公开(公告)号：US09287348B1

公开(公告)日：2016-03-15

申请号：US14686576

申请日：2015-04-14

Applicant: Honeywell International Inc.

Inventor： Daniel Youngner

IPC: H01L23/04 ,  H01L49/02 ,  H01L23/48

CPC classification number: H01L28/40 ,  H01L21/02164 ,  H01L21/2885 ,  H01L21/32055 ,  H01L21/76831 ,  H01L21/7684 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/642 ,  H01L24/03 ,  H01L24/08 ,  H01L29/945 ,  H01L2224/03462 ,  H01L2224/05144 ,  H01L2224/08225 ,  H01L2924/0002 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/00

Abstract: Devices, methods, and systems for ion trapping are described herein. One device includes a through-silicon via (TSV) and a trench capacitor formed around the TSV.

Abstract translation: 本文描述了用于离子捕获的装置，方法和系统。 一个器件包括贯穿硅通孔（TSV）和围绕TSV形成的沟槽电容器。

公开(公告)号：US20150125008A1

公开(公告)日：2015-05-07

申请号：US14073638

申请日：2013-11-06

Applicant: Honeywell International Inc.

Inventor： Lisa Lust ,  Daniel Youngner

IPC: H04R19/01

CPC classification number: H04R19/016 ,  H04R19/005 ,  H04R31/00

Abstract: Generally disclosed herein are transducers that can convert sound energy into electrical signals, such as to detect if a pressure wave includes a specific frequency. Methods of using the transducers and systems that include the transducers are disclosed herein as well. A transducer can include a first probe plate, a second probe plate, a ground plate situated between the first and second probe plates, a first electret film adjacent to a first side of the ground plate and situated between the first and second probe plates, and a second electret film adjacent to a second side of the ground plate and situated between the first and second probe plates, the second side opposite the first side.

Abstract translation: 本文通常公开的是可以将声能转换成电信号的换能器，例如检测压力波是否包括特定频率。 本文还公开了使用包括换能器的换能器和系统的方法。 换能器可以包括第一探针板，第二探针板，位于第一和第二探针板之间的接地板，与接地板的第一侧相邻且位于第一和第二探针板之间的第一驻极体膜，以及 邻近接地板的第二侧并位于第一和第二探针板之间的第二驻极体膜，第二侧与第一侧相对。

公开(公告)号：US20150053465A1

公开(公告)日：2015-02-26

申请号：US14517672

申请日：2014-10-17

Applicant: Honeywell International Inc.

Inventor： Daniel Youngner ,  Son Thai Lu ,  Helen Chanhvongsak ,  Lisa Lust ,  Douglas Carlson

IPC: H05K3/46 ,  H05K3/30 ,  H05K3/06 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/061 ,  H05K3/24 ,  H05K3/30 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/0104 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/0165 ,  H05K2203/0271

Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.