公开(公告)号：US12126117B2

公开(公告)日：2024-10-22

申请号：US17659987

申请日：2022-04-20

Applicant: Cisco Technology, Inc.

Inventor： Garima Mishra ,  Rohit Dev Gupta ,  Shilpa Agrawal ,  Manjunatha Reddy Shivashankara ,  Ramesh Babu Darla

IPC: H01R13/64 ,  H01R13/66 ,  H01R13/717

CPC classification number: H01R13/64 ,  H01R13/6683 ,  H01R13/7175

Abstract: Embodiments herein describe preventing a pluggable module from connecting to a chassis until ensuring there is no damage on the pluggable module, the chassis, or both. In one embodiment, the chassis includes a blocking element that prevents or blocks the pluggable module from mating with the chassis. The chassis can also include a camera for capturing an image of the pluggable module to determine whether there is damage to its connection elements (e.g., pins). If not, the chassis can release the locking pin to permit the pluggable module to mate with connection elements on the chassis.

公开(公告)号：US20240334589A1

公开(公告)日：2024-10-03

申请号：US18742367

申请日：2024-06-13

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/066 ,  H05K2201/10734

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

公开(公告)号：US12010809B2

公开(公告)日：2024-06-11

申请号：US17171634

申请日：2021-02-09

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Shailesh R. Nayak ,  Viktor Brauer ,  Joel Richard Goergen

IPC: H05K7/14 ,  F16L3/01

CPC classification number: H05K7/1447 ,  F16L3/01

Abstract: In one embodiment, an apparatus includes a module receivable in a modular electronic system, arms extending from a front panel of the module, and a cable support bracket connected to the arms. The cable support bracket is slidably connected to the arms to change a distance between the cable support bracket and the front panel of the module.

公开(公告)号：US11812585B2

公开(公告)日：2023-11-07

申请号：US17445470

申请日：2021-08-19

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Manigandan Boopalan ,  Arjun G. Jayaprakash ,  Parag Ghate

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20145 ,  H05K7/20836

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

公开(公告)号：US20230156971A1

公开(公告)日：2023-05-18

申请号：US18156688

申请日：2023-01-19

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Robert Gregory Twiss

IPC: H05K7/20

CPC classification number: H05K7/20709 ,  H05K7/2039

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

公开(公告)号：US11644500B2

公开(公告)日：2023-05-09

申请号：US17480773

申请日：2021-09-21

Applicant: Cisco Technology, Inc.

Inventor： Mohammed Ghouse ,  Shailesh Nayak ,  Damaruganath Pinjala ,  Rohit Dev Gupta ,  Mehmet Onder Cap

IPC: G01R31/28 ,  H05K1/02 ,  H05K1/18

CPC classification number: G01R31/2808 ,  G01R31/2817 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/064

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

公开(公告)号：US20220141990A1

公开(公告)日：2022-05-05

申请号：US17329043

申请日：2021-05-24

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Narasimha Reddy Emmareddy ,  Manjunatha Reddy Shivashankara ,  Suresh Kumar Vadivazhagan ,  Giovanni Giobbio

IPC: H05K7/20 ,  H01R13/516

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

公开(公告)号：US11300363B2

公开(公告)日：2022-04-12

申请号：US16922015

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Tilak Gaitonde ,  Prashanth Pavithran

IPC: F28D19/04 ,  F28F3/02 ,  F28F5/02 ,  F28D21/00

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

公开(公告)号：US20210410312A1

公开(公告)日：2021-12-30

申请号：US17470465

申请日：2021-09-09

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Joel Richard Goergen ,  Sarma VMK Vedhanabhatla ,  Damaruganath Pinjala ,  Jatin Kohli ,  Robert Gregory Twiss

IPC: H05K7/14 ,  H05K7/20 ,  H05K7/02

Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

公开(公告)号：US11172587B2

公开(公告)日：2021-11-09

申请号：US16819399

申请日：2020-03-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rohit Dev Gupta ,  Joel Richard Goergen ,  Sarma V M K Vedhanabhatla ,  Damaruganath Pinjala ,  Jatin Kohli ,  Robert Gregory Twiss

IPC: H05K7/14 ,  H05K7/02 ,  H05K7/20 ,  H05K7/18

Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.