Abstract:
The present invention provides compounds having a cyclopentabenzofuran core and the use of such compounds in therapy as well as compositions comprising said compounds.
Abstract:
The present invention discloses an integrated analysis device for simultaneously detecting exhaled breath condensates (EBCs) and volatile organic compounds (VOCs) in human exhaled breath. The device comprises a module for sampling, separating and enriching a detected object, an EBCs detection module and a combined VOCs detection module. The module for sampling, separating and enriching a detected object is connected with the EBCs detection module via a syringe pump for sample injection. The module for sampling, separating and enriching a detected object is connected with the combined VOCs detection module by a capillary separation column. In the present invention, it is achieved that EBCs and VOCs in human exhaled breath are simultaneously sampled, separated and condensed; the heavy metal ions, cell factors, etc. in the collected EBCs are detected with a light addressable potentiometric sensor (LAPS); the condensed VOCs can be quantitatively detected by the combined VOCs detection module with a high sensitivity; and a heating rod and a platinum resistor can be conveniently replaced because a separated outlet heating piece is designed in the combined VOCs detection module.
Abstract:
A method and system for inventorying wireless transponders, specifically referred to as RFID transceiver devices. To provide higher functionality, a microcontroller is used in the RFID, along with a battery, but the clock frequency of the microcontroller is adjusted, based on external input, to minimize battery requirements. The RFID transceiver device includes at least one sensor coupled to the microcontroller. Data from the at least one sensor is stored in non-volatile memory of the microcontroller if the battery is at a predetermined low level, and is read later when the battery is at a higher level.
Abstract:
Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.Alternatively, the method of joining the electronic package parts according to the present invention comprises the steps of: forming a plating layer made of alloy elements on top of each of the electronic parts having a surface treated with copper or nickel and reflowing lead-free solders; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to allow the alloy elements contained in the plating layer to be diffused into the lead-free solders and generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.The present invention can prevent brittle fracture of the electronic package parts by deriving alteration of the intermetallic compounds generated from existing lead-free solders when the electronic package parts of electronic devices are solder joined together, thereby ensuring reliability of the electronic devices.
Abstract:
The present invention discloses a modification of portable computer. The bottom of the lower seat of a notebook computer is provided with supporting pieces which can retrieve within and protrude over the bottom and which can render the aforementioned bottom to maintain a slanting angle and a gap with respect to the residing surface.
Abstract:
An optical recording/playback apparatus and a method for adjusting playback parameters of the optical recording/playback apparatus are disclosed. The method includes loading an optical disc, determining whether there is data recorded on a data zone of the optical disc, recording test data on an optimal power control (OPC) zone on a playback parameter adjustment area of the optical disc at a reference power when there is no data recorded in the data zone, and adjusting a playback parameter while reading the playback parameter adjustment area, and recording data in the data zone after the adjustment.
Abstract:
An apparatus for controlling an erasing power level, which is capable of optimally setting a power level applied to a disc when erasing a test period in an OPC (Optimum Power Control) area of the disc, and a method using the apparatus. The apparatus includes: a pickup unit irradiating light corresponding to the erasing power level to a test period and receiving reflected light; an RF processing unit outputting an indication signal indicating a writing state of the test period according to an output of the pickup unit; and a control unit temporarily setting a plurality of erasing power levels, erasing the test period by applying the plurality of erasing power levels, and then setting any one of the plurality of erasing power levels to an optimum erasing power level on the basis of the indication signal.
Abstract:
An optical disc apparatus is provided with optimum power control (OPC) to determine an optimum laser power needed for recording data on an optical disc. Such an apparatus comprises a controller to determine optimum writing power in such a way of re-establishing a new test zone when an erasing error is detected on an initially established test zone in order to perform the OPC. When the erasing error is detected on a test zone of an OPC zone, a new test zone is re-established, so that OPC is performed rapidly while reducing an error frequency occurring when optimum writing power is not determined.
Abstract:
Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation is executed between a chip and a PCB, between chips, or between PCBs. On a side having a larger solder pad, a general solder ball is used. Conversely, on a side having a smaller solder pad, a solder ball having a core is used. The core serves to maintain a predetermined interval between the chip and the PCB or between the chips, after the bonding operation has been completed. The solder bonded parts are aligned with each other so as to perform a final bonding operation. In a conventional flip-chip package, solder pads provided on a bonded part must have the same or similar size. According to this invention, even if the size difference between the solder pads is large, bonding is possible, thus ensuring electrical and mechanical reliability.
Abstract:
A method and system for providing virtual access to product/service information distributed across heterogeneous catalog systems is disclosed. The method and system include subscribing a first catalog server to at least a portion of the information stored on one or more remote catalog systems, thereby creating a subscribing catalog server. Thereafter, a replication process is performed to synchronize information on the subscribing catalog server with the subscribed information on the remote catalog systems. A user may then use the subscribing catalog server to search and browse the synchronized information, thereby providing one site for viewing information from multiple catalog servers.