05-08

    申请号:US13671913

    申请日:2012-11-08

    IPC分类号: F28F27/02

    摘要: A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.

    摘要翻译: 提供了一种冷却剂调节单元,其包括设备冷却剂路径,具有设备冷却剂流量控制阀,以及容纳系统冷却剂的系统冷却剂通道,并具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径,以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂,并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置,并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的,部分打开的最小调节位置。

    GROUND-BASED HEAT SINK FACILITATING ELECTRONIC SYSTEM COOLING
    38.
    发明申请
    GROUND-BASED HEAT SINK FACILITATING ELECTRONIC SYSTEM COOLING 有权
    基于地基的散热器加热电子系统冷却

    公开(公告)号:US20140124164A1

    公开(公告)日:2014-05-08

    申请号:US13780538

    申请日:2013-02-28

    IPC分类号: H05K7/20

    摘要: Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.

    摘要翻译: 提供了冷却方法,其包括提供散热器,该散热器具有带有隔室的壳体,冷却剂入口和冷却剂出口。 壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口,其中冷却剂传送从一个或多个电子部件提取的热量。 散热器还包括一个或多个热管,其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。 热管被配置为从流过隔室的冷却剂中提取热量,并且将提取的热量传送到设置在壳体外部的第二部分。 壳体外部的第二部分设置成便于将提取的热量导入地面。

    CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT
    40.
    发明申请
    CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT 有权
    冷凝器冷凝器冷凝器冷凝器的冷凝器结构

    公开(公告)号:US20130180687A1

    公开(公告)日:2013-07-18

    申请号:US13785236

    申请日:2013-03-05

    IPC分类号: F28D15/02

    摘要: Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation.

    摘要翻译: 本文提供蒸气冷凝器和冷却装置,其有助于在冷却电子设备或电子子系统时所用的冷却剂的蒸气冷凝冷却。 蒸汽冷凝器包括导热基体结构,当冷凝器促进蒸汽冷凝物形成时,具有工作方向,以及从导热基体结构延伸的多个导热冷凝器翅片。 多个导热冷凝器翅片沿其长度的至少一部分具有变化的横截面周长。 多个导热冷凝器翅片的横截面周长被配置成当导热基底结构处于工作方位时,在冷凝物行进的方向上增大,并且蒸汽冷凝器有利于蒸气冷凝物的形成。